F4BTMS233 PCB 2.33 Dk 2-layer rigid PCB with Blind vias 40mil 1.016mm Thick used in Aerospace equipment, space and cabin equipment

1. Introduction to F4BTMS
An enhanced iteration of the F4BTM series, the F4BTMS series showcases a breakthrough in technological advancements in material formulation and manufacturing processes. Through the infusion of a substantial amount of ceramics and reinforcement with ultra-thin, ultra-fine glass fiber cloth, the material demonstrates significant enhancements in performance and a wider spectrum of dielectric constants. Tailored for aerospace applications, this high-reliability material presents a viable alternative to comparable international products.

By integrating a minor percentage of ultra-thin, ultra-fine glass fiber cloth and an extensive distribution of specially designed nano-ceramics blended with polytetrafluoroethylene resin, the adverse impacts of glass fiber on electromagnetic wave propagation are minimized. This reduction in dielectric loss, improved dimensional stability, and reduced X/Y/Z anisotropy of the material contribute to an expanded usable frequency range, reinforced electrical strength, and heightened thermal conductivity. Furthermore, the material showcases exceptional characteristics such as low thermal expansion coefficient and consistent dielectric temperature stability.

The F4BTMS series is equipped with RTF low roughness copper foil as a standard component, which diminishes conductor loss and ensures superior peel strength. Compatible with copper or aluminum bases, this material offers a versatile solution for various applications.

2. Features (F4BTMS233)
- Dielectric constant (Dk) of 2.33 at 10GHz
- Dissipation factor of .0010 at 10GHz, 0.0011 at 20GHz
- CTE x-axis of 35 ppm/°C, CTE y-axis of 40 ppm/°C, CTE z-axis of 220 ppm/°C, -55°C to 288°C
- Low thermal coefficient of Dk at-122 ppm/°C, -55°C to 150°C
- UL-94 V0
- Low Moisture absorption of 0.02%

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
F4BTMS233 Core - 1.016 mm (40mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 40mm x 108 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/4 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 1.1mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: OSP
- Top Silkscreen: White
- Bottom Silkscreen: No
- Top Solder Mask: Blue
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 27
Total Pads: 62
Thru Hole Pads: 36
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 41
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- Aerospace equipment, space and cabin equipment
- Microwave, RF
- Radar, military radar
- Feed networks
- Phase-sensitive antennas, phased array antennas
- Satellite communications, and more.