| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
6-Layer PCB with I-Tera MT40 and RO4450F PP
The 6-layer PCB is designed with advanced materials and features for high-speed digital and RF applications, integrating I-Tera MT40 and RO4450F PP. With precise impedance control, blind vias, and metal edge plating, this board is tailored for demanding environments requiring high-performance signal integrity and robust mechanical properties.
PCB Specifications & Requirements
| Category | Specification |
| Layer Count | 6 Layers |
| Board Size | 99 mm x 99 mm |
| Total Thickness | 1.501 mm |
| Core | I-Tera MT40 |
| Prepreg (PP) | RO4450F |
| Inner Layers | 1 oz |
| Outer Layers | 2 oz |
| Surface Finish | Immersion Gold (ENIG), 2µm |
| Solder Mask | Green |
| Silkscreen | White Lettering |
| Impedance Control | Top Layer, 5 mil trace, 50 Ohm (Single-ended) |
| Via Type | Blind Vias |
| Via Filling | 0.3mm vias, Resin Plugged + Electroplated Caps |
| Edge Plating | Required (Metal Edge Plating) |
Introduction
I-Tera MT40 is a high-performance laminate material designed for high-speed digital and RF/microwave applications. Its excellent thermal and electrical properties make it an ideal choice for advanced PCB designs.
Data Sheet
| I-Tera® MT40 | ||||
| Property | Typical Value | Units | Test Method | |
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 215 | °C | 2.4.25C | |
| Glass Transition Temperature (Tg) by DMA | 230 | °C | 2.4.24.4 | |
| Glass Transition Temperature (Tg) by TMA | 210 | °C | 2.4.24C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 | >60 | Minutes | 2.4.24.1 |
| B. T288 | ||||
| Z-Axis CTE | A. Pre-Tg | 55 | ppm/°C | 2.4.24C |
| B. Post-Tg | 290 | ppm/°C | ||
| C. 50 to 260°C, (Total Expansion) | 2.8 | % | ||
| X/Y-Axis CTE | Pre-Tg | 12 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.61 | W/m·K | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched | Pass | Pass Visual | 2.4.13.1 |
| B. Etched | ||||
| Dk, Permittivity | A. @ 2 GHz | 3.45 | — | 2.5.5.5 |
| B. @ 5 GHz | ||||
| C. @ 10 GHz | ||||
| Df, Loss Tangent | A. @ 2 GHz | 0.0031 | — | Bereskin Stripline |
| B. @ 5 GHz | ||||
| C. @ 10 GHz | ||||
| Volume Resistivity | C-96/35/90 | 1.33 x 10^7 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | C-96/35/90 | 1.33 x 10^5 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | 45.4 | kV | 2.5.6B | |
| Arc Resistance | 139 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 | Class (Volts) | UL 746A | |
| ASTM D3638 | ||||
| Peel Strength | 1 oz. EDC foil | 1.0 (5.7) | N/mm (lb/inch) | 2.4.8C |
| Flexural Strength | A. Length direction | 490 (71.0) | MPa (kpsi) | 2.4.4B |
| B. Cross direction | 400 (58.0) | |||
| Tensile Strength | A. Length direction | 269 (39.0) | MPa (kpsi) | ASTM D3039 |
| B. Cross direction | 241 (35.0) | |||
| Young's Modulus | A. Length direction | 3060 | ksi | ASTM D790-15e2 |
| B. Cross direction | 2784 | |||
| Poisson's Ratio | A. Length direction | 0.234 | — | ASTM D3039 |
| B. Cross direction | 0.222 | |||
| Moisture Absorption | 0.1 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
What is Single-End Impedance Control?
Single-ended impedance control refers to the precise regulation of a signal trace's impedance on a PCB. In high-frequency designs, maintaining consistent impedance is critical to ensure signal integrity and minimize reflections or losses.
How It Works:
Impedance is determined by the trace width, trace thickness, dielectric constant (Dk) of the material, and the distance between the trace and the reference plane.
For this PCB, the top layer features 5mil traces designed for a 50-ohm impedance, optimized for high-speed and RF signals.
Why It’s Important:
Ensures minimal signal distortion in high-speed digital and RF circuits.
Prevents impedance mismatches that can cause reflections, signal degradation, or electromagnetic interference (EMI).
Why Is Metal Edge Plating Necessary?
Metal edge plating involves plating the edges of the PCB with a conductive layer, typically for electrical, mechanical, or shielding purposes.
Benefits of Metal Edge Plating:
Applications:
PCBs for RF, microwave, and antenna designs.
Boards requiring improved EMI protection in compact designs.
PCBs with strict durability requirements, such as aerospace and industrial electronics.
Summary
The 6-layer PCB with I-Tera MT40 and RO4450F PP materials is a high-performance solution for high-speed digital and RF applications. Key features such as 50-ohm impedance control, blind vias, and metal edge plating enhance the board's electrical performance and mechanical reliability.
| Feature | Purpose |
| I-Tera MT40 + RO4450F PP | High-frequency performance and thermal stability |
| Impedance Control | Ensures signal integrity for high-speed circuits |
| Blind Vias | Reliable layer-to-layer connections |
| Metal Edge Plating | Provides EMI shielding and mechanical strength |
This PCB is ideal for applications in telecommunications, aerospace, RF/microwave systems, and industrial electronics, where high performance and durability are critical.
| MOQ: | 1PCS |
| Price: | 0.99-99USD/PCS |
| Standard Packaging: | Packing |
| Delivery Period: | 2-10 working days |
| Payment Method: | T/T, Paypal |
| Supply Capacity: | 50000pcs |
6-Layer PCB with I-Tera MT40 and RO4450F PP
The 6-layer PCB is designed with advanced materials and features for high-speed digital and RF applications, integrating I-Tera MT40 and RO4450F PP. With precise impedance control, blind vias, and metal edge plating, this board is tailored for demanding environments requiring high-performance signal integrity and robust mechanical properties.
PCB Specifications & Requirements
| Category | Specification |
| Layer Count | 6 Layers |
| Board Size | 99 mm x 99 mm |
| Total Thickness | 1.501 mm |
| Core | I-Tera MT40 |
| Prepreg (PP) | RO4450F |
| Inner Layers | 1 oz |
| Outer Layers | 2 oz |
| Surface Finish | Immersion Gold (ENIG), 2µm |
| Solder Mask | Green |
| Silkscreen | White Lettering |
| Impedance Control | Top Layer, 5 mil trace, 50 Ohm (Single-ended) |
| Via Type | Blind Vias |
| Via Filling | 0.3mm vias, Resin Plugged + Electroplated Caps |
| Edge Plating | Required (Metal Edge Plating) |
Introduction
I-Tera MT40 is a high-performance laminate material designed for high-speed digital and RF/microwave applications. Its excellent thermal and electrical properties make it an ideal choice for advanced PCB designs.
Data Sheet
| I-Tera® MT40 | ||||
| Property | Typical Value | Units | Test Method | |
| Metric (English) | IPC-TM-650 (or as noted) | |||
| Glass Transition Temperature (Tg) by DSC | 215 | °C | 2.4.25C | |
| Glass Transition Temperature (Tg) by DMA | 230 | °C | 2.4.24.4 | |
| Glass Transition Temperature (Tg) by TMA | 210 | °C | 2.4.24C | |
| Decomposition Temperature (Td) by TGA @ 5% weight loss | 360 | °C | 2.4.24.6 | |
| Time to Delaminate by TMA (Copper removed) | A. T260 | >60 | Minutes | 2.4.24.1 |
| B. T288 | ||||
| Z-Axis CTE | A. Pre-Tg | 55 | ppm/°C | 2.4.24C |
| B. Post-Tg | 290 | ppm/°C | ||
| C. 50 to 260°C, (Total Expansion) | 2.8 | % | ||
| X/Y-Axis CTE | Pre-Tg | 12 | ppm/°C | 2.4.24C |
| Thermal Conductivity | 0.61 | W/m·K | ASTM E1952 | |
| Thermal Stress 10 sec @ 288ºC (550.4ºF) | A. Unetched | Pass | Pass Visual | 2.4.13.1 |
| B. Etched | ||||
| Dk, Permittivity | A. @ 2 GHz | 3.45 | — | 2.5.5.5 |
| B. @ 5 GHz | ||||
| C. @ 10 GHz | ||||
| Df, Loss Tangent | A. @ 2 GHz | 0.0031 | — | Bereskin Stripline |
| B. @ 5 GHz | ||||
| C. @ 10 GHz | ||||
| Volume Resistivity | C-96/35/90 | 1.33 x 10^7 | MΩ-cm | 2.5.17.1 |
| Surface Resistivity | C-96/35/90 | 1.33 x 10^5 | MΩ | 2.5.17.1 |
| Dielectric Breakdown | 45.4 | kV | 2.5.6B | |
| Arc Resistance | 139 | Seconds | 2.5.1B | |
| Electric Strength (Laminate & laminated prepreg) | 45 (1133) | kV/mm (V/mil) | 2.5.6.2A | |
| Comparative Tracking Index (CTI) | 3 | Class (Volts) | UL 746A | |
| ASTM D3638 | ||||
| Peel Strength | 1 oz. EDC foil | 1.0 (5.7) | N/mm (lb/inch) | 2.4.8C |
| Flexural Strength | A. Length direction | 490 (71.0) | MPa (kpsi) | 2.4.4B |
| B. Cross direction | 400 (58.0) | |||
| Tensile Strength | A. Length direction | 269 (39.0) | MPa (kpsi) | ASTM D3039 |
| B. Cross direction | 241 (35.0) | |||
| Young's Modulus | A. Length direction | 3060 | ksi | ASTM D790-15e2 |
| B. Cross direction | 2784 | |||
| Poisson's Ratio | A. Length direction | 0.234 | — | ASTM D3039 |
| B. Cross direction | 0.222 | |||
| Moisture Absorption | 0.1 | % | 2.6.2.1A | |
| Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | |
| Relative Thermal Index (RTI) | 130 | °C | UL 796 | |
What is Single-End Impedance Control?
Single-ended impedance control refers to the precise regulation of a signal trace's impedance on a PCB. In high-frequency designs, maintaining consistent impedance is critical to ensure signal integrity and minimize reflections or losses.
How It Works:
Impedance is determined by the trace width, trace thickness, dielectric constant (Dk) of the material, and the distance between the trace and the reference plane.
For this PCB, the top layer features 5mil traces designed for a 50-ohm impedance, optimized for high-speed and RF signals.
Why It’s Important:
Ensures minimal signal distortion in high-speed digital and RF circuits.
Prevents impedance mismatches that can cause reflections, signal degradation, or electromagnetic interference (EMI).
Why Is Metal Edge Plating Necessary?
Metal edge plating involves plating the edges of the PCB with a conductive layer, typically for electrical, mechanical, or shielding purposes.
Benefits of Metal Edge Plating:
Applications:
PCBs for RF, microwave, and antenna designs.
Boards requiring improved EMI protection in compact designs.
PCBs with strict durability requirements, such as aerospace and industrial electronics.
Summary
The 6-layer PCB with I-Tera MT40 and RO4450F PP materials is a high-performance solution for high-speed digital and RF applications. Key features such as 50-ohm impedance control, blind vias, and metal edge plating enhance the board's electrical performance and mechanical reliability.
| Feature | Purpose |
| I-Tera MT40 + RO4450F PP | High-frequency performance and thermal stability |
| Impedance Control | Ensures signal integrity for high-speed circuits |
| Blind Vias | Reliable layer-to-layer connections |
| Metal Edge Plating | Provides EMI shielding and mechanical strength |
This PCB is ideal for applications in telecommunications, aerospace, RF/microwave systems, and industrial electronics, where high performance and durability are critical.