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Rogers RO3203 High-Frequency PCBs 2-Layer 20mil Thickness Circuit Boards DK 3.02 with Immersion Tin apply for for wireless communications

Rogers RO3203 High-Frequency PCBs 2-Layer 20mil Thickness Circuit Boards DK 3.02 with Immersion Tin apply for for wireless communications

Detail Information
Product Description

Unveiling the Innovation of Rogers RO3203 High-Frequency PCBs: A Detailed Exploration of 2-Layer 20mil Thickness Circuit Boards

 

Introduction:
Step into the world of high-frequency circuit materials with the Rogers RO3203 PCB, an advanced ceramic-filled laminate that seamlessly combines exceptional electrical performance with unmatched mechanical stability. As an extension of the esteemed RO3000 Series, the RO3203 offers enhanced rigidity and reliability, with a dielectric constant of 3.02 and a dissipation factor of 0.0016, pushing the boundaries of frequency capabilities beyond 40 GHz.

 

 

Features and Benefits:

  • Ceramic-filled PTFE composites ensure superior performance
  • Dielectric constant of 3.02 and dissipation factor of 0.0016 for high-frequency applications
  • Improved rigidity with woven glass reinforcement
  • Uniform electrical and mechanical performance for complex structures
  • Low dielectric loss suitable for applications exceeding 20 GHz
  • Low in-plane expansion coefficient for compatibility with copper
  • Excellent dimensional stability and cost-effective manufacturing
  • Surface smoothness allows for fine line etching tolerances

 

 

PCB Construction Details:

  • 2-layer rigid PCB stackup with copper layers and 20mil Rogers RO3203 substrate
  • Board dimensions: 65.78mm x 37.48mm
  • Minimum Trace/Space: 5/5 mils
  • Finished board thickness: 0.6mm with immersion tin surface finish
  • 100% Electrical test conducted prior to shipment

 

 

RO3203 Typical Value

Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100 ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/ -50 to 288 ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23 ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 

 

PCB Statistics and Quality Standards:

  • 10 components, 34 pads, and 29 vias for intricate design
  • Compliant with IPC-Class-2 quality standards
  • Accepts Gerber RS-274-X artwork and available worldwide

 

 

 

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

 

 

Typical Applications:

  • Automotive collision avoidance systems
  • Wireless telecommunications infrastructure
  • Microstrip patch antennas for wireless communications
  • Direct broadcast satellites
  • Power backplanes and LMDS for broadband applications

 

 

Conclusion:
The Rogers RO3203 PCB stands as a pinnacle of high-frequency circuit design, offering unparalleled performance, reliability, and versatility across a myriad of applications. With a focus on advanced technology and precision engineering, the RO3203 sets a new standard for high-frequency PCBs, catering to the evolving needs of industries worldwide.

products
PRODUCTS DETAILS
Rogers RO3203 High-Frequency PCBs 2-Layer 20mil Thickness Circuit Boards DK 3.02 with Immersion Tin apply for for wireless communications
Detail Information
Product Description

Unveiling the Innovation of Rogers RO3203 High-Frequency PCBs: A Detailed Exploration of 2-Layer 20mil Thickness Circuit Boards

 

Introduction:
Step into the world of high-frequency circuit materials with the Rogers RO3203 PCB, an advanced ceramic-filled laminate that seamlessly combines exceptional electrical performance with unmatched mechanical stability. As an extension of the esteemed RO3000 Series, the RO3203 offers enhanced rigidity and reliability, with a dielectric constant of 3.02 and a dissipation factor of 0.0016, pushing the boundaries of frequency capabilities beyond 40 GHz.

 

 

Features and Benefits:

  • Ceramic-filled PTFE composites ensure superior performance
  • Dielectric constant of 3.02 and dissipation factor of 0.0016 for high-frequency applications
  • Improved rigidity with woven glass reinforcement
  • Uniform electrical and mechanical performance for complex structures
  • Low dielectric loss suitable for applications exceeding 20 GHz
  • Low in-plane expansion coefficient for compatibility with copper
  • Excellent dimensional stability and cost-effective manufacturing
  • Surface smoothness allows for fine line etching tolerances

 

 

PCB Construction Details:

  • 2-layer rigid PCB stackup with copper layers and 20mil Rogers RO3203 substrate
  • Board dimensions: 65.78mm x 37.48mm
  • Minimum Trace/Space: 5/5 mils
  • Finished board thickness: 0.6mm with immersion tin surface finish
  • 100% Electrical test conducted prior to shipment

 

 

RO3203 Typical Value

Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100 ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/ -50 to 288 ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23 ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 

 

PCB Statistics and Quality Standards:

  • 10 components, 34 pads, and 29 vias for intricate design
  • Compliant with IPC-Class-2 quality standards
  • Accepts Gerber RS-274-X artwork and available worldwide

 

 

 

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

 

 

Typical Applications:

  • Automotive collision avoidance systems
  • Wireless telecommunications infrastructure
  • Microstrip patch antennas for wireless communications
  • Direct broadcast satellites
  • Power backplanes and LMDS for broadband applications

 

 

Conclusion:
The Rogers RO3203 PCB stands as a pinnacle of high-frequency circuit design, offering unparalleled performance, reliability, and versatility across a myriad of applications. With a focus on advanced technology and precision engineering, the RO3203 sets a new standard for high-frequency PCBs, catering to the evolving needs of industries worldwide.

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