Introducing the Rogers PCB, a groundbreaking advancement in high-performance circuitry designed to elevate electronic projects to new heights. Crafted with proprietary woven glass reinforced hydrocarbon/ceramics, the RO4350B material combines the electrical precision of PTFE/woven glass with the manufacturing ease of epoxy/glass, delivering exceptional quality at a fraction of the cost of traditional microwave laminates.
Key Features:
RO4350B Typical Value
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits:
The RO4350B PCB offers a myriad of benefits, including its suitability for multi-layer board constructions, cost-effective fabrication comparable to FR-4 processes, exceptional dimensional stability, and competitive pricing. With a Tg value exceeding 280°C, this PCB ensures stable expansion characteristics across various circuit processing temperatures, making it ideal for demanding applications.
PCB Specifications:
Our PCB Capability (RO4350B)
PCB Material: | Glass reinforced hydrocarbon ceramic laminates |
Designator: | Rogers RO4350B |
Dielectric constant: | 3.48 ±0.05 (process) |
3.65 (design) | |
Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP,etc. |
Applications:
The versatility of the RO4350B PCB extends to a wide range of applications, including cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites. Its reliability, stability, and performance make it a preferred choice for high-frequency circuit design in various industries.
Quality Standard and Availability:
Adhering to IPC-Class-2 standards, the RO4350B PCB guarantees exceptional quality and reliability. With worldwide availability, this cutting-edge PCB is poised to revolutionize high-frequency circuitry design on a global scale.
Embark on a journey of innovation and excellence with the Rogers RO4350B PCB, where precision meets performance to drive electronic projects to unparalleled success.
Introducing the Rogers PCB, a groundbreaking advancement in high-performance circuitry designed to elevate electronic projects to new heights. Crafted with proprietary woven glass reinforced hydrocarbon/ceramics, the RO4350B material combines the electrical precision of PTFE/woven glass with the manufacturing ease of epoxy/glass, delivering exceptional quality at a fraction of the cost of traditional microwave laminates.
Key Features:
RO4350B Typical Value
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Benefits:
The RO4350B PCB offers a myriad of benefits, including its suitability for multi-layer board constructions, cost-effective fabrication comparable to FR-4 processes, exceptional dimensional stability, and competitive pricing. With a Tg value exceeding 280°C, this PCB ensures stable expansion characteristics across various circuit processing temperatures, making it ideal for demanding applications.
PCB Specifications:
Our PCB Capability (RO4350B)
PCB Material: | Glass reinforced hydrocarbon ceramic laminates |
Designator: | Rogers RO4350B |
Dielectric constant: | 3.48 ±0.05 (process) |
3.65 (design) | |
Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP,etc. |
Applications:
The versatility of the RO4350B PCB extends to a wide range of applications, including cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, and LNB's for direct broadcast satellites. Its reliability, stability, and performance make it a preferred choice for high-frequency circuit design in various industries.
Quality Standard and Availability:
Adhering to IPC-Class-2 standards, the RO4350B PCB guarantees exceptional quality and reliability. With worldwide availability, this cutting-edge PCB is poised to revolutionize high-frequency circuitry design on a global scale.
Embark on a journey of innovation and excellence with the Rogers RO4350B PCB, where precision meets performance to drive electronic projects to unparalleled success.