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F4BM220 DK2.2 PCB 2-layer build on 1.575mm Thick with Double Sided 0.5oz copper | Bare copper | OSP

F4BM220 DK2.2 PCB 2-layer build on 1.575mm Thick with Double Sided 0.5oz copper | Bare copper | OSP

MOQ: 1PCS
Price: 1USD/PCS
Delivery Period: 2-10 working day
Payment Method: T/T
Supply Capacity: 10000pcs
Detail Information
Minimum Order Quantity:
1PCS
Price:
1USD/PCS
Delivery Time:
2-10 working day
Payment Terms:
T/T
Supply Ability:
10000pcs
Product Description

Advanced RF Performance in a Compact 2-Layer Design

 

Our newly shipped F4BM220 High-Frequency PCB is engineered for demanding RF and microwave applications, delivering exceptional signal integrity and low-loss performance. Designed for phase-sensitive systems, radar, and satellite communications, this PCB combines Wangling's advanced F4BM220 PTFE-based laminate with precision manufacturing to meet strict performance requirements.

 

 

Key Specifications

  • Base Material: F4BM220 (PTFE/fiberglass composite)
  • Layer Count: 2 layers
  • Dimensions: 130.5mm × 103mm (±0.15mm tolerance)
  • Thickness: 1.7mm (finished)
  • Copper Weight: 1oz (35μm) outer layers
  • Trace/Space: 4/6 mils
  • Min Hole Size: 0.3mm (mechanical drill)
  • Surface Finish: ENIG (Electroless Nickel Immersion Gold)
  • Via Plating: 20μm thickness
  • Testing: 100% electrical test prior to shipment
PCB Capability (F4BME)
PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010
F4BME220 2.20±0.04 0.0010
F4BME233 2.33±0.04 0.0011
F4BME245 2.45±0.05 0.0012
F4BME255 2.55±0.05 0.0013
F4BME265 2.65±0.05 0.0013
F4BME275 2.75±0.05 0.0015
F4BME294 2.94±0.06 0.0016
F4BME300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

Material Advantages (F4BM220)
✅ Ultra-Low Loss:

  • Dielectric Constant (Dk): 2.2 ±0.04 @ 10GHz
  • Dissipation Factor (Df): 0.001 @ 10GHz (superior to standard FR-4)

✅ Thermal & Mechanical Stability:

  • CTE: x/y/z = 25/34/240 ppm/°C
  • Moisture Absorption: ≤0.08% (ideal for harsh environments)
  • Flammability Rating: UL-94 V0

✅ Optimized for RF/Microwave:

  • Low PIM (Passive Intermodulation) risk
  • Excellent phase stability for sensitive antenna systems

 

 

Design Features

  • No Blind Vias – Simplified 2-layer construction for cost efficiency
  • ENIG Surface Finish – Ensures reliable solderability and corrosion resistance
  • High-Precision Fabrication – Tight impedance control (±5%) for RF circuits

 

 

Typical Applications

  • Phase Shifters & Power Dividers – Stable Dk for precise signal control
  • Satellite & Radar Systems – Low loss at high frequencies
  • 5G Base Station Antennas – Enhanced signal integrity
  • Phased Array Antennas – Critical for aerospace/defense

 

 

Why Choose This PCB?
✔ Proven RF Performance – Superior to standard PTFE laminates
✔ Cost-Effective 2-Layer Solution – No unnecessary complexity
✔ Global Availability – Shipped worldwide with IPC-Class 2 compliance

 

Ideal For: Engineers developing compact, high-frequency systems where low loss and stable Dk are non-negotiable.

 

Contact us today for technical datasheets or pricing inquiries!

products
PRODUCTS DETAILS
F4BM220 DK2.2 PCB 2-layer build on 1.575mm Thick with Double Sided 0.5oz copper | Bare copper | OSP
MOQ: 1PCS
Price: 1USD/PCS
Delivery Period: 2-10 working day
Payment Method: T/T
Supply Capacity: 10000pcs
Detail Information
Minimum Order Quantity:
1PCS
Price:
1USD/PCS
Delivery Time:
2-10 working day
Payment Terms:
T/T
Supply Ability:
10000pcs
Product Description

Advanced RF Performance in a Compact 2-Layer Design

 

Our newly shipped F4BM220 High-Frequency PCB is engineered for demanding RF and microwave applications, delivering exceptional signal integrity and low-loss performance. Designed for phase-sensitive systems, radar, and satellite communications, this PCB combines Wangling's advanced F4BM220 PTFE-based laminate with precision manufacturing to meet strict performance requirements.

 

 

Key Specifications

  • Base Material: F4BM220 (PTFE/fiberglass composite)
  • Layer Count: 2 layers
  • Dimensions: 130.5mm × 103mm (±0.15mm tolerance)
  • Thickness: 1.7mm (finished)
  • Copper Weight: 1oz (35μm) outer layers
  • Trace/Space: 4/6 mils
  • Min Hole Size: 0.3mm (mechanical drill)
  • Surface Finish: ENIG (Electroless Nickel Immersion Gold)
  • Via Plating: 20μm thickness
  • Testing: 100% electrical test prior to shipment
PCB Capability (F4BME)
PCB Material: PTFE glass fiber cloth copper clad laminates
Designation (F4BME ) F4BME DK (10GHz) DF (10 GHz)
F4BME217 2.17±0.04 0.0010
F4BME220 2.20±0.04 0.0010
F4BME233 2.33±0.04 0.0011
F4BME245 2.45±0.05 0.0012
F4BME255 2.55±0.05 0.0013
F4BME265 2.65±0.05 0.0013
F4BME275 2.75±0.05 0.0015
F4BME294 2.94±0.06 0.0016
F4BME300 3.00±0.06 0.0017
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness (or overall thickness) 0.127mm (dielectric), 0.2mm, 0.25mm, 0.5mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.5mm, 1.524mm, 1.575mm, 2.0mm, 2.5mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

Material Advantages (F4BM220)
✅ Ultra-Low Loss:

  • Dielectric Constant (Dk): 2.2 ±0.04 @ 10GHz
  • Dissipation Factor (Df): 0.001 @ 10GHz (superior to standard FR-4)

✅ Thermal & Mechanical Stability:

  • CTE: x/y/z = 25/34/240 ppm/°C
  • Moisture Absorption: ≤0.08% (ideal for harsh environments)
  • Flammability Rating: UL-94 V0

✅ Optimized for RF/Microwave:

  • Low PIM (Passive Intermodulation) risk
  • Excellent phase stability for sensitive antenna systems

 

 

Design Features

  • No Blind Vias – Simplified 2-layer construction for cost efficiency
  • ENIG Surface Finish – Ensures reliable solderability and corrosion resistance
  • High-Precision Fabrication – Tight impedance control (±5%) for RF circuits

 

 

Typical Applications

  • Phase Shifters & Power Dividers – Stable Dk for precise signal control
  • Satellite & Radar Systems – Low loss at high frequencies
  • 5G Base Station Antennas – Enhanced signal integrity
  • Phased Array Antennas – Critical for aerospace/defense

 

 

Why Choose This PCB?
✔ Proven RF Performance – Superior to standard PTFE laminates
✔ Cost-Effective 2-Layer Solution – No unnecessary complexity
✔ Global Availability – Shipped worldwide with IPC-Class 2 compliance

 

Ideal For: Engineers developing compact, high-frequency systems where low loss and stable Dk are non-negotiable.

 

Contact us today for technical datasheets or pricing inquiries!

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