RO4003C high frequency PCB 2-layer 20mil with Immersion Gold no Solder Mask,no Silkscreen

RO4003C High Frequency PCB: Unleashing Unparalleled Performance and Cost Efficiency

Welcome to the world of RO4003C, Rogers' revolutionary high frequency circuit material. Engineered to combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass, RO4003C sets a new standard in high frequency PCB design. Join us as we explore the intricate details of this exceptional material, its remarkable features, benefits, and diverse applications.

Features:
RO4003C laminates are crafted using proprietary woven glass reinforced hydrocarbon/ceramics, offering exceptional electrical performance and manufacturability. With a dielectric constant (DK) of 3.38 +/- 0.05 at 10GHz, it provides precise control over signal integrity. The low dissipation factor of 0.0027 at 10GHz ensures minimal signal loss. RO4003C's impressive thermal conductivity of 0.71 W/m/°K facilitates efficient heat dissipation, while its thermal coefficient of dielectric constant ranging from -50°C to 150°C ensures stability across temperature variations. The material's coefficient of thermal expansion (CTE) is precisely matched to copper, with an X-axis of 11ppm/°C and Y-axis of 14ppm/°C. RO4003C exhibits a low Z-axis coefficient of thermal expansion at 46 ppm/°C, offering robustness in demanding environments. With a Tg above 280°C and low moisture absorption of 0.06%, it guarantees exceptional reliability.

Benefits:
RO4003C caters to multi-layer board (MLB) constructions, providing the same processing method as standard epoxy/glass materials but at a fraction of the cost compared to conventional microwave laminates. Its affordability combined with performance sensitivity makes it an ideal choice for high volume applications. Unlike PTFE-based materials, RO4003C does not require special through-hole treatments or handling procedures, simplifying manufacturing processes and reducing overall costs.

PCB Construction Details:
RO4003C is ideally suited for a 2-layer rigid PCB configuration. It features copper layers with a thickness of 35 μm on both sides, while the core thickness measures 0.508 mm (20mil). The finished board thickness is 0.6mm, with a 1oz (1.4 mils) outer layer copper weight. With a via plating thickness of 20 μm, immersion gold surface finish, and no silkscreen or solder mask, the focus remains on optimizing the high frequency performance.

Applications:
RO4003C finds widespread applications across various industries. It is commonly used in cellular base station antennas and power amplifiers, RF identification tags, automotive radar and sensors, as well as LNB's for direct broadcast satellites. Its exceptional performance, reliability, and cost efficiency make it a preferred choice for these demanding applications.

Conclusion:
RO4003C high frequency PCB material represents a quantum leap in performance and cost efficiency. With its exceptional features, tight control over electrical properties, and competitive pricing, it emerges as the ultimate solution for high volume and performance-sensitive applications. Embrace the power of RO4003C and unlock unparalleled possibilities in your PCB designs. Experience the future of high frequency circuit materials today.