Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RF-35TC High Frequency PCB with 30mil, 60mil Thick Coating Immersion Gold, HASL, Immersion Silver and Tin

RF-35TC High Frequency PCB with 30mil, 60mil Thick Coating Immersion Gold, HASL, Immersion Silver and Tin

  • RF-35TC High Frequency PCB  with 30mil, 60mil Thick Coating Immersion Gold, HASL, Immersion Silver and Tin
  • RF-35TC High Frequency PCB  with 30mil, 60mil Thick Coating Immersion Gold, HASL, Immersion Silver and Tin
RF-35TC High Frequency PCB  with 30mil, 60mil Thick Coating Immersion Gold, HASL, Immersion Silver and Tin
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-267-V1.34
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 4 Layer, Multilayer Glass Epoxy: PI+FR4
Final Height Of PCB: 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm 1.8mm, 2.0mm Final Foil External: 0.5oz, 1oz, 2oz
Surface Finish: ENIG, Immersion Tin, OSP,etc.. Solder Mask Color: Green, Black, Blue, Yellow, Red Etc.
Colour Of Component Legend: Green, Black, Blue, Yellow, Red Etc. Test: 100% Electrical Test Prior Shipment


RF-35TC is a ceramic-filled fiberglass laminate material based on PTFE (Polytetrafluoroethylene). It offers exceptional electrical performance and exhibits properties that make it highly suitable for high-frequency applications. Here are the key characteristics and properties of RF-35TC:


  1. Dielectric Properties: RF-35TC has a low dielectric constant (DK) of 3.5 at 10 GHz, which remains stable across a wide temperature range. This stability is crucial for applications requiring precise control of the dielectric constant, such as narrow and broad-band overlay couplers.
  2. Dissipation Factor (Df): RF-35TC demonstrates a low Df value of 0.0011 at 10 GHz, indicating minimal signal loss and excellent signal integrity. Compared to other materials like RT/duroid 6035HTC, TC600, and TC350, RF-35TC offers even lower Df values.
  3. Dielectric Breakdown and Strength: RF-35TC exhibits impressive dielectric breakdown properties with a value of 56.7 kilovolts and a dielectric strength of 570 V/mil (22,441 V/mm). These values ensure the material's reliability and safety in electronic devices.
  4. Arc Resistance: RF-35TC surpasses industry standards for arc resistance, with a duration of 304 seconds according to IPC-650 2.5.1. This property makes it highly suitable for applications where resistance to arcing is critical.
  5. Moisture Absorption: RF-35TC has a very low moisture absorption rate of 0.05%, complying with the strict IPC-650 standard. This low absorption rate ensures the material's stability and reliability, even in high humidity or moisture-exposed environments.
  6. Mechanical Properties: RF-35TC exhibits excellent flexural strength, with values of 12,900 psi (88.94 N/mm²) in the machine direction (MD) and 11,700 psi (80.67 N/mm²) in the cross-machine direction (CD). It also demonstrates good elongation at break and high Young's modulus.
  7. Thermal Properties: RF-35TC offers high thermal conductivity, which helps dissipate heat from both transmission lines and surface mount components. It has a thermal conductivity value of 0.6 W/(mK) at 125℃ and is particularly well-suited for power amplifier applications.
  8. Dimensional Stability: RF-35TC exhibits minimal dimensional changes, ensuring precise circuit geometries and signal integrity. Its dimensional stability is crucial for maintaining critical distances between trace elements in printed filters and enhancing antenna gains and efficiencies.
  9. Electrical Properties: RF-35TC maintains good surface and volume resistivity even after exposure to elevated temperatures and humidity.
  10. Other Properties: RF-35TC has a low coefficient of thermal expansion (CTE), a density of 2.35 g/cm³, a hardness of 79.1 (Shore D), and specific heat of 0.94 j/(g℃). It also has a high thermal decomposition temperature (Td) of 420℃ (2% weight loss) and 436℃ (5% weight loss).

Overall, RF-35TC offers exceptional electrical, mechanical, thermal, and dimensional stability properties, making it an excellent choice for high-frequency applications that require reliable and high-performance PCB materials.


Property Test Method Unit RF-35TC Unit RF-35TC
DK at 10 GHz IPC-650   3.5   3.5
Tck(-30 to 120℃) IPC-650 ppm 24 ppm 24
Df at 10 GHz IPC-650   0.0011   0.0011
Dielectric Breakdown IPC-650 2.5.6(in-Plane,Two Pins in Oil) kV 56.7 kV 56.7
Dielectric Strength ASTM D 149(Through Plane) V/mil 570 V/mm 22,441
Arc Resistance IPC-650 2.5.1 Seconds 304 Seconds 304
Moisture Absorption IPC-650 % 0.05 % 0.05
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 12,900 N/mm2 88.94
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 11,700 N/mm2 80.67
Tensile Strength(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 9,020 N/mm2 62.19
Tensile Strength(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 7,740 N/mm2 53.37
Elongation at Break(MD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.89 N/mm 1.89
Elongation at Break(CD) ASTM D 3039/IPC-TM-650 2.4.19 % 1.7 % 1.7
Young's Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 psi 667,000 N/mm2 4,599
Young's Modulus(CD) ASTM D 3039/IPC-TM-650 2.4.19 psi 637,000 N/mm2 4,392
Poisson's Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19   0.18   0.18
Poisson's Ratio(CD) ASTM D 3039/IPC-TM-650 2.4.19   0.23   0.18
Compressive Modulus ASTM D 695(23℃) psi 560,000 N/mm2 3,861
Flexural Strength(MD) ASTM D 790/IPC-650 2.4.4 psi 1.46 x 106 N/mm2 10,309
Flexural Strength(CD) ASTM D 790/IPC-650 2.4.4 psi 1.50 x 106 N/mm2 10,076
Peel Stength(½ oz.CVH) IPC-650 2.4.8(Thermal Stress.) Ibs./inch 7 g/cm3 1.25
Thermal Conductivity(Unclad,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.6 W/(mK) 0.6
Thermal Conductivity(C1/C1,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.92 W/(mK) 0.92
Thermal Conductivity(CH/CH,125℃) ASTM F433(Guarded Heat Flow) W/(mK) 0.87 W/(mK) 0.87
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.23 mm/M 0.23
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.4(After Etch) mils/in. 0.64 mm/M 0.64
Dimensional Stability(MD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. -0.04 mm/M -0.04
Dimensional Stability(CD) IPC-650-2.4.39 Sec.5.5(Thermal Stress.) mils/in. 0.46 mm/M 0.46
Surface Resistivity IPC-650 elevated temp.) Mohms 8.33 x 107 Mohms 8.33 x 107
Surface Resistivity IPC-650 humidity) Mohms 6.42 x 107 Mohms 6.42 x 107
Volume Resistivity IPC-650 elevated temp.) Mohms/cm 5.19 x 108 Mohms/cm 5.19 x 108
Volume Resistivity IPC-650 humidity) Mohms/cm 2.91 x 108 Mohms/cm 2.91 x 108
CTE(X axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 11 ppm/℃ 11
CTE(Y axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 13 ppm/℃ 13
CTE(Z axis)(25-260℃) IPC-650 2.4.41/ASTM D 3386 ppm/℃ 34 ppm/℃ 34
Density ASTM D 792 g/cm3 2.35 g/cm3 2.35
Hardness ASTM D 2240(Shore D)   79.1   79.1
Strain at Break(MD) ASTM D 790/IPC-650 2.4.4 % 0.014 % 0.014
Strain at Break(CD) ASTM D 790/IPC-650 2.4.4 % 0.013 % 0.013
Specific Heat ASTM E 1269-05,E 967-08,E968-02 j/(g℃) 0.94 j/(g℃) 0.94
Td(2% Weight Loss) IPC-650 oF 788 420
Td(5% Weight Loss) IPC-650 oF 817 436


PCB Capability (RF-35TC)

For RF-35TC PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RF-35TC PCBs have wide thickness. These are the standard thickness such as 10 mils, 20 mils, 30 mils, and 60mils etc.

Finished copper on PCB can be 1oz and 2oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.


Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.


PCB material: PTFE based Ceramic filled Fiberglass
Designation: RF-35TC
Dielectric constant: 3.50 @ 10GHz
Layer count: 1-layer, 2-layer, Multi-layer, Hybrid type
Dielectric thickness: 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
Copper weight: 1oz, 2oz
Solder mask: Green, Black, Blue, Yellow, White etc.
PCB size: ≤400mm X 500mm
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, Pure gold, ENEPIG etc.


A Piece of RF-35TC PCB:

The RF-35TC PCB in the image is a 30mil (0.03 inches) thick board made from RF-35TC material. It features a brown or gray base color, which is typical for this material. The PCB has been coated with immersion gold for improved conductivity and corrosion resistance. The solder mask applied on top of the copper traces is black, providing visual contrast and protection for the circuitry.


Applications of RF-35TC PCBs:

RF-35TC PCBs find applications in various electronic devices and systems. Some common applications include:

  1. Couplers: RF-35TC PCBs are well-suited for use in couplers, which are components that split or combine electrical signals in RF and microwave systems.
  2. Antennas: RF-35TC PCBs can be used to fabricate antenna structures for wireless communication systems, such as Wi-Fi routers, cellular base stations, and satellite communication equipment.
  3. Power Amplifiers: RF-35TC PCBs are suitable for power amplifier circuits, which are responsible for amplifying signals to high power levels in applications such as radio transmitters and RF signal generators.
  4. Satellite Equipment: RF-35TC PCBs can be found in various satellite equipment, including communication satellites, earth observation satellites, and navigation systems.


Superior Heat Dissipation Performance:

The thermal conductivity of RF-35TC PCBs can be accurately measured by conducting tests on unclad laminates, which provide the true thermal conductivity of the material. Measurements conducted on copper clad laminates (CCL) typically yield higher values due to the lower thermal resistance at the interface between the laminate and the measuring equipment.


Regardless of the measurement technique, RF-35TC PCBs demonstrate superior heat dissipation performance. This property is vital for electronic devices that generate heat, as it helps prevent overheating and ensures the reliability and longevity of the components.


In summary, RF-35TC PCBs offer excellent electrical properties, including low dielectric constant and dissipation factor, while also providing reliable thermal conductivity and heat dissipation capabilities. These features make RF-35TC PCBs well-suited for high-frequency applications that require both excellent electrical performance and effective heat management.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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