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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RO4003C 2-layer rigid PCB hydrocarbon ceramic laminates Immersion Gold (ENIG)

RO4003C 2-layer rigid PCB hydrocarbon ceramic laminates Immersion Gold (ENIG)

  • RO4003C 2-layer rigid PCB hydrocarbon ceramic laminates Immersion Gold (ENIG)
  • RO4003C 2-layer rigid PCB hydrocarbon ceramic laminates Immersion Gold (ENIG)
RO4003C 2-layer rigid PCB hydrocarbon ceramic laminates Immersion Gold (ENIG)
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0362-V3.62
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD69~110
Packaging Details: KK carton (hard card)
Delivery Time: 2-3 working days
Payment Terms: T/T/Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Base Material: Stainless Steel Shim Foil Thickness(Optional): 0.1mm
Aperture Configured: Laser Cut Appearance: Engraving And Electro Polishing
Fiducial Mark: Through Hole Application: CSP, BGA, 0.5mm QFP Etc. Package

Specifications for a 2-Layer Rigid PCB Design

 

The key specifications for a recently designed 2-layer rigid PCB were documented in order to share the considerations that go into PCB design. The details below cover the materials, stackup, construction details, statistics, artwork format, quality standards, and contact information.

 

The PCB material chosen was RO4003C hydrocarbon ceramic laminates, which provide thermal stability across a wide temperature range of -40°C to +85°C. The laminates were selected to be lead-free for environmental compliance.

 

A 2-layer stackup was constructed with finished copper of 35um used on each signal layer. The core dielectric selected was RO4003C with a thickness of 32mil (0.8mm). This resulted in a total finished board thickness of 0.9mm.

 

The board dimensions were specified at 139mm x 100mm (6 pieces) with a tolerance of +/- 0.15mm allowed. A minimum trace/space of 4/4 mils was specified to allow for tighter routing. A minimum hole size of 0.5mm was set. No blind or buried vias were used to reduce cost. The finished copper weight was chosen to be 1 oz (1.4 mil) on all layers. 1 mil via plating was used to connect the layers. ENIG surface finish was selected for solderability and shelf life. No soldermask or silkscreen were used for cost savings. 100% electrical testing was specified for quality assurance. 0.5mm filled vias were implemented per IPC-4761 Type VII.

 

Specification Value
Board dimensions 139mm x 100mm (6PCS), +/- 0.15mm tolerance
Minimum Trace/Space 4/4 mils
Minimum Hole Size 0.5mm
Blind or buried vias None used
Finished board thickness 0.9mm
Finished Cu weight 1 oz (1.4 mils) all layers
Via plating thickness 1 mil
Surface finish Electroless Nickle Immersion Gold (ENIG)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None

 

The PCB statistics show 97 components, with 130 total pads, 49 thru-hole pads, 81 SMT pads, 151 vias, and 17 nets for routing.

Gerber RS-274X artwork format was supplied for manufacturing. IPC-Class-2 quality standard was targeted for high reliability commercial product requirements.

 

Any technical questions can be directed to Sally Mao at sales30@bichengpcb.com who can be contacted as needed.

Please let me know if you would like any part of this revised in a more passive tone or expression. I'm happy to make additional changes.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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