Wangling TP: A Cutting-Edge High-Frequency Thermoplastic PCB for Advanced Electronics

Wangling TP: A Cutting-Edge High-Frequency Thermoplastic Material for Advanced Electronics

Introduction:
Wangling TP is revolutionizing the electronics industry with its unique high-frequency thermoplastic material. Unlike traditional laminates, TP-type materials feature a dielectric layer composed of ceramics and polyphenylene Oxide resin (PPO), eliminating the need for fiberglass reinforcement. The distinguishing characteristic of Wangling TP lies in its ability to precisely adjust the dielectric constant by manipulating the ceramics-to-PPO resin ratio. This specialized production process results in outstanding dielectric performance and remarkable reliability. Available in TP, TP-1, and TP-2 variants, Wangling TP encompasses smooth surface material without copper cladding, material with copper cladding on one side, and material with copper cladding on both sides, respectively.

Key Features:

1.Adjustable Dielectric Constant:
Wangling TP empowers engineers to select the dielectric constant within a versatile range of 3 to 25, ensuring it meets the specific requirements of various circuits. The dielectric constant remains stable, with popular options including 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. Additionally, the material exhibits low dielectric loss, with minimal changes as the frequency increases, particularly up to 10 GHz.

2.Wide Operating Temperature Range:
Designed to withstand challenging conditions, Wangling TP boasts a long-term operating temperature range spanning from -100°C to +150°C. Its excellent low-temperature resistance ensures reliable performance in extreme cold environments. However, caution should be exercised as temperatures exceeding 180°C may cause material deformation, copper foil delamination, and significant deviations in electrical performance.

3.Versatility in Thickness:
Wangling TP offers a range of thickness options, starting from an ultra-thin 0.5mm. This flexibility allows for customization to meet specific thickness requirements, accommodating diverse application needs.

4.Radiation Resistance and Low Outgassing:
With inherent radiation resistance, Wangling TP is an optimal choice for applications that encounter radiation exposure. Furthermore, the material exhibits low outgassing properties, ensuring reliable performance in demanding environments.

5.Ideal for Advanced Applications:
Wangling TP finds optimal usage in advanced applications such as GPS antennas, missile-borne systems, fuzes, and miniaturized antennas. Its exceptional properties and reliability make it the material of choice for cutting-edge technologies.

6.Enhanced Adhesion and Processability:
Wangling TP surpasses traditional ceramic substrates with vacuum coating through its superior adhesion between the copper foil and dielectric layer. This enhanced adhesion ensures long-term reliability. Moreover, the material is easy to machine, allowing for various processing methods including drilling, turning, grinding, shearing, etching, and more. These capabilities exceed what can be achieved with conventional ceramic substrates.

PCB Construction Details:

Wangling TP is commonly utilized in the construction of 2-layer rigid PCBs. The typical stack-up configuration consists of:

Copper_layer_1: 35 μm
TP1020 Core: 0.8 mm
Copper_layer_2: 35 μm

Additional PCB Details:

Conclusion:
Wangling TP represents a remarkable advancement in high-frequency thermoplastic materials, offering unparalleled performance and versatility. With its adjustable dielectric constant, wide operating temperature range, and superior adhesion, Wangling TP is the material of choice for demanding applications in GPS antennas, missile-borne systems, fuzes, and miniaturized antennas. Its reliability, processability, and availability on a global scale make it an ideal solution for advanced electronic designs. Stay ahead of the curve with Wangling TP and unlock new possibilities in high-frequency applications.