Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RT/duroid 5880LZ High Frequency PCBfor RF microwave antenna

RT/duroid 5880LZ High Frequency PCBfor RF microwave antenna

  • RT/duroid 5880LZ High Frequency PCBfor RF microwave antenna
RT/duroid 5880LZ High Frequency PCBfor RF microwave antenna
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0310-V3.1
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + 0.2mm Stiffener Of FR-4 Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: No
Function: 100% Pass Electrical Test Number Of Layers: 2


RT/duroid 5880LZ laminates are PTFE composites engineered for precise strip-line and micro-strip circuits. They incorporate a specialized filler resulting in low density and lightweight construction ideal for weight-sensitive, high-performance applications.


Let's explore some of the impressive properties that make 5880LZ stand out:

It has a dielectric constant of 2.00 ± 0.04 at 10GHz and 23°C in the Z direction per IPC standards. This enables reliable signal transmission. The design dielectric constant remains 2.00 from 8GHz to 40GHz.


Dissipation factor or tan delta is extremely low - typically 0.0021, maximally 0.0027 at 10GHz/23°C - minimizing signal loss.


The thermal coefficient of dielectric constant is +20 ppm/°C over -50°C to 150°C at 10GHz. This confers excellent stability versus temperature.

Electrically, volume and surface resistivity exceed 10^7 and 10^6 Mohm-cm respectively under IPC test conditions.


Electric strength is specified at 40KV, ensuring durability in tough environments.


In terms of dimensional stability, RT/duroid 5880LZ demonstrates remarkable performance with just -0.38% change in X and Y directions per IPC standards. This ensures consistent, reliable behavior.


Moisture absorption is only 0.31% after 24 hours at 23°C, indicating excellent moisture resistance as specified by IPC.


Thermal conductivity in the Z axis is 0.33 W/mK at 80°C via ASTM C518.


Coefficient of thermal expansion is moderately low at 54 ppm/°C (X), 47 ppm/°C (Y) and 40 ppm/°C (Z) over 0°C to 150°C. This confers dimensional stability with temperature fluctuations.


Rigorous ASTM outgassing tests are passed, with minimal Total Mass Loss, Collected Volatile Condensable Materials and Water Vapor Regain of 0.01% each.


With a density of 1.4 gm/cm^3, 5880LZ provides lightweight yet robust high frequency performance.


Copper peel strength exceeds 4.0 pli, ensuring excellent copper bonding and reliability.


Flammability is V-0 rated per UL 94 standards for resistance to ignition and flame spread.


Lastly, 5880LZ is compatible with lead-free processes for an eco-friendly solution.


Property RT/duroid 5880LZ Direction Units Condition Test Method
Dielectric Constant er,Process 2.00 ± 0.04 Z   10 GHz/23°C IPC-TM-650,
Dielectric Constant er,Design 2.00 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor, tan Typ: 0.0021 Max: 0.0027 Z   10GHz/23°C IPC-TM-650,
Thermal Coefficient of Dielectric Constant, er +20 Z ppm/°C -50°C to 150°C 10GHz IPC-TM-650,
Volume Resistivity 1.74 X 10^7   Mohm•cm C-96/35/90 IPC-TM-650,
Surface Resistivity 2.08 X 10^6   Mohm C-96/35/90 IPC-TM-650,
Electrical Strength 40   KV D48/50 IPC-TM-650, 2.5.6
Dimensional Stability -0.38 X,Y %   IPC-TM-650, 2.4.39A
Moisture Absorption 0.31   % 24 hours/23°C IPC-TM-650,
Thermal Conductivity 0.33 Z W/m/°K 80°C ASTM C518
Coefficient of Thermal Expansion 54, 47 40 X,Y Z ppm/°C 0 to 150°C IPC-TM-650, 2.4.41
TML 0.01   %   ASTM E-595
CVCM 0.01        
WVR 0.01        
Density 1.4   gm/cm^3   ASTM D792
Copper Peel >4.0   pli   IPC-TM-650, 2.4.8
Flammability V-O       UL 94
Lead-Free Process Compatible YES        


RT/duroid 5880LZ PCB Capabilities

For RT/duroid 5880LZ printed circuit boards, we offer single-layer, double-layer, multilayer, and hybrid constructions. These boards are available in a wide range of standard thicknesses including 10 mils, 20 mils, 50 mils, and 100 mils to suit various designs.


The finished copper weight on the boards can be specified as 1 oz or 2 oz. Our maximum panel size for 5880LZ high frequency boards measures 400mm by 500mm. This allows production of either a single large board or many smaller boards in one panel.


We have various solder mask colors in-house, including green, black, blue, yellow, and more. For pad plating, we offer immersion gold, immersion silver, immersion tin, bare copper and other finishes.


Please contact us to discuss your specific requirements for RT/duroid 5880LZ PCBs. We have extensive capabilities to fulfill your high frequency circuit needs.


PCB material: Unique Filled PTFE Composites
Designation: RT/Duroid 5880LZ
Dielectric constant: 2
Dissipation factor 0.0021 10GHz
Layer count: 1-layer, 2-layer, multi-layer, hybrid designs
Laminate thickness: 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm )
Copper weight: 1oz (35µm), 2oz (70 µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, Immersion silver, Immersion tin, ENEPIG, Bare copper, HASL, OSP, Pure gold plated etc..


A Piece of RT/duroid 5880LZ PCB
Now what we are seeing on the screen is a type of 20mil RT/duroid 5880LZ PCB with immersion gold, a double layer board. In our lives, we can find their typical applications in the area of airborne antenna system, lightweight feed networks, point-to-point digital radio antennas etc.


RT/duroid 5880LZ High Frequency PCBfor RF microwave antenna 0


RT/duroid 5880LZ has Z-axis coefficient of thermal expansion (CTE) at 40 ppm/°C. This is a low value that ensure its reliable plated through holes.


When ordering RT/duroid 5880LZ PCB, it is important to specify the dielectric thickness, weight of copper foil required and surface finish.


Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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