Introducing the Hybrid 6-Layer PCB: The Ultimate Solution for High-Frequency and Mixed-Signal Applications

As Sally, a senior sales manager, I’m excited to highlight the exceptional performance and versatility of the newly shipped Hybrid 6-Layer PCB. Built with a combination of RO4350B and S1000-2M laminates, this PCB is engineered to handle high-frequency applications while offering robust mechanical and thermal reliability. Its advanced construction, high-quality materials, and precise manufacturing make it the perfect choice for RF, microwave, and millimeter-wave technologies.

Let’s dive into the details of this cutting-edge PCB and why it’s a game-changer for demanding electronic designs.

Advanced Construction for Superior Performance

This Hybrid PCB integrates materials and manufacturing techniques to ensure peak performance in high-frequency and mixed-signal environments. Below are the key highlights of its construction:

• Base Materials:
  • RO4350B: Known for its low loss and stable dielectric properties, ideal for RF and microwave applications.
  • S1000-2M: Provides excellent thermal resistance, anti-CAF performance, and superior mechanical reliability.
• Layer Count: 6 layers, enabling complex signal routing and ground planes for high-frequency stability.
• Dimensions: Compact design with dimensions of 76.5mm x 83mm, adhering to a strict tolerance of +/- 0.15mm.
• Trace/Space: Minimum trace and space of 4/4 mils, ensuring precise signal routing for dense circuits.
• Finished Thickness: The board maintains a 1.5mm finished thickness, balancing rigidity and compactness.
• Copper Weight: 1oz (35 μm) copper on both inner and outer layers for reliable power distribution and signal integrity.
• Blind Vias: L1-L2 blind vias enhance signal path optimization without compromising the board’s structural integrity.
• Surface Finish: Electroless Nickel Immersion Gold (ENIG) for excellent solderability, corrosion resistance, and long-term reliability.
• Solder Mask and Silkscreen:
  • Top and bottom solder masks: Blue.
  • Top and bottom silkscreens: White for clear component labeling.

Every PCB undergoes 100% electrical testing to ensure quality and compliance with IPC-Class-2 standards before shipment.

Hybrid Stackup: Precision Meets Performance

The 6-layer hybrid stackup combines RO4350B and S1000-2M to deliver a balance of electrical performance, thermal reliability, and mechanical strength. The stackup is as follows:

1. Copper Layer 1 (Signal): 35 μm (1oz), impedance-controlled for 50 ohms with a 4mil trace width.
2. Dielectric (RO4350B): 0.254mm (10mil), offering low dielectric loss and stable performance at high frequencies.
3. Copper Layer 2 (Signal/Ground): 35 μm (1oz).
4. Prepreg: 1080 X2 RC63%, 0.127mm (5mil), bonding layers with excellent stability.
5. Copper Layer 3 (Signal): 35 μm (1oz).
6. Dielectric (S1000-2M): 0.254mm (10mil), providing mechanical processability and thermal resistance.
7. Copper Layer 4 (Signal): 35 μm (1oz).
8. Prepreg: 1080 X2 RC63%, 0.127mm (5mil).
9. Copper Layer 5 (Ground/Power Plane): 35 μm (1oz).
10. Dielectric (RO4350B): 0.254mm (10mil).
11. Copper Layer 6 (Signal): 35 μm (1oz).

This stackup ensures low signal loss, excellent impedance control, and reliable thermal performance.

Material Advantages

The success of this hybrid PCB lies in the combination of RO4350B and S1000-2M, two industry-leading materials that bring unique benefits to the table.

RO4350B: The RF & Microwave Specialist

RO4350B is a high-frequency laminate from Rogers Corporation, designed for RF and microwave applications.

Key Features:

• Low Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz, ensuring stable and precise signal transmission.
• Low Dissipation Factor (Df): 0.0037 at 10GHz, minimizing signal loss in high-frequency designs.
• Thermal Stability:
  • Tg: >280°C, maintaining dimensional stability during thermal cycling.
  • Low Z-axis CTE: 32 ppm/°C, ensuring reliable plated through-hole performance.
• Manufacturability: Compatible with standard epoxy/glass processing, reducing production costs.
• Moisture Resistance: Absorbs just 0.06%, ensuring consistent performance in humid environments.

S1000-2M: The Thermal and Mechanical Powerhouse

S1000-2M is a high-performance laminate that complements RO4350B by providing mechanical and thermal reliability.

Key Features:

• High Tg: 180°C, ensuring excellent heat resistance.
• Anti-CAF Performance: Prevents conductive anodic filament formation for long-term reliability.
• UV Blocking: Compatible with Automated Optical Inspection (AOI) systems.
• Low Water Absorption: Improves dimensional stability and performance in harsh environments.

​Technical Highlights

Here are the key statistics of the Hybrid 6-Layer PCB:

• Components: 149.
• Total Pads: 215.
• Thru-Hole Pads: 57.
• Top SMT Pads: 38.
• Bottom SMT Pads: 120.
• Vias: 79.
• Nets: 6.

​Applications: Where the Hybrid PCB Excels

Thanks to its unique combination of materials, precise construction, and advanced features, the Hybrid 6-Layer PCB is perfectly suited for the following applications:

1. Commercial Airline Broadband Antennas

The low Dk and Df of RO4350B ensure minimal signal loss, while the S1000-2M adds durability for harsh aviation environments.

2. Microstrip and Stripline Circuits

Impedance control and low dielectric loss make this PCB ideal for high-frequency circuit designs.

3. Millimeter-Wave Applications

The board’s ability to handle high frequencies with precision ensures performance in the 30GHz to 300GHz range.

4. Radar and Guidance Systems

The thermal stability and reliability of the hybrid stackup make it a dependable choice for radar and navigation technologies.

5. Point-to-Point Digital Radio Antennas

Stable impedance and minimal loss ensure efficient signal transmission in communication systems.

Why Choose the Hybrid 6-Layer PCB?

The Hybrid 6-Layer PCB offers:

1. High-Frequency Performance: RO4350B ensures low loss and stable signal transmission.
2. Reliability: S1000-2M provides thermal and mechanical stability for demanding environments.
3. Impedance Control: 50-ohm impedance on the top layer for precise high-speed signal routing.
4. Cost-Effective Manufacturing: Standard processing methods reduce production costs compared to PTFE-based laminates.
5. Global Availability: Manufactured to IPC-Class-2 standards, ready to ship worldwide.

​Conclusion: Build with Confidence

The Hybrid 6-Layer PCB combines the best of both worlds: the high-frequency performance of RO4350B and the thermal and mechanical reliability of S1000-2M. Its advanced features, robust construction, and wide range of applications make it the ideal choice for cutting-edge RF, microwave, and millimeter-wave designs.

If you’re ready to elevate your designs with a high-performance PCB, contact us today to learn more or place your order. Let’s power the future of technology together!