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Hybrid 6-Layer PCB with I-Tera MT40 and RO4450F PP is suitable for RF/microwave printed circuit designs

Hybrid 6-Layer PCB with I-Tera MT40 and RO4450F PP is suitable for RF/microwave printed circuit designs

MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Model Number
I-Tera MT40 and RO4450F PP
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

6-Layer PCB with I-Tera MT40 and RO4450F PP

 

 

The 6-layer PCB is designed with advanced materials and features for high-speed digital and RF applications, integrating I-Tera MT40 and RO4450F PP. With precise impedance control, blind vias, and metal edge plating, this board is tailored for demanding environments requiring high-performance signal integrity and robust mechanical properties.

 

 

PCB Specifications & Requirements

Category Specification
Layer Count 6 Layers
Board Size 99 mm x 99 mm
Total Thickness 1.501 mm
Core I-Tera MT40
Prepreg (PP) RO4450F
Inner Layers 1 oz
Outer Layers 2 oz
Surface Finish Immersion Gold (ENIG), 2µm
Solder Mask Green
Silkscreen White Lettering
Impedance Control Top Layer, 5 mil trace, 50 Ohm (Single-ended)
Via Type Blind Vias
Via Filling 0.3mm vias, Resin Plugged + Electroplated Caps
Edge Plating Required (Metal Edge Plating)

 

 

 

Introduction

I-Tera MT40 is a high-performance laminate material designed for high-speed digital and RF/microwave applications. Its excellent thermal and electrical properties make it an ideal choice for advanced PCB designs.

 

 

Data Sheet

I-Tera® MT40
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 215 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 230 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 210 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) A. T260 >60 Minutes 2.4.24.1
B. T288
Z-Axis CTE A. Pre-Tg 55 ppm/°C 2.4.24C
B. Post-Tg 290 ppm/°C
C. 50 to 260°C, (Total Expansion) 2.8 %
X/Y-Axis CTE Pre-Tg 12 ppm/°C 2.4.24C
Thermal Conductivity 0.61 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched Pass Pass Visual 2.4.13.1
B. Etched
Dk, Permittivity A. @ 2 GHz 3.45 2.5.5.5
B. @ 5 GHz
C. @ 10 GHz
Df, Loss Tangent A. @ 2 GHz 0.0031 Bereskin Stripline
B. @ 5 GHz
C. @ 10 GHz
Volume Resistivity C-96/35/90 1.33 x 10^7 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 10^5 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 Class (Volts) UL 746A
ASTM D3638
Peel Strength 1 oz. EDC foil 1.0 (5.7) N/mm (lb/inch) 2.4.8C
Flexural Strength A. Length direction 490 (71.0) MPa (kpsi) 2.4.4B
B. Cross direction 400 (58.0)
Tensile Strength A. Length direction 269 (39.0) MPa (kpsi) ASTM D3039
B. Cross direction 241 (35.0)
Young's Modulus A. Length direction 3060 ksi ASTM D790-15e2
B. Cross direction 2784
Poisson's Ratio A. Length direction 0.234 ASTM D3039
B. Cross direction 0.222
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796

 

 

 

What is Single-End Impedance Control?

Single-ended impedance control refers to the precise regulation of a signal trace's impedance on a PCB. In high-frequency designs, maintaining consistent impedance is critical to ensure signal integrity and minimize reflections or losses.

 

How It Works:

Impedance is determined by the trace width, trace thickness, dielectric constant (Dk) of the material, and the distance between the trace and the reference plane.

For this PCB, the top layer features 5mil traces designed for a 50-ohm impedance, optimized for high-speed and RF signals.

 

 

Why It’s Important:

Ensures minimal signal distortion in high-speed digital and RF circuits.

Prevents impedance mismatches that can cause reflections, signal degradation, or electromagnetic interference (EMI).

 

 

Why Is Metal Edge Plating Necessary?

Metal edge plating involves plating the edges of the PCB with a conductive layer, typically for electrical, mechanical, or shielding purposes.

 

 

Benefits of Metal Edge Plating:

  • Provides electromagnetic shielding to reduce interference from external noise.
  • Enhances overall signal integrity in RF and high-speed applications.
  • Adds mechanical reinforcement to the PCB edges, increasing durability.
  • Ensures reliable electrical continuity between different layers or between the top and bottom of the PCB.
  • Useful in grounding applications, especially for multilayer designs.

 

 

Applications:

PCBs for RF, microwave, and antenna designs.

Boards requiring improved EMI protection in compact designs.

PCBs with strict durability requirements, such as aerospace and industrial electronics.

 

 

Summary

The 6-layer PCB with I-Tera MT40 and RO4450F PP materials is a high-performance solution for high-speed digital and RF applications. Key features such as 50-ohm impedance control, blind vias, and metal edge plating enhance the board's electrical performance and mechanical reliability.

Feature Purpose
I-Tera MT40 + RO4450F PP High-frequency performance and thermal stability
Impedance Control Ensures signal integrity for high-speed circuits
Blind Vias Reliable layer-to-layer connections
Metal Edge Plating Provides EMI shielding and mechanical strength

 

 

This PCB is ideal for applications in telecommunications, aerospace, RF/microwave systems, and industrial electronics, where high performance and durability are critical.

 

Products
PRODUCTS DETAILS
Hybrid 6-Layer PCB with I-Tera MT40 and RO4450F PP is suitable for RF/microwave printed circuit designs
MOQ: 1PCS
Price: 0.99-99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000pcs
Detail Information
Place of Origin
China
Model Number
I-Tera MT40 and RO4450F PP
Minimum Order Quantity:
1PCS
Price:
0.99-99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000pcs
Product Description

6-Layer PCB with I-Tera MT40 and RO4450F PP

 

 

The 6-layer PCB is designed with advanced materials and features for high-speed digital and RF applications, integrating I-Tera MT40 and RO4450F PP. With precise impedance control, blind vias, and metal edge plating, this board is tailored for demanding environments requiring high-performance signal integrity and robust mechanical properties.

 

 

PCB Specifications & Requirements

Category Specification
Layer Count 6 Layers
Board Size 99 mm x 99 mm
Total Thickness 1.501 mm
Core I-Tera MT40
Prepreg (PP) RO4450F
Inner Layers 1 oz
Outer Layers 2 oz
Surface Finish Immersion Gold (ENIG), 2µm
Solder Mask Green
Silkscreen White Lettering
Impedance Control Top Layer, 5 mil trace, 50 Ohm (Single-ended)
Via Type Blind Vias
Via Filling 0.3mm vias, Resin Plugged + Electroplated Caps
Edge Plating Required (Metal Edge Plating)

 

 

 

Introduction

I-Tera MT40 is a high-performance laminate material designed for high-speed digital and RF/microwave applications. Its excellent thermal and electrical properties make it an ideal choice for advanced PCB designs.

 

 

Data Sheet

I-Tera® MT40
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 215 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 230 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 210 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) A. T260 >60 Minutes 2.4.24.1
B. T288
Z-Axis CTE A. Pre-Tg 55 ppm/°C 2.4.24C
B. Post-Tg 290 ppm/°C
C. 50 to 260°C, (Total Expansion) 2.8 %
X/Y-Axis CTE Pre-Tg 12 ppm/°C 2.4.24C
Thermal Conductivity 0.61 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched Pass Pass Visual 2.4.13.1
B. Etched
Dk, Permittivity A. @ 2 GHz 3.45 2.5.5.5
B. @ 5 GHz
C. @ 10 GHz
Df, Loss Tangent A. @ 2 GHz 0.0031 Bereskin Stripline
B. @ 5 GHz
C. @ 10 GHz
Volume Resistivity C-96/35/90 1.33 x 10^7 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 10^5 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 Class (Volts) UL 746A
ASTM D3638
Peel Strength 1 oz. EDC foil 1.0 (5.7) N/mm (lb/inch) 2.4.8C
Flexural Strength A. Length direction 490 (71.0) MPa (kpsi) 2.4.4B
B. Cross direction 400 (58.0)
Tensile Strength A. Length direction 269 (39.0) MPa (kpsi) ASTM D3039
B. Cross direction 241 (35.0)
Young's Modulus A. Length direction 3060 ksi ASTM D790-15e2
B. Cross direction 2784
Poisson's Ratio A. Length direction 0.234 ASTM D3039
B. Cross direction 0.222
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796

 

 

 

What is Single-End Impedance Control?

Single-ended impedance control refers to the precise regulation of a signal trace's impedance on a PCB. In high-frequency designs, maintaining consistent impedance is critical to ensure signal integrity and minimize reflections or losses.

 

How It Works:

Impedance is determined by the trace width, trace thickness, dielectric constant (Dk) of the material, and the distance between the trace and the reference plane.

For this PCB, the top layer features 5mil traces designed for a 50-ohm impedance, optimized for high-speed and RF signals.

 

 

Why It’s Important:

Ensures minimal signal distortion in high-speed digital and RF circuits.

Prevents impedance mismatches that can cause reflections, signal degradation, or electromagnetic interference (EMI).

 

 

Why Is Metal Edge Plating Necessary?

Metal edge plating involves plating the edges of the PCB with a conductive layer, typically for electrical, mechanical, or shielding purposes.

 

 

Benefits of Metal Edge Plating:

  • Provides electromagnetic shielding to reduce interference from external noise.
  • Enhances overall signal integrity in RF and high-speed applications.
  • Adds mechanical reinforcement to the PCB edges, increasing durability.
  • Ensures reliable electrical continuity between different layers or between the top and bottom of the PCB.
  • Useful in grounding applications, especially for multilayer designs.

 

 

Applications:

PCBs for RF, microwave, and antenna designs.

Boards requiring improved EMI protection in compact designs.

PCBs with strict durability requirements, such as aerospace and industrial electronics.

 

 

Summary

The 6-layer PCB with I-Tera MT40 and RO4450F PP materials is a high-performance solution for high-speed digital and RF applications. Key features such as 50-ohm impedance control, blind vias, and metal edge plating enhance the board's electrical performance and mechanical reliability.

Feature Purpose
I-Tera MT40 + RO4450F PP High-frequency performance and thermal stability
Impedance Control Ensures signal integrity for high-speed circuits
Blind Vias Reliable layer-to-layer connections
Metal Edge Plating Provides EMI shielding and mechanical strength

 

 

This PCB is ideal for applications in telecommunications, aerospace, RF/microwave systems, and industrial electronics, where high performance and durability are critical.

 

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