Unveiling the Innovation of Rogers RO3203 High-Frequency PCBs: A Detailed Exploration of 2-Layer 20mil Thickness Circuit Boards
Introduction:
Step into the world of high-frequency circuit materials with the Rogers RO3203 PCB, an advanced ceramic-filled laminate that seamlessly combines exceptional electrical performance with unmatched mechanical stability. As an extension of the esteemed RO3000 Series, the RO3203 offers enhanced rigidity and reliability, with a dielectric constant of 3.02 and a dissipation factor of 0.0016, pushing the boundaries of frequency capabilities beyond 40 GHz.
Features and Benefits:
PCB Construction Details:
RO3203 Typical Value
Property | RO3203 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.02±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Dissipation Factor,tanδ | 0.0016 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Conductivity | 0.47 (3.2) | W/mK | Float 100℃ | ASTM C518 | |
Volume Resistivity | 107 | MΩ.cm | A | ASTM D257 | |
Surface Resistivity | 107 | MΩ | A | ASTM D257 | |
Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
Tensile Modulus | X Y | kpsi | RT | ASTM D638 | |
Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
Moisure Absorption | <0.1 | % | D24/23 | IPC-TM-650 2.6.2.1 | |
Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
Td | 500 | ℃ | TGA | ASTM D3850 | |
Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
Copper Peel Stength | 10 (1.74) | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes |
PCB Statistics and Quality Standards:
PCB Capability (RO3203)
PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: | RO3203 |
Dielectric constant: | 3.02±0.04 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Typical Applications:
Conclusion:
The Rogers RO3203 PCB stands as a pinnacle of high-frequency circuit design, offering unparalleled performance, reliability, and versatility across a myriad of applications. With a focus on advanced technology and precision engineering, the RO3203 sets a new standard for high-frequency PCBs, catering to the evolving needs of industries worldwide.
Unveiling the Innovation of Rogers RO3203 High-Frequency PCBs: A Detailed Exploration of 2-Layer 20mil Thickness Circuit Boards
Introduction:
Step into the world of high-frequency circuit materials with the Rogers RO3203 PCB, an advanced ceramic-filled laminate that seamlessly combines exceptional electrical performance with unmatched mechanical stability. As an extension of the esteemed RO3000 Series, the RO3203 offers enhanced rigidity and reliability, with a dielectric constant of 3.02 and a dissipation factor of 0.0016, pushing the boundaries of frequency capabilities beyond 40 GHz.
Features and Benefits:
PCB Construction Details:
RO3203 Typical Value
Property | RO3203 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.02±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Dissipation Factor,tanδ | 0.0016 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Conductivity | 0.47 (3.2) | W/mK | Float 100℃ | ASTM C518 | |
Volume Resistivity | 107 | MΩ.cm | A | ASTM D257 | |
Surface Resistivity | 107 | MΩ | A | ASTM D257 | |
Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
Tensile Modulus | X Y | kpsi | RT | ASTM D638 | |
Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
Moisure Absorption | <0.1 | % | D24/23 | IPC-TM-650 2.6.2.1 | |
Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
Td | 500 | ℃ | TGA | ASTM D3850 | |
Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
Copper Peel Stength | 10 (1.74) | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes |
PCB Statistics and Quality Standards:
PCB Capability (RO3203)
PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: | RO3203 |
Dielectric constant: | 3.02±0.04 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Typical Applications:
Conclusion:
The Rogers RO3203 PCB stands as a pinnacle of high-frequency circuit design, offering unparalleled performance, reliability, and versatility across a myriad of applications. With a focus on advanced technology and precision engineering, the RO3203 sets a new standard for high-frequency PCBs, catering to the evolving needs of industries worldwide.