RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||CHINA|
|Brand Name:||Bicheng Enterprise Limited|
|Minimum Order Quantity:||1 PIECE|
|Price:||USD2 .99-9.99 per piece|
|Delivery Time:||8-9 WORKING DAY|
|Supply Ability:||50000 PIECE PER MONTH|
|Board Material:||Polyimide 25μm||Board Thickness:||0.20 Mm|
|Surface/Inner Layer Cu Thickness:||35 µm||Surface Finish:||Immersion Gold|
|Coverlay Colour:||Yellow||Color Of Silkscreen:||White|
|Function:||100% Pass Electrical Test||Number Of Layers:||2|
RT/duroid 6006 high-frequency PCBs are ceramic-PTFE composites designed for electronic and microwave circuit applications that require a high dielectric constant. These PCBs offer several advantages, including reduced circuit size, low signal loss, and repeatable circuit performance.
RT/duroid 6006 Typical Properties:
The dielectric properties of RT/duroid 6006 are noteworthy. It has a process dielectric constant (εProcess) of 6.15±0.15 at 10 GHz and 23℃, ensuring excellent signal performance and stability. The design dielectric constant (εDesign) is 6.45, covering a frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method. This high dielectric constant facilitates greater space in PCB circuit design, enabling product miniaturization.
The dissipation factor (tanδ) of RT/duroid 6006 is impressively low at 0.0027 at 10 GHz, which ensures minimal signal loss and high signal integrity.
When it comes to thermal properties, RT/duroid 6006 exhibits a thermal coefficient of dielectric constant of -410 ppm/℃ in the temperature range of -50℃ to 170℃. This indicates that the material has varying dielectric properties across a wide temperature spectrum, making it unsuitable for millimeter-wave applications and environments with significant temperature fluctuations.
In terms of electrical properties, RT/duroid 6006 demonstrates excellent electrical insulation capabilities with a volume resistivity of 7 x 10^7 Mohm.cm and a surface resistivity of 2 x 10^7 Mohm.
Regarding mechanical properties, RT/duroid 6006 has impressive tensile properties. In the X-axis, it has a Young's modulus of 627 MPa (91 kpsi) and an ultimate stress of 20 MPa (2.8 kpsi). In the Y-axis, the Young's modulus is 517 MPa (75 kpsi) and the ultimate stress is 17 MPa (2.5 kpsi). The ultimate strain ranges from 12% to 13% in the X-axis and from 4% to 6% in the Y-axis.
In compressive properties, RT/duroid 6006 has a Young's modulus of 1069 MPa (115 kpsi) in the Z-axis and an ultimate stress of 54 MPa (7.9 kpsi). The ultimate strain in the Z-axis measures at 33%.
The material's flexural modulus is 2634 MPa (382 kpsi) in the X-axis and 1951 MPa (283 kpsi) in the Y-axis. The ultimate stress in the X-axis is 38 MPa (5.5 kpsi).
Under load, RT/duroid 6006 exhibits a deformation rate of 0.33% in the Z-axis after 24 hours at 50℃ and 7 MPa. At 150℃ and 7 MPa, the deformation rate is 2.1% in the Z-axis, highlighting the material's dimensional stability under pressure and heat.
The moisture absorption of RT/duroid 6006 is remarkably low at 0.05%, ensuring its reliability and stability in humid environments.
Thermal conductivity of the material is 0.49 W/m/k at 80℃, indicating good heat dissipation capabilities.
The coefficient of thermal expansion for RT/duroid 6006 is 47 ppm/℃ in the X-axis, 34 ppm/℃ in the Y-axis, and 117 ppm/℃ in the Z-axis at 23℃ and 50% RH, which means it can withstand temperature changes without significant dimensional variations.
The thermal decomposition temperature (Td) of RT/duroid 6006 is 500℃, ensuring its stability in high-temperature environments.
With a density of 2.7 g/cm³, RT/duroid 6006 strikes a balance between lightweight design and robust performance.
Other properties include specific heat measuring 0.97 j/g/k (0.231 BTU/ib/OF), copper peel strength of 14.3 pli (2.5 N/mm) after solder float, V-0 flammability rating based on UL 94 testing, and full compatibility with lead-free processes, making it environmentally friendly.
|Property||RT/duroid 6006||Direction||Units||Condition||Test Method|
|Dielectric Constant,εProcess||6.15±0.15||Z||10 GHz/23℃||IPC-TM-650 220.127.116.11 Clamped stripline|
|Dielectric Constant,εDesign||6.45||Z||8GHz to 40 GHz||Differential Phase Length Method|
|Dissipation Factor,tanδ||0.0027||Z||10 GHz/A||IPC-TM-650 18.104.22.168|
|Thermal Coefficient of ε||-410||Z||ppm/℃||-50℃-170℃||IPC-TM-650 22.214.171.124|
|Volume Resistivity||7 x 107||Mohm.cm||A||IPC 126.96.36.199|
|Surface Resistivity||2 x 107||Mohm||A||IPC 188.8.131.52|
|Tensile Properties||ASTM D638 (0.1/min. strain rate)|
|Young's Modulus||627(91) 517(75)||X Y||MPa(kpsi)||A|
|Ultimate Stress||20(2.8) 17(2.5)||X Y||MPa(kpsi)||A|
|Ultimate Strain||12 to 13 4 to 6||X Y||%||A|
|Compressive Properties||ASTM D695 (0.05/min. strain rate)|
|Young's Modulus||1069 (115)||Z||MPa(kpsi)||A|
|Flexural Modulus||2634 (382) 1951 (283)||X||MPa(kpsi)||A||ASTM D790|
|Ultimate Stress||38 (5.5)||X Y||MPa(kpsi)||A|
|Deformation under load||0.33 2.1||Z Z||%||24hr/50℃/7MPa 24hr/150℃/7MPa||ASTM D261|
|Moisture Absorption||0.05||%||D48/50℃ 0.050"(1.27mm) thick||IPC-TM-650 184.108.40.206|
|Thermal Conductivity||0.49||W/m/k||80℃||ASTM C518|
|Coefficient of Thermal Expansion||47
|ppm/℃||23℃/50% RH||IPC-TM-650 2.4.41|
|Td||500||℃ TGA||ASTM D3850|
|Copper Peel||14.3 (2.5)||pli (N/mm)||after solder float||IPC-TM-650 2.4.8|
|Lead-free Process Compatible||Yes|
PCB Capability (RT/duroid 6006)
For RT/duroid 6006 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.
RT/duroid 6006 PCBs have wide thickness. These are the standard thickness such as 10 mils, 25 mils, 50 mils and 75mils etc. Finished copper on PCB is 1oz and 2oz.
Our maximum PCB size on RT/duroid 6006 laminate is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.
Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper and OSP etc. for pads protection.
|PCB material:||Ceramic-PTFE Composites|
|Dissipation factor||0.0027 10GHz|
|Layer count:||Single-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid types|
|Dielectric thickness:||10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm)|
|Copper weight:||1oz (35µm), 2oz (70µm)|
|PCB size:||≤400mm X 500mm|
|Solder mask:||Green, Black, Blue, Yellow, Red etc.|
|Surface finish:||Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..|
A Piece of RT/duroid 6006 PCB
Now on the screen is a type of 50mil RT/duroid 6006 PCB with immersion silver for patch antennas.
RT/duroid 6006 PCBs can be used in applications of 8 to 40 GHz of telecommunications, aerospace and defence etc. We can also see their applications in aircraft collision avoidance systems, ground radar warning systems and satellite communications systems etc.
That concludes our overview of the remarkable properties and characteristics of the RT/duroid 6006 and our printed circuit boards on it. If you have any further questions or would like more information, please feel free to ask. Thank you for your attention.
Contact Person: Miss. Sally Mao