F4BTMS450 high frequency laminate built for hybridpcb, Multi Layer PCB Using in RF microwave application

Product Description: F4BTMS450 4-Layer PCB

This newly shipped 4-layer PCB, constructed with F4BTMS450 material, is a high-reliability solution designed for demanding RF, microwave, and aerospace applications. Engineered with precision and built to meet IPC-Class-2 standards, this PCB offers a balance of advanced material properties and robust construction features. Below, we analyze its advantages and disadvantages in detail.

PCB Construction Details

Advantages

F4BTMS450 has a dissipation factor (Df) of 0.0015 at 10GHz, ensuring minimal signal loss, making it ideal for high-frequency applications such as radar, microwave circuits, and satellite communication systems.

The PCB offers a Dk of 4.5 ± 0.09 at 10GHz, ensuring consistent signal integrity across a wide frequency range. This stability is critical for RF and phased array antenna designs.

With a thermal conductivity of 0.64 W/mK and a low thermal coefficient of Dk (-58 ppm/°C), the PCB maintains electrical performance even under thermal stresses.

The CTE values (X/Y: 12 ppm/°C, Z: 45 ppm/°C) ensure excellent dimensional stability, reducing warping during thermal cycling and improving reliability in high-temperature aerospace environments.

A low moisture absorption rate of 0.08% protects the board from performance degradation in humid or moisture-prone environments.

Versatile Applications:

The F4BTMS450 PCB is specifically designed for high-performance and mission-critical applications such as:

Aerospace systems: Space equipment, cabin systems, and satellite communications.

Microwave and RF applications: Radar systems, feed networks, and phased array antennas.

Military-grade designs: High-frequency radar and secure communication systems.

Disadvantages

Limited Protective Layers

Complex Manufacturing Requirements

Small Component Count

Cost Considerations

Conclusion

The F4BTMS450 4-layer PCB is an exceptional choice for high-frequency, high-reliability applications, particularly in aerospace and RF/microwave systems. Its advanced material properties, such as low loss, thermal stability, and dimensional integrity, make it ideal for mission-critical designs requiring precision and durability. However, the lack of protective layers, coupled with higher manufacturing costs, may limit its use in more general-purpose or cost-sensitive applications.

This PCB stands out as a specialized solution for cutting-edge industries requiring high-performance materials and reliable performance in demanding environments. For RF engineers and system designers, the F4BTMS450 4-layer PCB is a dependable option for next-generation communication systems.