RO4350B + High Tg FR-4 (S1000-2M) 4-Layer PCB with 1.5mm Thickness: A High-Performance Hybrid PCB Solution by Bicheng Technologies Limited

RO4350B + High Tg FR-4 (S1000-2M) 4-Layer PCB with 1.5mm Thickness: A High-Performance Hybrid PCB Solution by Bicheng Technologies Limited

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

At Bicheng Technologies Limited, we specialize in delivering high-quality PCB solutions designed to meet the most demanding requirements of RF, microwave, and high-frequency applications. One of our standout products is the RO4350B + High Tg FR-4 (S1000-2M) 4-Layer PCB, a hybrid board combining the superior electrical properties of Rogers RO4350B with the mechanical and thermal robustness of S1000-2M high Tg FR-4 material.

This 1.5mm PCB is optimized for high performance, thermal stability, and low dielectric loss, making it an ideal choice for broadband antennas, radar systems, and digital communication devices. With its 4-layer stackup, ENIG surface finish, and high component density, this PCB is engineered to perform in the most challenging environments.

Let’s explore the details of this cutting-edge PCB, its unique features, and the wide range of applications it supports.

1. Overview of the RO4350B + High Tg FR-4 Hybrid 4-Layer PCB

The RO4350B + High Tg FR-4 (S1000-2M) 4-Layer PCB combines the electrical superiority of Rogers RO4350B material with the mechanical reliability of S1000-2M. This hybrid construction allows designers to achieve high-frequency performance without compromising on mechanical stability or thermal resistance.

The RO4350B laminate offers a low dissipation factor (Df) and stable dielectric constant (Dk), ensuring minimal signal loss and consistent performance in RF and microwave circuits. Meanwhile, the S1000-2M high Tg FR-4 material enhances the PCB’s heat resistance, anti-CAF performance, and dimensional stability, making it ideal for demanding, high-density designs.

At Bicheng Technologies Limited, we ensure that every PCB meets IPC-Class-2 standards and undergoes 100% electrical testing to guarantee reliability and precision.

PCB Construction Details

Here’s a detailed breakdown of the construction of this 4-layer PCB:

This rigid 4-layer stackup ensures thermal stability, mechanical reliability, and low signal loss, making it suitable for high-frequency and high-power applications.

2. Features and Advantages of RO4350B and S1000-2M Materials

The performance of this PCB is driven by the unique properties of the RO4350B laminate and S1000-2M high Tg FR-4 material. These materials combine to deliver a PCB that is ideal for mixed dielectric constructions, offering the best of both worlds: high-frequency performance and mechanical durability.

Key Features of Rogers RO4350B:

• Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz/23°C, ensuring stable signal propagation across a wide frequency range.
• Dissipation Factor (Df): 0.0037 at 10GHz/23°C, minimizing energy loss and optimizing signal transmission.
• Thermal Conductivity: 0.69W/m/K, enabling efficient heat dissipation in high-power designs.
• Thermal Stability:
• CTE (Coefficient of Thermal Expansion):
  • X-axis: 10ppm/°C
  • Y-axis: 12ppm/°C
  • Z-axis: 32ppm/°C, ensuring excellent dimensional stability under thermal stress.
• High Tg: >280°C, maintaining stable performance over a wide temperature range.
• Moisture Resistance: Low water absorption of 0.06%, ensuring reliable performance in humid environments.

Key Features of S1000-2M:

• Tg Value: 180°C (DSC), ensuring high thermal resistance and lead-free soldering compatibility.
• Mechanical Processability: Excellent machinability for precise and reliable manufacturing.
• Anti-CAF Performance: Prevents conductive anodic filament formation, improving long-term reliability.
• Dimensional Stability: Low Z-axis CTE for improved through-hole reliability.
• Moisture Resistance: Low water absorption, enabling stable performance in challenging environments.

Key Benefits of the Hybrid Construction:

• High-Frequency Stability: The RO4350B material ensures minimal signal loss and consistent Dk, making it ideal for RF and microwave designs.
• Thermal Reliability: The S1000-2M core enhances heat resistance and dimensional stability, especially in high-density layouts.
• Cost Efficiency: This hybrid construction offers high performance at a fraction of the cost of fully PTFE-based laminates.

3. Applications of the RO4350B + High Tg FR-4 4-Layer PCB

This hybrid 4-layer PCB is designed for industries that require high-frequency stability, thermal reliability, and mechanical durability. Its ability to handle high power and low signal loss makes it suitable for a wide range of applications.

Key Applications:

1. Commercial Airline Broadband Antennas
2. Microstrip and Stripline Circuits
3. Millimeter-Wave Applications
4. Radar Systems and Guidance Systems
5. Point-to-Point Digital Radio Antennas

Why Choose Bicheng Technologies Limited?

At Bicheng Technologies Limited, we are committed to delivering innovative PCB solutions that meet the needs of high-performance industries. The RO4350B + High Tg FR-4 4-Layer PCB is a prime example of our dedication to quality, offering low signal loss, thermal reliability, and mechanical robustness.

Every PCB we manufacture undergoes 100% electrical testing to ensure reliable performance. With worldwide availability and adherence to IPC-Class-2 standards, we’re here to support your most demanding projects.

For inquiries or technical assistance, feel free to contact me, Sally, at sales30@bichengpcb.com. I’ll be happy to help you find the perfect PCB solution for your application.