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F4BTMS615 rigid PCB 2-layer 5.08mm Thick double sided Cu weight with Hot Air Soldering Level (HASL) for Microwave, RF

F4BTMS615 rigid PCB 2-layer 5.08mm Thick double sided Cu weight with Hot Air Soldering Level (HASL) for Microwave, RF

Detail Information
Product Description

 

Introducing the F4BTMS Series PCB: Advanced Material for High-Reliability Aerospace Applications

 

 

Representing a significant leap in technological advancement from the F4BTM series, the F4BTMS series embodies a fusion of innovative material formulation and cutting-edge manufacturing processes. This blend of advanced materials and state-of-the-art production techniques elevates the performance benchmarks and expands the range of dielectric constants available. Positioned as an ideal solution for aerospace applications, the F4BTMS series offers exceptional characteristics and presents a viable alternative to similar products from overseas markets.

 

 

Key Features of F4BTMS615:

  • Exceptional Dielectric Constant (Dk) of 6.15 at 10GHz
  • Ultra-low Dissipation Factor of 0.0020 at 10GHz and 0.0023 at 20GHz
  • Impressive Thermal Conductivity of 0.67 W/mk
  • Negligible Moisture Absorption rate of 0.1%
  • Coefficient of Thermal Expansion (CTE) X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 40 ppm/°C
  • Thermal Coefficient of Dk: -96 ppm/°C
  • Wide Temperature Range from -55°C to 288°C

 

 

 

Detailed PCB Stackup Specifications:

  • Configuration: 2-layer rigid PCB incorporating an F4BTMS615 core
  • Copper Layer Thickness: 35 μm
  • Core Thickness: 5.08 mm (200mil)

 

PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.
Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz)
F4BTMS220 2.2±0.02 0.0009
F4BTMS233 2.33±0.03 0.0010
F4BTMS255 2.55±0.04 0.0012
F4BTMS265 2.65±0.04 0.0012
F4BTMS294 2.94±0.04 0.0012
F4BTMS300 3.0±0.04 0.0013
F4BTMS350 3.5±0.05 0.0016
F4BTMS430 4.3±0.09 0.0015
F4BTMS450 4.5±0.09 0.0015
F4BTMS615 6.15±0.12 0.0020
F4BTMS1000 10.2±0.2 0.0020
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

 

Comprehensive PCB Construction Details:

  • Board Dimensions: 92.32mm x 31.5mm
  • Minimum Trace/Space: 5/5 mils
  • Minimum Hole Size: 0.5mm
  • Finished Board Thickness: 5.2mm
  • Copper Weight: 1oz on outer layers
  • Via Plating Thickness: 20 μm
  • Surface Finish: Hot Air Solder Level (HASL)

 

 

 

In-depth PCB Statistics:

  • Components Integrated: 20
  • Total Pads: 35
  • Thru Hole Pads: 21
  • Top SMT Pads: 14
  • Bottom SMT Pads: 0
  • Vias Utilized: 37
  • Total Nets: 2

 

 

 

Adherence to Artwork & Quality Standards:

  • Artwork Format: Gerber RS-274-X
  • Quality Standard Compliance: IPC-Class-2

 

 

 

Versatile Applications Spectrum:

  • Aerospace Equipment Utilization
  • Advanced Microwave & RF Technologies
  • Integration with Radar Systems
  • Support for Feed Networks
  • Empowerment of Phased Array Antennas
  • Facilitation of Satellite Communication Systems

 

 

 

Global Availability and Support:
Experience the unparalleled performance and reliability of the F4BTMS series PCB, meticulously designed to meet the stringent demands of critical aerospace applications and beyond. For further information and to secure this state-of-the-art PCB solution, please reach out to our team.

 

 

 

Q: What makes the F4BTMS series stand out for aerospace applications?

A: The F4BTMS series offers exceptional dielectric properties, thermal conductivity, and reliability, making it an ideal choice for aerospace equipment where performance and durability are crucial.

 

 

Q: Can the F4BTMS series PCBs be customized for specific radar system requirements?

A: Yes, the F4BTMS series PCBs can be tailored to meet the specific needs of radar systems, ensuring optimal performance and compatibility.

 

 

Q: How does the F4BTMS series compare to other similar products in the market?

A: The F4BTMS series provides superior characteristics and reliability compared to many foreign products, making it a cost-effective and high-performance solution for aerospace and communication applications.

 

F4BTMS615 rigid PCB 2-layer 5.08mm Thick double sided Cu weight with Hot Air Soldering Level (HASL) for Microwave, RF 0

 

products
PRODUCTS DETAILS
F4BTMS615 rigid PCB 2-layer 5.08mm Thick double sided Cu weight with Hot Air Soldering Level (HASL) for Microwave, RF
Detail Information
Product Description

 

Introducing the F4BTMS Series PCB: Advanced Material for High-Reliability Aerospace Applications

 

 

Representing a significant leap in technological advancement from the F4BTM series, the F4BTMS series embodies a fusion of innovative material formulation and cutting-edge manufacturing processes. This blend of advanced materials and state-of-the-art production techniques elevates the performance benchmarks and expands the range of dielectric constants available. Positioned as an ideal solution for aerospace applications, the F4BTMS series offers exceptional characteristics and presents a viable alternative to similar products from overseas markets.

 

 

Key Features of F4BTMS615:

  • Exceptional Dielectric Constant (Dk) of 6.15 at 10GHz
  • Ultra-low Dissipation Factor of 0.0020 at 10GHz and 0.0023 at 20GHz
  • Impressive Thermal Conductivity of 0.67 W/mk
  • Negligible Moisture Absorption rate of 0.1%
  • Coefficient of Thermal Expansion (CTE) X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 40 ppm/°C
  • Thermal Coefficient of Dk: -96 ppm/°C
  • Wide Temperature Range from -55°C to 288°C

 

 

 

Detailed PCB Stackup Specifications:

  • Configuration: 2-layer rigid PCB incorporating an F4BTMS615 core
  • Copper Layer Thickness: 35 μm
  • Core Thickness: 5.08 mm (200mil)

 

PCB Material: PTFE,Ultra-thin and ultra-fine fiberglass, ceramics.
Designation (F4BTMS ) F4BTMS DK (10GHz) DF (10 GHz)
F4BTMS220 2.2±0.02 0.0009
F4BTMS233 2.33±0.03 0.0010
F4BTMS255 2.55±0.04 0.0012
F4BTMS265 2.65±0.04 0.0012
F4BTMS294 2.94±0.04 0.0012
F4BTMS300 3.0±0.04 0.0013
F4BTMS350 3.5±0.05 0.0016
F4BTMS430 4.3±0.09 0.0015
F4BTMS450 4.5±0.09 0.0015
F4BTMS615 6.15±0.12 0.0020
F4BTMS1000 10.2±0.2 0.0020
Layer count: Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Dielectric thickness 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

 

Comprehensive PCB Construction Details:

  • Board Dimensions: 92.32mm x 31.5mm
  • Minimum Trace/Space: 5/5 mils
  • Minimum Hole Size: 0.5mm
  • Finished Board Thickness: 5.2mm
  • Copper Weight: 1oz on outer layers
  • Via Plating Thickness: 20 μm
  • Surface Finish: Hot Air Solder Level (HASL)

 

 

 

In-depth PCB Statistics:

  • Components Integrated: 20
  • Total Pads: 35
  • Thru Hole Pads: 21
  • Top SMT Pads: 14
  • Bottom SMT Pads: 0
  • Vias Utilized: 37
  • Total Nets: 2

 

 

 

Adherence to Artwork & Quality Standards:

  • Artwork Format: Gerber RS-274-X
  • Quality Standard Compliance: IPC-Class-2

 

 

 

Versatile Applications Spectrum:

  • Aerospace Equipment Utilization
  • Advanced Microwave & RF Technologies
  • Integration with Radar Systems
  • Support for Feed Networks
  • Empowerment of Phased Array Antennas
  • Facilitation of Satellite Communication Systems

 

 

 

Global Availability and Support:
Experience the unparalleled performance and reliability of the F4BTMS series PCB, meticulously designed to meet the stringent demands of critical aerospace applications and beyond. For further information and to secure this state-of-the-art PCB solution, please reach out to our team.

 

 

 

Q: What makes the F4BTMS series stand out for aerospace applications?

A: The F4BTMS series offers exceptional dielectric properties, thermal conductivity, and reliability, making it an ideal choice for aerospace equipment where performance and durability are crucial.

 

 

Q: Can the F4BTMS series PCBs be customized for specific radar system requirements?

A: Yes, the F4BTMS series PCBs can be tailored to meet the specific needs of radar systems, ensuring optimal performance and compatibility.

 

 

Q: How does the F4BTMS series compare to other similar products in the market?

A: The F4BTMS series provides superior characteristics and reliability compared to many foreign products, making it a cost-effective and high-performance solution for aerospace and communication applications.

 

F4BTMS615 rigid PCB 2-layer 5.08mm Thick double sided Cu weight with Hot Air Soldering Level (HASL) for Microwave, RF 0

 

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