Advancements in Hybrid PCB Construction Using RO4835 and 370HR Materials
In the ever-evolving landscape of high-frequency and high-performance electronics, the selection of materials for PCB construction plays a pivotal role in determining the overall functionality and reliability of electronic circuits. Two advanced materials that have garnered attention for their exceptional properties in recent years are Rogers' RO4835 and Isola's 370HR. These materials offer unique advantages that cater to the demands of modern electronic designs, making them a preferred choice for high-performance applications.
Advantages of RO4835:
RO4835 laminate from Rogers Corporation stands out for its enhanced stability at high temperatures and superior resistance to oxidation compared to other hydrocarbon materials. Designed specifically for high-frequency performance and cost-effective circuit fabrication, RO4835 shares similar electrical and mechanical properties with RO4350B laminates. This makes it an ideal choice for applications that require high-frequency performance within budget constraints. The low loss characteristic of RO4835 laminates facilitates low-cost circuit fabrication without compromising on performance, making them a popular choice for a wide range of applications.
Superiority of 370HR:
Isola's 370HR laminates are manufactured using a patented high-performance 180°C Tg FR-4 multifunctional epoxy resin system. These laminates are tailored for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are paramount. The use of high-quality E-glass glass fabric in 370HR laminates ensures excellent mechanical, chemical, and moisture resistance properties, surpassing the performance of traditional FR-4 materials. With superior CAF resistance and thermal performance, 370HR laminates are well-suited for applications that demand high reliability and thermal stability.
Specifications of RO4835 and 370HR:
RO4835 boasts impressive specifications, including a dielectric constant (Dk) of 3.48 +/- 0.05, a low dissipation factor, and a Glass Transition Temperature (Tg) exceeding 280 °C. These specifications highlight the suitability of RO4835 for high-frequency applications where stability at elevated temperatures is crucial. On the other hand, 370HR features a dielectric constant (Dk) of 3.92 at 10 GHz, a low dissipation factor, and a Glass Transition Temperature (Tg) of 180 °C. These specifications make 370HR an excellent choice for applications that require thermal stability and reliability in multilayer PCB designs.
PCB Construction Details:
Construction Details | Specifications |
Board Dimensions | 93.57mm x 52mm=1 PCS, +/- 0.15mm |
Minimum Trace/Space | 4/4 mils |
Minimum Hole Size | 0.3mm |
Via in Pad and Under BGA | Filled and Capped |
Finished Board Thickness | 1.43mm |
Finished Cu Weight | 1 oz (1.4 mils) all layers |
Via Plating Thickness | 1 mil |
Surface Finish | Immersion Gold |
Top Silkscreen | White |
Bottom Silkscreen | White |
Top Solder Mask | Matt Red |
Bottom Solder Mask | Matt Red |
Single End Impedance Control | 50 ohm and 100 ohm of 5mil and 7mil on top layer |
Electrical Test | 100% Electrical Test Used |
Application Versatility:
By harnessing the capabilities of RO4835 and 370HR materials in hybrid PCB construction, electronics manufacturers can cater to a wide range of applications, including automotive radar, power amplifiers, RF components, and more. These materials enable the creation of high-performance circuitry with superior quality and reliability, meeting the evolving demands of modern technology across various industries.
In conclusion, the advancements in hybrid PCB construction using RO4835 and 370HR materials represent a significant leap forward in the field of high-frequency electronics. With their exceptional properties and specifications, these materials empower electronics manufacturers to design and produce high-performance circuitry that meets the stringent requirements of modern electronic applications, ensuring reliability and efficiency in a competitive market landscape.
Advancements in Hybrid PCB Construction Using RO4835 and 370HR Materials
In the ever-evolving landscape of high-frequency and high-performance electronics, the selection of materials for PCB construction plays a pivotal role in determining the overall functionality and reliability of electronic circuits. Two advanced materials that have garnered attention for their exceptional properties in recent years are Rogers' RO4835 and Isola's 370HR. These materials offer unique advantages that cater to the demands of modern electronic designs, making them a preferred choice for high-performance applications.
Advantages of RO4835:
RO4835 laminate from Rogers Corporation stands out for its enhanced stability at high temperatures and superior resistance to oxidation compared to other hydrocarbon materials. Designed specifically for high-frequency performance and cost-effective circuit fabrication, RO4835 shares similar electrical and mechanical properties with RO4350B laminates. This makes it an ideal choice for applications that require high-frequency performance within budget constraints. The low loss characteristic of RO4835 laminates facilitates low-cost circuit fabrication without compromising on performance, making them a popular choice for a wide range of applications.
Superiority of 370HR:
Isola's 370HR laminates are manufactured using a patented high-performance 180°C Tg FR-4 multifunctional epoxy resin system. These laminates are tailored for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are paramount. The use of high-quality E-glass glass fabric in 370HR laminates ensures excellent mechanical, chemical, and moisture resistance properties, surpassing the performance of traditional FR-4 materials. With superior CAF resistance and thermal performance, 370HR laminates are well-suited for applications that demand high reliability and thermal stability.
Specifications of RO4835 and 370HR:
RO4835 boasts impressive specifications, including a dielectric constant (Dk) of 3.48 +/- 0.05, a low dissipation factor, and a Glass Transition Temperature (Tg) exceeding 280 °C. These specifications highlight the suitability of RO4835 for high-frequency applications where stability at elevated temperatures is crucial. On the other hand, 370HR features a dielectric constant (Dk) of 3.92 at 10 GHz, a low dissipation factor, and a Glass Transition Temperature (Tg) of 180 °C. These specifications make 370HR an excellent choice for applications that require thermal stability and reliability in multilayer PCB designs.
PCB Construction Details:
Construction Details | Specifications |
Board Dimensions | 93.57mm x 52mm=1 PCS, +/- 0.15mm |
Minimum Trace/Space | 4/4 mils |
Minimum Hole Size | 0.3mm |
Via in Pad and Under BGA | Filled and Capped |
Finished Board Thickness | 1.43mm |
Finished Cu Weight | 1 oz (1.4 mils) all layers |
Via Plating Thickness | 1 mil |
Surface Finish | Immersion Gold |
Top Silkscreen | White |
Bottom Silkscreen | White |
Top Solder Mask | Matt Red |
Bottom Solder Mask | Matt Red |
Single End Impedance Control | 50 ohm and 100 ohm of 5mil and 7mil on top layer |
Electrical Test | 100% Electrical Test Used |
Application Versatility:
By harnessing the capabilities of RO4835 and 370HR materials in hybrid PCB construction, electronics manufacturers can cater to a wide range of applications, including automotive radar, power amplifiers, RF components, and more. These materials enable the creation of high-performance circuitry with superior quality and reliability, meeting the evolving demands of modern technology across various industries.
In conclusion, the advancements in hybrid PCB construction using RO4835 and 370HR materials represent a significant leap forward in the field of high-frequency electronics. With their exceptional properties and specifications, these materials empower electronics manufacturers to design and produce high-performance circuitry that meets the stringent requirements of modern electronic applications, ensuring reliability and efficiency in a competitive market landscape.