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ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin

ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin

Detail Information
Product Description

 

 

Step into the realm of cutting-edge PCB technology with Bicheng Co., Ltd's 370HR PCB – a high-performance solution designed to exceed industry standards and elevate your electronic projects to new heights. Our 6-layer board with a 1.6mm thickness is meticulously crafted using ISOLA 370HR laminates and prepregs, developed by Polyclad, to deliver unparalleled thermal performance and reliability.

 

The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance. With properties that include a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.

 

 

Key Features of 370HR PCB:

 

What makes the ISOLA 370HR material stand out?
The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance.

 

 

How does the 370HR PCB ensure optimal performance?
With properties like a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.

 

 

What are the key properties of the 370HR PCB?

  • High thermal reliability and CAF resistance
  • Low CTE for optimal performance
  • Superior dielectric properties with low DK and Df values
  • High-density interconnect for seamless signal transmission
  • Flame-retardant properties with a UL94-V0 rating

 

 

 

 

PCB Construction Details:

Construction Details Specifications
Board Dimensions 40mm x 55 mm=1 PCS, +/- 0.15mm
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.2mm
Via in Pad and Under BGA Filled and Capped
Finished Board Thickness 1.6mm
Finished Cu Weight 1 oz (1.4 mils) all layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Green
Bottom Solder Mask Green
Single End Impedance Control 50 ohm and 100 ohm of 5mil and 7mil on top layer
Electrical Test 100% Electrical Test Used

 

 

Board Construction

ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin 0

 

Why choose Bicheng Co., Ltd's 370HR PCB for your electronic projects?
Our 6-layer PCB stackup for the 370HR PCB is meticulously designed, featuring specific layer thicknesses and layout to ensure precise performance. Each board undergoes a 100% Electrical test prior to shipment, guaranteeing reliability and performance.

 

 

Where can the 370HR PCB be used?
Ideal for a wide range of applications, including Computing, Consumer Electronics, Networking, Medical, Automotive, Aerospace, and Defense, our 370HR PCB is available worldwide.

 

 

Typical Values Table

Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 340 °C 2.4.24.6
Time to Delaminate by TMA
(Copper removed)
A. T260
B. T288
60
30
Minutes 2.4.24.1
Z-Axis CTE A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @
288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.24
4.17
4.04
3.92
3.92
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0161
0.0210
0.0250
0.0250


2.5.5.3
2.5.5.9
Bereskin Stripline
2.5.5.5
2.5.5.5
Volume Resistivity A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm 2.5.17.1
Surface Resistivity A. After moisture resistance
B. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 115 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 54 (1350) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength A. Low profile copper foil and very low profile
copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
1. After thermal stress
2. At 125ºC (257ºF)
3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch) 2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength A. Length direction
B. Cross direction
620 (90.0)
531 (77.0)
MPa (kpsi) 2.4.4B
Tensile Strength A. Length direction
B. Cross direction
385 (55.9)
245 (35.6)
MPa (kpsi) ASTM D3039
Young's Modulus A. Length direction
B. Cross direction
3744
3178
ksi ASTM D790-15e2
Poisson's Ratio A. Length direction
B. Cross direction
0.177
0.171
ASTM D3039
Moisture Absorption 0.15 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796

 

 

Want to learn more or place an order?
For technical inquiries or to place an order, contact Sally at sales30@bichengpcb.com. Experience the excellence of Bicheng Co., Ltd's 370HR PCB and take your electronic projects to the next level with unmatched performance and reliability.

 

 

ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin 1

 

products
PRODUCTS DETAILS
ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin
Detail Information
Product Description

 

 

Step into the realm of cutting-edge PCB technology with Bicheng Co., Ltd's 370HR PCB – a high-performance solution designed to exceed industry standards and elevate your electronic projects to new heights. Our 6-layer board with a 1.6mm thickness is meticulously crafted using ISOLA 370HR laminates and prepregs, developed by Polyclad, to deliver unparalleled thermal performance and reliability.

 

The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance. With properties that include a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.

 

 

Key Features of 370HR PCB:

 

What makes the ISOLA 370HR material stand out?
The ISOLA 370HR material features a patented high-performance 180°C Tg FR-4 epoxy resin system, offering exceptional thermal reliability and superior Conductive Anodic Filament (CAF) resistance.

 

 

How does the 370HR PCB ensure optimal performance?
With properties like a Glass Transition Temperature (Tg) of 180°C, low Coefficient of Thermal Expansion (CTE), and outstanding mechanical, chemical, and moisture resistance, the 370HR PCB sets a new standard in PCB technology.

 

 

What are the key properties of the 370HR PCB?

  • High thermal reliability and CAF resistance
  • Low CTE for optimal performance
  • Superior dielectric properties with low DK and Df values
  • High-density interconnect for seamless signal transmission
  • Flame-retardant properties with a UL94-V0 rating

 

 

 

 

PCB Construction Details:

Construction Details Specifications
Board Dimensions 40mm x 55 mm=1 PCS, +/- 0.15mm
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.2mm
Via in Pad and Under BGA Filled and Capped
Finished Board Thickness 1.6mm
Finished Cu Weight 1 oz (1.4 mils) all layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen White
Top Solder Mask Green
Bottom Solder Mask Green
Single End Impedance Control 50 ohm and 100 ohm of 5mil and 7mil on top layer
Electrical Test 100% Electrical Test Used

 

 

Board Construction

ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin 0

 

Why choose Bicheng Co., Ltd's 370HR PCB for your electronic projects?
Our 6-layer PCB stackup for the 370HR PCB is meticulously designed, featuring specific layer thicknesses and layout to ensure precise performance. Each board undergoes a 100% Electrical test prior to shipment, guaranteeing reliability and performance.

 

 

Where can the 370HR PCB be used?
Ideal for a wide range of applications, including Computing, Consumer Electronics, Networking, Medical, Automotive, Aerospace, and Defense, our 370HR PCB is available worldwide.

 

 

Typical Values Table

Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 340 °C 2.4.24.6
Time to Delaminate by TMA
(Copper removed)
A. T260
B. T288
60
30
Minutes 2.4.24.1
Z-Axis CTE A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @
288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
4.24
4.17
4.04
3.92
3.92
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0150
0.0161
0.0210
0.0250
0.0250


2.5.5.3
2.5.5.9
Bereskin Stripline
2.5.5.5
2.5.5.5
Volume Resistivity A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm 2.5.17.1
Surface Resistivity A. After moisture resistance
B. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 115 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 54 (1350) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 (175-249) Class (Volts) UL 746A
ASTM D3638
Peel Strength A. Low profile copper foil and very low profile
copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
1. After thermal stress
2. At 125ºC (257ºF)
3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch) 2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength A. Length direction
B. Cross direction
620 (90.0)
531 (77.0)
MPa (kpsi) 2.4.4B
Tensile Strength A. Length direction
B. Cross direction
385 (55.9)
245 (35.6)
MPa (kpsi) ASTM D3039
Young's Modulus A. Length direction
B. Cross direction
3744
3178
ksi ASTM D790-15e2
Poisson's Ratio A. Length direction
B. Cross direction
0.177
0.171
ASTM D3039
Moisture Absorption 0.15 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796

 

 

Want to learn more or place an order?
For technical inquiries or to place an order, contact Sally at sales30@bichengpcb.com. Experience the excellence of Bicheng Co., Ltd's 370HR PCB and take your electronic projects to the next level with unmatched performance and reliability.

 

 

ISOLA 370HR PCB 6-layer 1.6mm thickness with laminates and prepregs with ENIG,Immersion silver,tin 1

 

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