RO3035 2-Layer PCB: A High-Frequency Solution for Automotive Radar

The RO3035 2-Layer PCB: Unlocking High-Frequency Performance for Next-Generation Applications

As industries like 5G communications, automotive radar, and satellite systems continue to grow, the demand for high-performance circuit boards has increased significantly. Meeting these demands requires cutting-edge materials and precise engineering to deliver reliable performance in high-frequency environments. The RO3035 2-Layer PCB, built with Rogers RO3035 ceramic-filled PTFE laminates, is a newly shipped solution designed specifically for these applications. It combines advanced material properties, excellent thermal stability, and high-frequency performance to meet the requirements of modern designs.

In this article, we’ll explore the construction, features, benefits, and applications of the RO3035 2-Layer PCB, showcasing why it’s an excellent choice for engineers and manufacturers working on innovative projects.

What is the RO3035 2-Layer PCB?

The RO3035 2-Layer PCB is a high-frequency circuit board designed for applications requiring precision, reliability, and thermal stability. The board is constructed with Rogers RO3035 laminates, which are ceramic-filled PTFE materials known for their excellent electrical and mechanical properties. These laminates are part of the RO3000 series, making them ideal for RF (radio frequency), microwave, and 5G applications.

The PCB features a 2-layer rigid stackup, an ultra-thin 5 mil substrate, and a highly durable immersion gold surface finish. Combined with advanced manufacturing processes, this PCB delivers the performance and reliability required for cutting-edge technologies.

Technical Specifications

Here’s a detailed breakdown of the RO3035 2-Layer PCB:

1. PCB Construction

1. Base Material: Rogers RO3035 (ceramic-filled PTFE laminate)
2. Layer Count: 2 layers
3. Board Dimensions: 67.1mm x 57.6mm (2 types, 2 pieces)
4. Finished Board Thickness: 0.2mm
5. Copper Weight: 1 oz (35 μm) per outer layer
6. Minimum Trace/Space: 4/5 mil
7. Minimum Hole Size: 0.2mm
8. Via Plating Thickness: 20 μm
9. Surface Finish: Immersion Gold (for superior solderability and corrosion resistance)
10. Solder Mask and Silkscreen: None (bare board design to enhance high-frequency performance)
11. Electrical Testing: 100% testing before shipment to ensure quality

2. PCB Stackup

Copper Layer 1: 35 μm

Rogers RO3035 Substrate: 5 mil (0.127mm)

Copper Layer 2: 35 μm

This stackup provides excellent signal integrity, low losses, and stable impedance, making it suitable for high-frequency designs.

3. Material Properties

1. The Rogers RO3035 laminate has the following properties:
2. Dielectric Constant (Dk): 3.5 ± 0.05 at 10 GHz/23°C
3. Dissipation Factor (Df): 0.0015 at 10 GHz/23°C
4. Thermal Decomposition Temperature (Td): >500°C
5. Thermal Conductivity: 0.5 W/mK
6. Moisture Absorption: 0.04%
7. Coefficient of Thermal Expansion (CTE):

• X/Y Axis: 17 ppm/°C
• Z Axis: 24 ppm/°C

These properties ensure that the board performs consistently in environments with high frequencies and extreme temperatures.

Key Features

Designed for High-Frequency Applications

• The RO3035 PCB is optimized for applications up to 30–40 GHz, ensuring excellent signal integrity with minimal loss.

Exceptional Thermal Stability

• With a thermal decomposition temperature (Td) of over 500°C and low CTE, the board offers superior dimensional stability and reliability.

Immersion Gold Surface Finish

• The immersion gold finish enhances solderability and provides corrosion resistance, ensuring long-term reliability in harsh environments.

Precision Manufacturing

• The 4/5 mil trace/space and 0.2mm minimum hole size meet the needs of advanced designs, providing accuracy and consistency.

Scalability for Hybrid Designs

• The RO3035 material allows integration with other PCB materials, making it ideal for hybrid multi-layer designs.

Benefits of the RO3035 2-Layer PCB

The RO3035 2-Layer PCB offers several advantages that make it the preferred choice for engineers working on advanced systems:

1. High-Frequency Performance

• The stable dielectric constant (Dk) and low dissipation factor (Df) of the RO3035 material ensure excellent signal integrity, even at high frequencies. This makes the board suitable for RF and microwave applications, where precision is critical.

2. Thermal and Mechanical Reliability

• The PCB is highly resistant to temperature fluctuations and mechanical stress. The low moisture absorption and high thermal conductivity ensure that the board remains reliable, even in extreme environments.

3. Cost-Effective Manufacturing

• The RO3035 material is compatible with volume manufacturing processes, allowing the board to be produced at an economical price without compromising on quality.

4. Flexibility in Design

• The material’s ability to integrate with other laminates makes it suitable for hybrid multi-layer designs. This flexibility is particularly useful for applications that require varying dielectric constants.

5. Long-Term Durability

• The immersion gold surface finish ensures the board remains corrosion-free and solderable over time, enhancing its overall lifespan.

Applications of the RO3035 2-Layer PCB

The RO3035 2-Layer PCB is ideal for a wide range of high-frequency and high-reliability applications, including:

Automotive Radar Systems

• Used in advanced driver-assistance systems (ADAS) and autonomous vehicles, where precision and reliability are critical.

5G Telecommunications

• Supports power amplifiers, antennas, and massive MIMO systems, enabling faster and more reliable 5G networks.

Satellite Communications

• Ensures reliable signal transmission for GPS systems, direct broadcast satellites, and global positioning satellite antennas.

Wireless Communication Antennas

• Perfect for patch antennas and other wireless communication systems, where low signal loss is essential.

Power Backplanes

• Used in complex electronic systems to ensure efficient and reliable power distribution.

IoT Devices and Remote Meter Readers

• Ideal for IoT applications that require low power loss and high reliability in compact designs.

Why Choose the RO3035 PCB?

The RO3035 2-Layer PCB is an excellent choice for engineers and manufacturers seeking precision, reliability, and high-frequency performance. Its stable material properties, thermal resistance, and cost-effectiveness make it a versatile solution for a wide range of industries. By integrating this PCB into their designs, engineers can ensure consistent performance, even in the most demanding environments.

Conclusion

The RO3035 2-Layer PCB sets a new standard for high-frequency circuit boards. Built with Rogers RO3035 laminates, it combines advanced material properties with precision manufacturing to deliver exceptional performance and reliability. Whether for automotive radar, 5G networks, or satellite systems, this PCB provides engineers with the tools they need to create next-generation designs.

If you’re ready to take your designs to the next level, the RO3035 2-Layer PCB is the perfect solution. Contact us today to learn more or to place an order!