RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
Place of Origin: | China |
Brand Name: | Bicheng Enterprise Limited |
Certification: | UL |
Model Number: | BIC-0330-V3.30 |
Minimum Order Quantity: | 1 |
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Price: | USD69~110 |
Packaging Details: | KK carton (hard card) |
Delivery Time: | 2-3 working days |
Payment Terms: | T/T/Paypal |
Supply Ability: | 45000 pieces per month |
Base Material: | Stainless Steel Shim | Foil Thickness(Optional): | 0.1mm |
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Aperture Configured: | Laser Cut | Appearance: | Engraving And Electro Polishing |
Fiducial Mark: | Through Hole | Application: | CSP, BGA, 0.5mm QFP Etc. Package |
Product profile
1.1 General description
This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel
foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are half-etch dented suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. Strict WIP inspection and monitoring as well as working instruction;
E. Delivery on time. Higher than 99% on-time-delivery rate;
F. Customer complaint rate: <1%
G. Quick CADCAM checking and free quotation;
H. More than 15 years of experience;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 520 x 420 mm =1 PCS | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness |
0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
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Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1556 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
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Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
Contact Person: Mr. Kevin Liao
Tel: 86-755-27374847
Fax: 86-755-27374947