Step into the realm of cutting-edge PCB technology with Bicheng Co., Ltd's 370HR PCB – a high-performance solution designed to exceed industry standards and elevate your electronic projects to new heights. Our 6-layer board with a 1.6mm thickness is meticulously crafted using ISOLA 370HR laminates and prepregs, developed by Polyclad, to deliver unparalleled thermal performance and reliability.
The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance. With properties that include a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.
Key Features of 370HR PCB:
What makes the ISOLA 370HR material stand out?
The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance.
How does the 370HR PCB ensure optimal performance?
With properties like a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.
What are the key properties of the 370HR PCB?
PCB Construction Details:
Construction Details | Specifications |
Board Dimensions | 40mm x 55 mm=1 PCS, +/- 0.15mm |
Minimum Trace/Space | 4/4 mils |
Minimum Hole Size | 0.2mm |
Via in Pad and Under BGA | Filled and Capped |
Finished Board Thickness | 1.6mm |
Finished Cu Weight | 1 oz (1.4 mils) all layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold |
Top Silkscreen | White |
Bottom Silkscreen | White |
Top Solder Mask | Green |
Bottom Solder Mask | Green |
Single End Impedance Control | 50 ohm and 100 ohm of 5mil and 7mil on top layer |
Electrical Test | 100% Electrical Test Used |
Board Construction
Why choose Bicheng Co., Ltd's 370HR PCB for your electronic projects?
Our 6-layer PCB stackup for the 370HR PCB is meticulously designed, featuring specific layer thicknesses and layout to ensure precise performance. Each board undergoes a 100% Electrical test prior to shipment, guaranteeing reliability and performance.
Where can the 370HR PCB be used?
Ideal for a wide range of applications, including Computing, Consumer Electronics, Networking, Medical, Automotive, Aerospace, and Defense, our 370HR PCB is available worldwide.
Typical Values Table
Property | Typical Value | Units | Test Method | ||||||||||
Metric (English) | IPC-TM-650 (or as noted) | ||||||||||||
Glass Transition Temperature (Tg) by DSC | 180 | °C | 2.4.25C | ||||||||||
Decomposition Temperature (Td) by TGA @ 5% weight loss | 340 | °C | 2.4.24.6 | ||||||||||
Time to Delaminate by TMA (Copper removed) |
A. T260 B. T288 |
60 30 |
Minutes | 2.4.24.1 | |||||||||
Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) |
45 230 2.8 |
ppm/°C ppm/°C % |
2.4.24C | |||||||||
X/Y-Axis CTE | Pre-Tg | 13/14 | ppm/°C | 2.4.24C | |||||||||
Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 | ||||||||||
Thermal Stress 10 sec @ 288ºC (550.4ºF) |
A. Unetched B. Etched |
Pass | Pass Visual | 2.4.13.1 | |||||||||
Dk, Permittivity | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz |
4.24 4.17 4.04 3.92 3.92 |
— | 2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline |
|||||||||
Df, Loss Tangent | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz |
0.0150 0.0161 0.0210 0.0250 0.0250 |
— — — |
2.5.5.3 2.5.5.9 Bereskin Stripline 2.5.5.5 2.5.5.5 |
|||||||||
Volume Resistivity | A. After moisture resistance B. At elevated temperature |
3.0 x 108 7.0 x 108 |
MΩ-cm | 2.5.17.1 | |||||||||
Surface Resistivity | A. After moisture resistance B. At elevated temperature |
3.0 x 106 2.0 x 108 |
MΩ | 2.5.17.1 | |||||||||
Dielectric Breakdown | >50 | kV | 2.5.6B | ||||||||||
Arc Resistance | 115 | Seconds | 2.5.1B | ||||||||||
Electric Strength (Laminate & laminated prepreg) | 54 (1350) | kV/mm (V/mil) | 2.5.6.2A | ||||||||||
Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 |
||||||||||
Peel Strength | A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions |
1.14 (6.5) 1.25 (7.0) 1.25 (7.0) 1.14 (6.5) |
N/mm (lb/inch) | 2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3 |
|||||||||
Flexural Strength | A. Length direction B. Cross direction |
620 (90.0) 531 (77.0) |
MPa (kpsi) | 2.4.4B | |||||||||
Tensile Strength | A. Length direction B. Cross direction |
385 (55.9) 245 (35.6) |
MPa (kpsi) | ASTM D3039 | |||||||||
Young's Modulus | A. Length direction B. Cross direction |
3744 3178 |
ksi | ASTM D790-15e2 | |||||||||
Poisson's Ratio | A. Length direction B. Cross direction |
0.177 0.171 |
— | ASTM D3039 | |||||||||
Moisture Absorption | 0.15 | % | 2.6.2.1A | ||||||||||
Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | ||||||||||
Relative Thermal Index (RTI) | 130 | °C | UL 796 |
Want to learn more or place an order?
For technical inquiries or to place an order, contact Sally at sales30@bichengpcb.com. Experience the excellence of Bicheng Co., Ltd's 370HR PCB and take your electronic projects to the next level with unmatched performance and reliability.
Step into the realm of cutting-edge PCB technology with Bicheng Co., Ltd's 370HR PCB – a high-performance solution designed to exceed industry standards and elevate your electronic projects to new heights. Our 6-layer board with a 1.6mm thickness is meticulously crafted using ISOLA 370HR laminates and prepregs, developed by Polyclad, to deliver unparalleled thermal performance and reliability.
The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance. With properties that include a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.
Key Features of 370HR PCB:
What makes the ISOLA 370HR material stand out?
The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance.
How does the 370HR PCB ensure optimal performance?
With properties like a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.
What are the key properties of the 370HR PCB?
PCB Construction Details:
Construction Details | Specifications |
Board Dimensions | 40mm x 55 mm=1 PCS, +/- 0.15mm |
Minimum Trace/Space | 4/4 mils |
Minimum Hole Size | 0.2mm |
Via in Pad and Under BGA | Filled and Capped |
Finished Board Thickness | 1.6mm |
Finished Cu Weight | 1 oz (1.4 mils) all layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold |
Top Silkscreen | White |
Bottom Silkscreen | White |
Top Solder Mask | Green |
Bottom Solder Mask | Green |
Single End Impedance Control | 50 ohm and 100 ohm of 5mil and 7mil on top layer |
Electrical Test | 100% Electrical Test Used |
Board Construction
Why choose Bicheng Co., Ltd's 370HR PCB for your electronic projects?
Our 6-layer PCB stackup for the 370HR PCB is meticulously designed, featuring specific layer thicknesses and layout to ensure precise performance. Each board undergoes a 100% Electrical test prior to shipment, guaranteeing reliability and performance.
Where can the 370HR PCB be used?
Ideal for a wide range of applications, including Computing, Consumer Electronics, Networking, Medical, Automotive, Aerospace, and Defense, our 370HR PCB is available worldwide.
Typical Values Table
Property | Typical Value | Units | Test Method | ||||||||||
Metric (English) | IPC-TM-650 (or as noted) | ||||||||||||
Glass Transition Temperature (Tg) by DSC | 180 | °C | 2.4.25C | ||||||||||
Decomposition Temperature (Td) by TGA @ 5% weight loss | 340 | °C | 2.4.24.6 | ||||||||||
Time to Delaminate by TMA (Copper removed) |
A. T260 B. T288 |
60 30 |
Minutes | 2.4.24.1 | |||||||||
Z-Axis CTE | A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion) |
45 230 2.8 |
ppm/°C ppm/°C % |
2.4.24C | |||||||||
X/Y-Axis CTE | Pre-Tg | 13/14 | ppm/°C | 2.4.24C | |||||||||
Thermal Conductivity | 0.4 | W/m·K | ASTM E1952 | ||||||||||
Thermal Stress 10 sec @ 288ºC (550.4ºF) |
A. Unetched B. Etched |
Pass | Pass Visual | 2.4.13.1 | |||||||||
Dk, Permittivity | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz |
4.24 4.17 4.04 3.92 3.92 |
— | 2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline |
|||||||||
Df, Loss Tangent | A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz |
0.0150 0.0161 0.0210 0.0250 0.0250 |
— — — |
2.5.5.3 2.5.5.9 Bereskin Stripline 2.5.5.5 2.5.5.5 |
|||||||||
Volume Resistivity | A. After moisture resistance B. At elevated temperature |
3.0 x 108 7.0 x 108 |
MΩ-cm | 2.5.17.1 | |||||||||
Surface Resistivity | A. After moisture resistance B. At elevated temperature |
3.0 x 106 2.0 x 108 |
MΩ | 2.5.17.1 | |||||||||
Dielectric Breakdown | >50 | kV | 2.5.6B | ||||||||||
Arc Resistance | 115 | Seconds | 2.5.1B | ||||||||||
Electric Strength (Laminate & laminated prepreg) | 54 (1350) | kV/mm (V/mil) | 2.5.6.2A | ||||||||||
Comparative Tracking Index (CTI) | 3 (175-249) | Class (Volts) | UL 746A ASTM D3638 |
||||||||||
Peel Strength | A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions |
1.14 (6.5) 1.25 (7.0) 1.25 (7.0) 1.14 (6.5) |
N/mm (lb/inch) | 2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3 |
|||||||||
Flexural Strength | A. Length direction B. Cross direction |
620 (90.0) 531 (77.0) |
MPa (kpsi) | 2.4.4B | |||||||||
Tensile Strength | A. Length direction B. Cross direction |
385 (55.9) 245 (35.6) |
MPa (kpsi) | ASTM D3039 | |||||||||
Young's Modulus | A. Length direction B. Cross direction |
3744 3178 |
ksi | ASTM D790-15e2 | |||||||||
Poisson's Ratio | A. Length direction B. Cross direction |
0.177 0.171 |
— | ASTM D3039 | |||||||||
Moisture Absorption | 0.15 | % | 2.6.2.1A | ||||||||||
Flammability (Laminate & laminated prepreg) | V-0 | Rating | UL 94 | ||||||||||
Relative Thermal Index (RTI) | 130 | °C | UL 796 |
Want to learn more or place an order?
For technical inquiries or to place an order, contact Sally at sales30@bichengpcb.com. Experience the excellence of Bicheng Co., Ltd's 370HR PCB and take your electronic projects to the next level with unmatched performance and reliability.