Rogers RT/duroid 6035HTC RF-10 Double Layer RF PCB built on 30mil Core Laminate With ENIG Finish Using in microwave amplifiers

RT/duroid 6035HTC PCB: 2-Layer, 30mil Core, ENIG Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 
Overview of the 2-Layer RT/duroid 6035HTC PCB
The 2-layer RT/duroid 6035HTC PCB is a high-performance laminate designed for high-power RF and microwave applications. Engineered with ceramic-filled PTFE composites, this PCB offers exceptional thermal conductivity, low insertion loss, and excellent high-frequency performance, making it ideal for power amplifiers, filters, and combiners.
 
With a 30mil (0.762mm) core, ENIG (Immersion Gold) surface finish, and black silkscreen, this PCB ensures thermal stability and long-term reliability in demanding high-power RF environments.
 

 
PCB Construction Details

 
 
PCB Stackup
The 2-layer stackup for the RT/duroid 6035HTC PCB is optimized for high thermal conductivity and low insertion loss. Below is the detailed stackup:

 
 
PCB Statistics
The 2-layer RT/duroid 6035HTC PCB is designed for high-power RF circuits with the following key statistics:

• Components: 19
• Total Pads: 53
• Thru Hole Pads: 31
• Top SMT Pads: 22
• Bottom SMT Pads: 0
• Vias: 33
• Nets: 2

 
 
 
Introduction to RT/duroid 6035HTC Material
RT/duroid 6035HTC is a ceramic-filled PTFE laminate developed for high-power RF and microwave applications. Its high thermal conductivity (1.44 W/m·K) ensures efficient heat dissipation, while its low dissipation factor (0.0013 at 10GHz) minimizes signal loss.
 
The material’s advanced filler system provides excellent drill-ability and long-term thermal stability, making it an ideal choice for high-power designs requiring low insertion loss and consistent performance in extreme environments.
 
Features of RT/duroid 6035HTC

1. Dielectric Constant (Dk): 3.5 ± 0.05 at 10GHz/23°C
2. Dissipation Factor (Df): 0.0013 at 10GHz/23°C
3. Thermal Conductivity: 1.44 W/m·K at 80°C
4. Thermal Coefficient of Dielectric Constant (TCDk): -66 ppm/°C
5. Moisture Absorption: 0.06%
6. Coefficient of Thermal Expansion (CTE): X-axis: 19 ppm/°C, Y-axis: 19 ppm/°C, Z-axis: 39 ppm/°C
7. Flammability Rating: UL 94-V0

 
 
 
Benefits of RT/duroid 6035HTC PCB

1. High Thermal Conductivity: Excellent heat dissipation reduces operating temperatures for high-power circuits.
2. Low Insertion Loss: Superior dielectric properties minimize RF signal losses.
3. Thermal Stability: Maintains performance in extreme environments with minimal Dk variation.
4. Reliable Drill-ability: Advanced filler system reduces fabrication costs.
5. Moisture Resistance: Low absorption rate ensures stable performance in humid environments.
6. High-Performance Copper Foil: Supports efficient signal propagation with minimal skin-effect losses.

 
 
 
Applications of RT/duroid 6035HTC PCB

1. High-Power RF and Microwave Amplifiers
2. Power Amplifiers
3. Couplers and Filters
4. Combiners and Dividers
5. Satellite Systems

 
 
 
Why Choose the 2-Layer RT/duroid 6035HTC PCB?
The RT/duroid 6035HTC PCB is the perfect solution for high-power, high-frequency designs requiring thermal stability, low loss, and long-term reliability. Its 30mil core, ENIG finish, and high thermal conductivity make it an excellent choice for mission-critical RF and microwave applications in aerospace, telecommunications, and satellite systems.
 
Contact us today to learn more about this high-performance PCB or to place your order!