Unveiling the Power and Versatility of Rogers RO3006 High-Frequency PCBs
Introduction: Revolutionizing High-Frequency PCB Technology with RO3006
In the realm of high-frequency printed circuit boards (PCBs), Rogers RO3006 laminates stand out as a technological marvel, offering unparalleled electrical and mechanical stability. These ceramic-filled PTFE composites have redefined the standards of high-frequency PCB design by maintaining a stable dielectric constant (Dk) across a broad range of temperatures, setting them apart from conventional PTFE glass materials.
Rogers RO3006: The Epitome of High-Frequency PCB Excellence
At the heart of RO3006's excellence are its exceptional features and benefits, setting a new benchmark for high-frequency laminates. With a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C and an impressively low dissipation factor of 0.002 at the same frequency and temperature, RO3006 delivers superior performance in demanding high-frequency applications. Furthermore, its high thermal conductivity of 0.79 W/mK, thermal decomposition temperature (Td) exceeding 500°C, and minimal moisture absorption rate of 0.02% make RO3006 a robust and reliable choice for critical electronic environments.
Features and Benefits: A Closer Look at the Superiority of RO3006
One of the key advantages of RO3006 lies in its uniform mechanical properties, making it an ideal choice for multi-layer board designs with varying dielectric constants. The laminate's low in-plane expansion coefficient ensures reliable surface-mounted assemblies, excellent dimensional stability, and compatibility with epoxy glass multi-layer board hybrid designs. Additionally, the volume manufacturing process employed in producing RO3006 laminates results in cost-effective pricing, making it an economical yet high-performance solution for high-frequency PCB applications.
PCB Construction details:
Parameter | Value |
Board Dimensions | 63.44mm x 48.5mm (2PCS) |
Minimum Trace/Space | 4/4 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | No |
Finished Board Thickness | 0.3mm |
Finished Cu Weight | 1 oz (1.4 mils) outer layers |
Via Plating Thickness | 20 um |
Surface Finish | Immersion Gold |
Top Silkscreen | Black |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Electrical Test | 100% prior to shipment |
Some Typical Applications:
A list of typical applications for RO3006 PCBs is provided, showcasing the diverse industries and technologies where these high-frequency laminates excel, including automotive radar, satellite communications, telecommunications, and wireless systems.
Unveiling the Power and Versatility of Rogers RO3006 High-Frequency PCBs
Introduction: Revolutionizing High-Frequency PCB Technology with RO3006
In the realm of high-frequency printed circuit boards (PCBs), Rogers RO3006 laminates stand out as a technological marvel, offering unparalleled electrical and mechanical stability. These ceramic-filled PTFE composites have redefined the standards of high-frequency PCB design by maintaining a stable dielectric constant (Dk) across a broad range of temperatures, setting them apart from conventional PTFE glass materials.
Rogers RO3006: The Epitome of High-Frequency PCB Excellence
At the heart of RO3006's excellence are its exceptional features and benefits, setting a new benchmark for high-frequency laminates. With a dielectric constant of 6.15+/- 0.15 at 10 GHz/23°C and an impressively low dissipation factor of 0.002 at the same frequency and temperature, RO3006 delivers superior performance in demanding high-frequency applications. Furthermore, its high thermal conductivity of 0.79 W/mK, thermal decomposition temperature (Td) exceeding 500°C, and minimal moisture absorption rate of 0.02% make RO3006 a robust and reliable choice for critical electronic environments.
Features and Benefits: A Closer Look at the Superiority of RO3006
One of the key advantages of RO3006 lies in its uniform mechanical properties, making it an ideal choice for multi-layer board designs with varying dielectric constants. The laminate's low in-plane expansion coefficient ensures reliable surface-mounted assemblies, excellent dimensional stability, and compatibility with epoxy glass multi-layer board hybrid designs. Additionally, the volume manufacturing process employed in producing RO3006 laminates results in cost-effective pricing, making it an economical yet high-performance solution for high-frequency PCB applications.
PCB Construction details:
Parameter | Value |
Board Dimensions | 63.44mm x 48.5mm (2PCS) |
Minimum Trace/Space | 4/4 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | No |
Finished Board Thickness | 0.3mm |
Finished Cu Weight | 1 oz (1.4 mils) outer layers |
Via Plating Thickness | 20 um |
Surface Finish | Immersion Gold |
Top Silkscreen | Black |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Electrical Test | 100% prior to shipment |
Some Typical Applications:
A list of typical applications for RO3006 PCBs is provided, showcasing the diverse industries and technologies where these high-frequency laminates excel, including automotive radar, satellite communications, telecommunications, and wireless systems.