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Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications

Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications

MOQ: 1PCS
Price: 0.99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working day
Payment Method: T/T
Supply Capacity: 10000pcs
Detail Information
Place of Origin
China
Brand Name
Wangling
Certification
ISO9001
Model Number
F4BM
Minimum Order Quantity:
1PCS
Price:
0.99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working day
Payment Terms:
T/T
Supply Ability:
10000pcs
Product Description

Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications

As a senior sales manager, I’m thrilled to introduce you to the F4BM220 2-Layer PCB, a cutting-edge solution designed for high-frequency applications such as RF, microwave, and radar systems. Engineered with precision and backed by the advanced features of Wangling's F4BM220 laminates, this PCB combines superior performance, reliability, and manufacturability to meet the demands of today’s most advanced technologies.
This article delves into the construction, material advantages, technical details, and typical applications of the F4BM220 PCB, highlighting why it’s the ideal choice for your next project.
 
 
 
Precision Construction for Advanced Performance
The F4BM220 PCB is a 2-layer rigid board with meticulous design and manufacturing to ensure it performs flawlessly in high-frequency environments. Let’s take a closer look at its construction:

  • Base Material: F4BM220, a high-performance laminate designed for RF and microwave applications.
  • Dimensions: The board measures 66.7mm x 51.9mm, with a tight tolerance of +/- 0.15mm.
  • Board Thickness: The finished thickness is 0.9mm, making it compact yet robust.
  • Copper Weight: Both outer layers are plated with 1oz (1.4 mils) of copper, ensuring excellent conductivity.
  • Trace/Space: A minimum trace width and spacing of 5/5 mils allow for precise signal routing in high-density designs.
  • Via Plating: Copper plating thickness of 20 μm, ensuring reliable connections and durability.
  • Surface Finish: Immersion Gold (ENIG) provides outstanding solderability, corrosion resistance, and long-term stability.
  • Solder Mask and Silkscreen:
    • Top Side: Blue solder mask and white silkscreen for clear labeling.
    • Bottom Side: No solder mask or silkscreen for a clean finish.
  • Electrical Testing: Every PCB undergoes 100% electrical testing before shipment, ensuring it meets the highest quality standards.

This combination of features ensures high reliability and performance, making it suitable for even the most demanding RF and microwave applications.
 
 
PCB Stackup: Simple Yet Effective
The 2-layer stackup of the F4BM220 PCB is designed to optimize electrical performance while maintaining structural integrity and thermal stability:

  1. Copper Layer 1: 35 μm (1oz) copper for efficient signal transmission.
  2. F4BM220 Core: 0.8mm thickness, providing a stable dielectric layer with low loss.
  3. Copper Layer 2: 35 μm (1oz) copper for consistent electrical performance.

This straightforward stackup delivers excellent RF performance while maintaining manufacturability and reliability.
 
 
Material Advantages: Why F4BM220 Stands Out
At the heart of this PCB is the F4BM220 laminate, a cutting-edge material that offers advanced properties for high-frequency applications. Manufactured with a combination of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film, F4BM220 is designed to outperform traditional laminates.
 
Key Features of F4BM220

  1. Low Dielectric Constant (Dk): Dk of 2.2 ± 0.04 at 10GHz ensures stable and precise signal transmission, critical for RF and microwave designs.
  2. Low Dissipation Factor (Df): Df of 0.001 at 10GHz minimizes signal loss, ensuring high efficiency in power-sensitive applications.
  3. Thermal Stability: CTE (Coefficient of Thermal Expansion): X-axis: 25ppm/°C, Y-axis: 34ppm/°C, Z-axis: 240ppm/°C.
  4. Operates reliably in temperatures ranging from -55°C to 288°C, making it suitable for extreme environments.
  5. Moisture Resistance: Absorbs less than 0.08% moisture, ensuring consistent performance in humid conditions.
  6. Flammability: Rated UL-94 V0, offering safety and reliability.
  7. Dimensional Stability: Achieves precise control of the dielectric constant, reducing thermal expansion and improving temperature drift.

These features make F4BM220 an ideal choice for high-frequency applications where stability, low loss, and reliability are essential.
 
Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications 0
 
Applications: Where the F4BM220 PCB Excels
The F4BM220 PCB is purpose-built for a wide range of RF and microwave applications. Its advanced material properties and precise construction make it a trusted solution in industries such as telecommunications, aerospace, and defense.
 
 
Typical Applications:

  • Microwave and RF Systems: The low Dk and Df ensure efficient signal transmission and minimal loss in microwave designs.
  • Radar Systems: Provides the stability and reliability needed for military and automotive radar technologies.
  • Power Dividers, Couplers, and Combiners: Optimized for high-frequency power management components.
  • Phased Array Antennas: Delivers precise signal control for phase-sensitive systems.
  • Satellite Communications: Ensures consistent performance in high-frequency satellite technologies.
  • Base Station Antennas: Perfect for telecommunications infrastructure requiring stable, high-frequency performance.

By leveraging the superior properties of F4BM220, this PCB delivers exceptional performance in mission-critical applications.
 
 
 
Why Choose the F4BM220 PCB?
The F4BM220 2-Layer PCB offers a unique combination of advanced material properties, precise construction, and quality assurance. Here’s why it stands out:

  1. High-Frequency Performance:

    • With a low Dk, low Df, and stable thermal properties, it ensures reliable operation across a broad frequency range.
  2. Enhanced Durability:

    • The ENIG finish, moisture resistance, and high thermal stability ensure long-term reliability even in harsh environments.
  3. Manufacturability:

    • Designed for easy processing, the F4BM220 PCB combines advanced materials with practical manufacturability.
  4. Global Availability:

    • With worldwide availability and compliance with IPC-Class-2 standards, this PCB is accessible to customers everywhere.

 
 
 
​Conclusion: Build Your Future with F4BM220
The F4BM220 2-Layer PCB is more than just a circuit board—it’s a high-performance solution designed to meet the needs of today’s most advanced RF and microwave systems. With its superior material properties, precise construction, and proven reliability, this PCB is the perfect foundation for your next project.
 
Whether you’re developing radar systems, satellite communications, or base station antennas, the F4BM220 PCB delivers the performance and consistency you need to succeed.
 
Contact us today to learn more or place an order. Let’s build tomorrow’s innovations together!

products
PRODUCTS DETAILS
Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications
MOQ: 1PCS
Price: 0.99USD/PCS
Standard Packaging: Packing
Delivery Period: 2-10 working day
Payment Method: T/T
Supply Capacity: 10000pcs
Detail Information
Place of Origin
China
Brand Name
Wangling
Certification
ISO9001
Model Number
F4BM
Minimum Order Quantity:
1PCS
Price:
0.99USD/PCS
Packaging Details:
Packing
Delivery Time:
2-10 working day
Payment Terms:
T/T
Supply Ability:
10000pcs
Product Description

Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications

As a senior sales manager, I’m thrilled to introduce you to the F4BM220 2-Layer PCB, a cutting-edge solution designed for high-frequency applications such as RF, microwave, and radar systems. Engineered with precision and backed by the advanced features of Wangling's F4BM220 laminates, this PCB combines superior performance, reliability, and manufacturability to meet the demands of today’s most advanced technologies.
This article delves into the construction, material advantages, technical details, and typical applications of the F4BM220 PCB, highlighting why it’s the ideal choice for your next project.
 
 
 
Precision Construction for Advanced Performance
The F4BM220 PCB is a 2-layer rigid board with meticulous design and manufacturing to ensure it performs flawlessly in high-frequency environments. Let’s take a closer look at its construction:

  • Base Material: F4BM220, a high-performance laminate designed for RF and microwave applications.
  • Dimensions: The board measures 66.7mm x 51.9mm, with a tight tolerance of +/- 0.15mm.
  • Board Thickness: The finished thickness is 0.9mm, making it compact yet robust.
  • Copper Weight: Both outer layers are plated with 1oz (1.4 mils) of copper, ensuring excellent conductivity.
  • Trace/Space: A minimum trace width and spacing of 5/5 mils allow for precise signal routing in high-density designs.
  • Via Plating: Copper plating thickness of 20 μm, ensuring reliable connections and durability.
  • Surface Finish: Immersion Gold (ENIG) provides outstanding solderability, corrosion resistance, and long-term stability.
  • Solder Mask and Silkscreen:
    • Top Side: Blue solder mask and white silkscreen for clear labeling.
    • Bottom Side: No solder mask or silkscreen for a clean finish.
  • Electrical Testing: Every PCB undergoes 100% electrical testing before shipment, ensuring it meets the highest quality standards.

This combination of features ensures high reliability and performance, making it suitable for even the most demanding RF and microwave applications.
 
 
PCB Stackup: Simple Yet Effective
The 2-layer stackup of the F4BM220 PCB is designed to optimize electrical performance while maintaining structural integrity and thermal stability:

  1. Copper Layer 1: 35 μm (1oz) copper for efficient signal transmission.
  2. F4BM220 Core: 0.8mm thickness, providing a stable dielectric layer with low loss.
  3. Copper Layer 2: 35 μm (1oz) copper for consistent electrical performance.

This straightforward stackup delivers excellent RF performance while maintaining manufacturability and reliability.
 
 
Material Advantages: Why F4BM220 Stands Out
At the heart of this PCB is the F4BM220 laminate, a cutting-edge material that offers advanced properties for high-frequency applications. Manufactured with a combination of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film, F4BM220 is designed to outperform traditional laminates.
 
Key Features of F4BM220

  1. Low Dielectric Constant (Dk): Dk of 2.2 ± 0.04 at 10GHz ensures stable and precise signal transmission, critical for RF and microwave designs.
  2. Low Dissipation Factor (Df): Df of 0.001 at 10GHz minimizes signal loss, ensuring high efficiency in power-sensitive applications.
  3. Thermal Stability: CTE (Coefficient of Thermal Expansion): X-axis: 25ppm/°C, Y-axis: 34ppm/°C, Z-axis: 240ppm/°C.
  4. Operates reliably in temperatures ranging from -55°C to 288°C, making it suitable for extreme environments.
  5. Moisture Resistance: Absorbs less than 0.08% moisture, ensuring consistent performance in humid conditions.
  6. Flammability: Rated UL-94 V0, offering safety and reliability.
  7. Dimensional Stability: Achieves precise control of the dielectric constant, reducing thermal expansion and improving temperature drift.

These features make F4BM220 an ideal choice for high-frequency applications where stability, low loss, and reliability are essential.
 
Discover the F4BM220 PCB: A High-Performance 2-Layer Solution for RF and Microwave Applications 0
 
Applications: Where the F4BM220 PCB Excels
The F4BM220 PCB is purpose-built for a wide range of RF and microwave applications. Its advanced material properties and precise construction make it a trusted solution in industries such as telecommunications, aerospace, and defense.
 
 
Typical Applications:

  • Microwave and RF Systems: The low Dk and Df ensure efficient signal transmission and minimal loss in microwave designs.
  • Radar Systems: Provides the stability and reliability needed for military and automotive radar technologies.
  • Power Dividers, Couplers, and Combiners: Optimized for high-frequency power management components.
  • Phased Array Antennas: Delivers precise signal control for phase-sensitive systems.
  • Satellite Communications: Ensures consistent performance in high-frequency satellite technologies.
  • Base Station Antennas: Perfect for telecommunications infrastructure requiring stable, high-frequency performance.

By leveraging the superior properties of F4BM220, this PCB delivers exceptional performance in mission-critical applications.
 
 
 
Why Choose the F4BM220 PCB?
The F4BM220 2-Layer PCB offers a unique combination of advanced material properties, precise construction, and quality assurance. Here’s why it stands out:

  1. High-Frequency Performance:

    • With a low Dk, low Df, and stable thermal properties, it ensures reliable operation across a broad frequency range.
  2. Enhanced Durability:

    • The ENIG finish, moisture resistance, and high thermal stability ensure long-term reliability even in harsh environments.
  3. Manufacturability:

    • Designed for easy processing, the F4BM220 PCB combines advanced materials with practical manufacturability.
  4. Global Availability:

    • With worldwide availability and compliance with IPC-Class-2 standards, this PCB is accessible to customers everywhere.

 
 
 
​Conclusion: Build Your Future with F4BM220
The F4BM220 2-Layer PCB is more than just a circuit board—it’s a high-performance solution designed to meet the needs of today’s most advanced RF and microwave systems. With its superior material properties, precise construction, and proven reliability, this PCB is the perfect foundation for your next project.
 
Whether you’re developing radar systems, satellite communications, or base station antennas, the F4BM220 PCB delivers the performance and consistency you need to succeed.
 
Contact us today to learn more or place an order. Let’s build tomorrow’s innovations together!

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