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Metal Core PCB Built On Aluminum Base With 3W/MK Dielectric and Immersion Gold thermal management circuit board used in LED lighting

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Metal Core PCB Built On Aluminum Base With 3W/MK Dielectric and Immersion Gold thermal management circuit board used in LED lighting

Name: Metal Core PCB Built On Aluminum Base With 3W/MK Dielectric and Immersion Gold thermal management circuit board used in LED lighting
Brand: Bicheng Enterprise Limited
SKU: BIC-0578-V5.78
Price: 20 USD
Availability: InStock
Rating: 4.6 (196 reviews)

MOQ:	1
Price:	USD20~30
Standard Packaging:	Vacuum
Delivery Period:	4-5 working days
Payment Method:	T/T, Paypal
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Enterprise Limited

Certification

Model Number

BIC-0578-V5.78

Thermal Conductivity:

3W / MK Dielectric Material, MCPCB

Final Height Of PCB:

1.6mm ±0.16

Final Foil External:

1 Oz

Surface Finish:

Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)

Solder Mask Color:

Black

Colour Of Component Legend:

No Silkscreen

TEST:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD20~30

Packaging Details:

Vacuum

Delivery Time:

4-5 working days

Payment Terms:

T/T, Paypal

Supply Ability:

45000 pieces per month

Product Description

General Profile

Metal core PCB is thermal management circuit board used in LED lighting which
needs fast cooling dissipation. The metal core can be aluminum (aluminum core
PCB) and copper (copper core PCB), even iron base. The fastest speed of heat
transfer is on copper which is designed in the form of thermoelectric separation.

Advantages

1) Effective heat dissipation reduces the operating temperature of the module
and prolongs the service life;
2) Power density and reliability are improved up 10%;
3) Reduce the dependence of heat sinks and other hardware (including thermal
interface materials);
4) Reduce the volume of the product;
5) Reduce the cost of hardware and assembly;
6) Optimization combination of power circuit and control circuit;
7) Replace the fragile ceramic substrate and obtain a better mechanical durability;
8) Reduce the operating temperature of the equipment;

Applications

LED lighting,
Switch regulator,
DC/AC converter,
Communication electronic equipment,
A filter electric circuit,
Office automation equipment,
Motor driver,
Motor controller, Automobile etc.

Metal Core PCB Capability

NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5	Layer Count	1-4 Layers
6	Maximum of Board Size	23" x 46" (584mm×1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm×5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5µm),1OZ(35µm), 2OZ(70µm),3OZ(105µm), 4OZ(140µm) to 10oz (350µm)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
14	Minimum Holes Punched	PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20µm
16	Tolerance of PTH	±0.00295" (0.075mm)
17	Tolerance of NPTH	±0.00197" (0.05mm)
18	Deviation of Hole Position	±0.00394" (0.10mm)
19	Outline Tolerance	Routing: ±0.00394" (0.1mm)
19	Outline Tolerance	Punching: ±0.00591" (0.15mm)
20	Angle of V-cut	30°, 45°, 60°
21	V-cut Size	0.1969" x 47.24" (5mm×1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	±5º
24	V-CUT Verticality	≤0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
25	Minimum Square Slots Punched	PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13µm (0.013mm)
29	Insulation Resistance	1012ΩNormal
30	Peel-off Strength	2.2N/mm
31	Solder float	260℃ 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	≤0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)

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