RO3210 high frequency 2-Layer circuit board built on 30mil Core Laminate with ENIG Finish using in Power backplanes

RO3210 PCB: 2-Layer, 30mil Core, ENIG Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Overview of the 2-Layer RO3210 PCB

The 2-layer RO3210 PCB is a high-performance, ceramic-filled laminate designed for high-frequency applications requiring exceptional electrical and mechanical stability. Built with Rogers RO3210 material, this PCB offers high dielectric constant (Dk), low dissipation factor, and excellent dimensional stability, making it ideal for automotive collision avoidance systems, wireless telecommunications, and microstrip patch antennas.

This PCB features a 30mil (0.762mm) core thickness, immersion gold (ENIG) surface finish, and green solder mask, ensuring precision and durability for demanding RF and microwave applications.

PCB Construction Details

PCB Stackup

The 2-layer stackup is optimized for low loss and high-frequency stability, with a uniform and precise structure. Below is the detailed layer stackup:

PCB Statistics

The 2-layer RO3210 PCB is compact and optimized for RF and microwave applications. Below are its key statistics:

• Components: 3
• Total Pads: 10
• Thru Hole Pads: 6
• Top SMT Pads: 4
• Bottom SMT Pads: 0
• Vias: 5
• Nets: 2

Introduction to RO3210 Material

Rogers RO3210 laminates are ceramic-filled PTFE materials reinforced with woven fiberglass, designed for high-frequency circuits requiring rigidity and excellent electrical performance. These laminates combine the smoothness of non-woven PTFE materials with the mechanical stability of woven-glass laminates, enabling consistent performance in complex high-frequency designs.

Key characteristics include:

• High dielectric constant (Dk): Provides precise signal control for RF applications.
• Low dissipation factor (Df): Ensures minimal signal loss and phase shift.
• Dimensional stability: Allows for high production yields and fine-line etching tolerances.

Features of RO3210

• Dielectric Constant (Dk): 10.2 ± 0.5 at 10GHz
• Dissipation Factor (Df): 0.0027 at 10GHz
• CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C, Y-axis: 13 ppm/°C, Z-axis: 34 ppm/°C
• Decomposition Temperature (Td): 500°C
• Thermal Conductivity: 0.81 W/mK
• Flammability Rating: UL-94 V0

Benefits of RO3210 PCB

• Woven Glass Reinforcement: Improves rigidity for easier handling and assembly.
• High Dielectric Constant: Enables compact designs and precise signal control.
• Low Dissipation Factor: Minimizes signal loss for high-frequency circuits.
• Matched CTE to Copper: Ensures reliability in hybrid designs and surface-mounted assemblies.
• Dimensional Stability: Enables high production yields and precise manufacturing.
• Surface Smoothness: Allows for finer line etching tolerances, suitable for advanced RF designs.

Applications of RO3210 PCB

1. Automotive Collision Avoidance Systems: Reliable signal transmission for radar-based safety systems.
2. Automotive GPS Antennas: High dielectric constant enables compact, high-precision designs.
3. Wireless Telecommunications Systems: Ensures low loss and stable performance.
4. Microstrip Patch Antennas: Provides consistent performance for wireless communication.
5. Direct Broadcast Satellites: Delivers reliable signal propagation in satellite systems.
6. Base Station Infrastructure: Suitable for high-frequency signal routing in base stations.
7. LMDS and Wireless Broadband: Supports high-speed data transmission.

Why Choose the 2-Layer RO3210 PCB?

The 2-layer RO3210 PCB is the ideal choice for high-frequency circuit designs requiring low loss, mechanical stability, and compact size. Its 30mil core, ENIG finish, and high dielectric constant make it a preferred solution for automotive radar, wireless communication, and satellite systems.

Contact us today to learn more about this high-performance PCB or to place an order for your application!