18-Layer High-Frequency PCB – RO4350B + RO4450F Stackup for RF/Microwave Applications

18-Layer High-Frequency PCB – RO4350B + RO4450F Stackup for RF/Microwave Applications

The newly shipped 18-layer high-frequency PCB is designed for demanding RF and microwave applications, utilizing Rogers RO4350B laminates and RO4450F bondply to achieve exceptional signal integrity, thermal stability, and low-loss performance. It is intended for mission-critical systems such as cellular base stations, automotive radar, and satellite communications. Compliance with IPC-Class 2 standards is ensured, and rigorous electrical testing is conducted prior to shipment to guarantee reliability.

Key Specifications:

• Materials: Rogers RO4350B (core) and RO4450F (bondply) are used.
• Layer Count: 18 layers are incorporated.
• Board Dimensions: 218 mm × 497 mm (±0.15mm tolerance) are maintained.
• Thickness: A finished thickness of 3.2 mm is achieved.
• Copper Weight: 1 oz (35 μm) is applied to inner and outer layers.
• Trace/Space: 4/4 mils are supported.
• Minimum Hole Size: 0.4 mm is achieved with mechanical drilling.
• Blind Vias: L11–L18 are implemented.
• Surface Finish: Immersion Gold + Selective Hard Gold (50 μinch) is applied.
• Solder Mask: Blue is used on top and bottom layers; white silkscreen is printed.
• Via Treatment: Vias are resin-filled and capped; via-in-pad and press-fit holes are included.
• Testing: 100% electrical testing is performed before shipment.

PCB Specifications

Advanced Material Benefits:
✅ RO4350B Core:

Ultra-low loss is achieved (Dk = 3.48 ±0.05 @ 10 GHz, Df = 0.0037).

High thermal conductivity (0.69 W/m/°K) and Tg >280°C are provided.

CTE is matched to copper (X/Y/Z: 10/12/32 ppm/°C) for reliable plated through-holes.

✅ RO4450F Bondply:

A compatible dielectric (Dk = 3.52 ±0.05) is ensured for multilayer stability.

Superior lateral flow is enabled for high-density interconnects.

Multiple sequential lamination cycles are supported.

Data sheet of Rogers 4350B (RO4350B )

Design and Manufacturing Excellence:
High-Density Interconnects: 632 vias and 779 pads (338 thru-hole, 441 SMT) are integrated.

Controlled Impedance: Tight Dk tolerance is maintained for consistent RF performance.

Robust Construction: Resin-filled vias and press-fit holes are included for mechanical durability.

Typical Applications:

• Cellular base station antennas and power amplifiers
• Automotive radar (77 GHz) and RF sensors
• Satellite LNBs and aerospace systems
• High-speed digital RF designs
• Compliance & Documentation:
• Artwork Format: Gerber RS-274-X is supplied.
• Quality Standard: IPC-Class 2 is adhered to.
• Global Availability: Worldwide shipping is supported.

Why This PCB Is Selected
This PCB is engineered for high-frequency, high-power RF systems, where Rogers’ advanced materials are leveraged to minimize signal loss, enhance thermal management, and ensure long-term reliability in harsh operating conditions.

For customization or volume pricing, inquiries are welcomed.