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Rogers RT/duroid 6006 High Frequency PCB on 25mil, 50mil and 75mil with Immersion Gold for Ground Radar Warning

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MOQ: | 1 PIECE |

Price: | USD2 .99-9.99 per piece |

Standard Packaging: | VACUUM |

Delivery Period: | 8-9 WORKING DAY |

Payment Method: | T/T,Paypal |

Supply Capacity: | 50000 PIECE PER MONTH |

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng Enterprise Limited

Certification

UL

Model Number

BIC-0308-V3.08

Board Material:

Polyimide 25μm

Board Thickness:

0.20 Mm

Surface/Inner Layer Cu Thickness:

35 µm

Surface Finish:

Immersion Gold

Coverlay Colour:

Yellow

Color Of Silkscreen:

White

Function:

100% Pass Electrical Test

Number Of Layers:

2

Minimum Order Quantity:

1 PIECE

Price:

USD2 .99-9.99 per piece

Packaging Details:

VACUUM

Delivery Time:

8-9 WORKING DAY

Payment Terms:

T/T,Paypal

Supply Ability:

50000 PIECE PER MONTH

Product Description

**Introduction:**

RT/duroid 6006 high-frequency PCBs are ceramic-PTFE composites designed for electronic and microwave circuit applications that require a high dielectric constant. These PCBs offer several advantages, including reduced circuit size, low signal loss, and repeatable circuit performance.

**RT/duroid 6006 Typical Properties:**

**Dielectric Properties:**

- Process Dielectric Constant (εProcess): The RT/duroid 6006 exhibits a process dielectric constant of 6.15±0.15 at 10 GHz and 23℃. This ensures excellent signal performance and stability.
- Design Dielectric Constant (εDesign): The design dielectric constant measures at 6.45 and covers a frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method. The high dielectric constant allows for greater space in PCB circuit design, enabling product miniaturization.
- Dissipation Factor (tanδ): The RT/duroid 6006 has a low dissipation factor of 0.0027 at 10 GHz, ensuring minimal signal loss and high signal integrity.
- Thermal Coefficient of Dielectric Constant: The material has a thermal coefficient of dielectric constant of -410 ppm/℃ in the temperature range of -50℃ to 170℃. This indicates that the RT/duroid 6006 has variant dielectric properties across a wide temperature spectrum, making it unsuitable for millimeter-wave applications and environments with significant temperature changes.

**Electrical Properties:**

- Volume Resistivity: The volume resistivity of the RT/duroid 6006 is measured at 7 x 10^7 Mohm.cm, indicating excellent electrical insulation capabilities.
- Surface Resistivity: The surface resistivity measures 2 x 10^7 Mohm, highlighting the material's strong electrical performance.

**Mechanical Properties:**

- Tensile Properties: The RT/duroid 6006 exhibits impressive tensile properties. The Young's modulus measures 627 MPa (91 kpsi) in the X-axis and 517 MPa (75 kpsi) in the Y-axis. The ultimate stress is 20 MPa (2.8 kpsi) in the X-axis and 17 MPa (2.5 kpsi) in the Y-axis. The ultimate strain ranges from 12% to 13% in the X-axis and from 4% to 6% in the Y-axis.
- Compressive Properties: In the Z-axis, the material has a Young's modulus of 1069 MPa (115 kpsi) and an ultimate stress of 54 MPa (7.9 kpsi). The ultimate strain in the Z-axis measures at 33%.
- Flexural Modulus: The RT/duroid 6006 has a flexural modulus of 2634 MPa (382 kpsi) in the X-axis and 1951 MPa (283 kpsi) in the Y-axis. The ultimate stress in the X-axis is 38 MPa (5.5 kpsi).

**Other Properties:**

- Deformation under Load: The material exhibits low deformation rates under load. In the Z-axis, the deformation rate is 0.33% after 24 hours at 50℃ and 7 MPa. At 150℃ and 7 MPa, the deformation rate is 2.1% in the Z-axis, showcasing dimensional stability under pressure and heat.
- Moisture Absorption: The RT/duroid 6006 has a moisture absorption rate of 0.05%, ensuring reliability and stability in humid environments.
- Thermal Conductivity: The material has a thermal conductivity of 0.49 W/m/k at 80℃, indicating good heat dissipation capabilities.
- Coefficient of Thermal Expansion: The coefficient of thermal expansion is 47 ppm/℃ in the X-axis, 34 ppm/℃ in the Y-axis, and 117 ppm/℃ in the Z-axis at 23℃ and 50% RH, allowing the material to withstand temperature changes without significant dimensional variations.
- Thermal Decomposition Temperature (Td): The material has a thermal decomposition temperature of 500℃, ensuring stability in high-temperature environments.
- Density: The RT/duroid 6006 has a density of 2.7 g/cm³, striking a balance between lightweight design and robust performance.
- Specific Heat: The specific heat measures 0.97 j/g/k (0.231 BTU/ib/OF), indicating its heat absorption and retention capabilities.
- Copper Peel Strength: The material exhibits a copper peel strength of 14.3 pli (2.5 N/mm) after undergoing solder float, ensuring secure adhesion and reliability in demanding applications.
- Flammability: The material has achieved a V-0 rating for flammability based on UL 94 testing.
- Lead-Free Compatibility: The RT/duroid 6006 is fully compatible with lead-free processes, making it an ideal choice forRT/duroid 6006 high-frequency PCBs are ceramic-PTFE composites specifically designed for electronic and microwave circuit applications that require a high dielectric constant. These PCBs offer various advantages, such as enabling circuit size reduction, low signal loss, and consistent circuit performance.

The dielectric properties of RT/duroid 6006 are noteworthy. It has a process dielectric constant (εProcess) of 6.15±0.15 at 10 GHz and 23℃, ensuring excellent signal performance and stability. The design dielectric constant (εDesign) is 6.45, covering a frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method. This high dielectric constant facilitates greater space in PCB circuit design, enabling product miniaturization.

The dissipation factor (tanδ) of RT/duroid 6006 is impressively low at 0.0027 at 10 GHz, which ensures minimal signal loss and high signal integrity.

When it comes to thermal properties, RT/duroid 6006 exhibits a thermal coefficient of dielectric constant of -410 ppm/℃ in the temperature range of -50℃ to 170℃. This indicates that the material has varying dielectric properties across a wide temperature spectrum, making it unsuitable for millimeter-wave applications and environments with significant temperature fluctuations.

In terms of electrical properties, RT/duroid 6006 demonstrates excellent electrical insulation capabilities with a volume resistivity of 7 x 10^7 Mohm.cm and a surface resistivity of 2 x 10^7 Mohm.

Regarding mechanical properties, RT/duroid 6006 has impressive tensile properties. In the X-axis, it has a Young's modulus of 627 MPa (91 kpsi) and an ultimate stress of 20 MPa (2.8 kpsi). In the Y-axis, the Young's modulus is 517 MPa (75 kpsi) and the ultimate stress is 17 MPa (2.5 kpsi). The ultimate strain ranges from 12% to 13% in the X-axis and from 4% to 6% in the Y-axis.

In compressive properties, RT/duroid 6006 has a Young's modulus of 1069 MPa (115 kpsi) in the Z-axis and an ultimate stress of 54 MPa (7.9 kpsi). The ultimate strain in the Z-axis measures at 33%.

The material's flexural modulus is 2634 MPa (382 kpsi) in the X-axis and 1951 MPa (283 kpsi) in the Y-axis. The ultimate stress in the X-axis is 38 MPa (5.5 kpsi).

Under load, RT/duroid 6006 exhibits a deformation rate of 0.33% in the Z-axis after 24 hours at 50℃ and 7 MPa. At 150℃ and 7 MPa, the deformation rate is 2.1% in the Z-axis, highlighting the material's dimensional stability under pressure and heat.

The moisture absorption of RT/duroid 6006 is remarkably low at 0.05%, ensuring its reliability and stability in humid environments.

Thermal conductivity of the material is 0.49 W/m/k at 80℃, indicating good heat dissipation capabilities.

The coefficient of thermal expansion for RT/duroid 6006 is 47 ppm/℃ in the X-axis, 34 ppm/℃ in the Y-axis, and 117 ppm/℃ in the Z-axis at 23℃ and 50% RH, which means it can withstand temperature changes without significant dimensional variations.

The thermal decomposition temperature (Td) of RT/duroid 6006 is 500℃, ensuring its stability in high-temperature environments.

With a density of 2.7 g/cm³, RT/duroid 6006 strikes a balance between lightweight design and robust performance.

Other properties include specific heat measuring 0.97 j/g/k (0.231 BTU/ib/OF), copper peel strength of 14.3 pli (2.5 N/mm) after solder float, V-0 flammability rating based on UL 94 testing, and full compatibility with lead-free processes, making it environmentally friendly.

Property |
RT/duroid 6006 |
Direction |
Units |
Condition |
Test Method |

Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |

Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |

Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |

Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |

Volume Resistivity | 7 x 10^{7} |
Mohm.cm | A | IPC 2.5.17.1 | |

Surface Resistivity | 2 x 10^{7} |
Mohm | A | IPC 2.5.17.1 | |

Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||

Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |

Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |

Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |

Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||

Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |

Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |

Ultimate Strain | 33 | Z | % | ||

Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |

Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |

Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |

Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |

Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |

Coefficient of Thermal Expansion | 47 34 117 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |

Td | 500 | ℃ TGA | ASTM D3850 | ||

Density | 2.7 | g/cm^{3} |
ASTM D792 | ||

Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/ ^{O}F) |
Calculated | ||

Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |

Flammability | V-0 | UL 94 | |||

Lead-free Process Compatible | Yes |

**PCB Capability (RT/duroid 6006)**

For RT/duroid 6006 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.

RT/duroid 6006 PCBs have wide thickness. These are the standard thickness such as 10 mils, 25 mils, 50 mils and 75mils etc. Finished copper on PCB is 1oz and 2oz.

Our maximum PCB size on RT/duroid 6006 laminate is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.

Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper and OSP etc. for pads protection.

PCB material: | Ceramic-PTFE Composites |

Designation: | RT/duroid 6006 |

Dielectric constant: | 6.15 |

Dissipation factor | 0.0027 10GHz |

Layer count: | Single-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid types |

Dielectric thickness: | 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) |

Copper weight: | 1oz (35µm), 2oz (70µm) |

PCB size: | ≤400mm X 500mm |

Solder mask: | Green, Black, Blue, Yellow, Red etc. |

Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |

**A Piece of RT/duroid 6006 PCB**

Now on the screen is a type of 50mil RT/duroid 6006 PCB with immersion silver for patch antennas.

RT/duroid 6006 PCBs can be used in applications of 8 to 40 GHz of telecommunications, aerospace and defence etc. We can also see their applications in aircraft collision avoidance systems, ground radar warning systems and satellite communications systems etc.

**Conclusion**

That concludes our overview of the remarkable properties and characteristics of the RT/duroid 6006 and our printed circuit boards on it. If you have any further questions or would like more information, please feel free to ask. Thank you for your attention.

Recommended Products

PRODUCTS DETAILS

Rogers RT/duroid 6006 High Frequency PCB on 25mil, 50mil and 75mil with Immersion Gold for Ground Radar Warning

MOQ: | 1 PIECE |

Price: | USD2 .99-9.99 per piece |

Standard Packaging: | VACUUM |

Delivery Period: | 8-9 WORKING DAY |

Payment Method: | T/T,Paypal |

Supply Capacity: | 50000 PIECE PER MONTH |

Detail Information

Place of Origin

CHINA

Brand Name

Bicheng Enterprise Limited

Certification

UL

Model Number

BIC-0308-V3.08

Board Material:

Polyimide 25μm

Board Thickness:

0.20 Mm

Surface/Inner Layer Cu Thickness:

35 µm

Surface Finish:

Immersion Gold

Coverlay Colour:

Yellow

Color Of Silkscreen:

White

Function:

100% Pass Electrical Test

Number Of Layers:

2

Minimum Order Quantity:

1 PIECE

Price:

USD2 .99-9.99 per piece

Packaging Details:

VACUUM

Delivery Time:

8-9 WORKING DAY

Payment Terms:

T/T,Paypal

Supply Ability:

50000 PIECE PER MONTH

Product Description

**Introduction:**

RT/duroid 6006 high-frequency PCBs are ceramic-PTFE composites designed for electronic and microwave circuit applications that require a high dielectric constant. These PCBs offer several advantages, including reduced circuit size, low signal loss, and repeatable circuit performance.

**RT/duroid 6006 Typical Properties:**

**Dielectric Properties:**

- Process Dielectric Constant (εProcess): The RT/duroid 6006 exhibits a process dielectric constant of 6.15±0.15 at 10 GHz and 23℃. This ensures excellent signal performance and stability.
- Design Dielectric Constant (εDesign): The design dielectric constant measures at 6.45 and covers a frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method. The high dielectric constant allows for greater space in PCB circuit design, enabling product miniaturization.
- Dissipation Factor (tanδ): The RT/duroid 6006 has a low dissipation factor of 0.0027 at 10 GHz, ensuring minimal signal loss and high signal integrity.
- Thermal Coefficient of Dielectric Constant: The material has a thermal coefficient of dielectric constant of -410 ppm/℃ in the temperature range of -50℃ to 170℃. This indicates that the RT/duroid 6006 has variant dielectric properties across a wide temperature spectrum, making it unsuitable for millimeter-wave applications and environments with significant temperature changes.

**Electrical Properties:**

- Volume Resistivity: The volume resistivity of the RT/duroid 6006 is measured at 7 x 10^7 Mohm.cm, indicating excellent electrical insulation capabilities.
- Surface Resistivity: The surface resistivity measures 2 x 10^7 Mohm, highlighting the material's strong electrical performance.

**Mechanical Properties:**

- Tensile Properties: The RT/duroid 6006 exhibits impressive tensile properties. The Young's modulus measures 627 MPa (91 kpsi) in the X-axis and 517 MPa (75 kpsi) in the Y-axis. The ultimate stress is 20 MPa (2.8 kpsi) in the X-axis and 17 MPa (2.5 kpsi) in the Y-axis. The ultimate strain ranges from 12% to 13% in the X-axis and from 4% to 6% in the Y-axis.
- Compressive Properties: In the Z-axis, the material has a Young's modulus of 1069 MPa (115 kpsi) and an ultimate stress of 54 MPa (7.9 kpsi). The ultimate strain in the Z-axis measures at 33%.
- Flexural Modulus: The RT/duroid 6006 has a flexural modulus of 2634 MPa (382 kpsi) in the X-axis and 1951 MPa (283 kpsi) in the Y-axis. The ultimate stress in the X-axis is 38 MPa (5.5 kpsi).

**Other Properties:**

- Deformation under Load: The material exhibits low deformation rates under load. In the Z-axis, the deformation rate is 0.33% after 24 hours at 50℃ and 7 MPa. At 150℃ and 7 MPa, the deformation rate is 2.1% in the Z-axis, showcasing dimensional stability under pressure and heat.
- Moisture Absorption: The RT/duroid 6006 has a moisture absorption rate of 0.05%, ensuring reliability and stability in humid environments.
- Thermal Conductivity: The material has a thermal conductivity of 0.49 W/m/k at 80℃, indicating good heat dissipation capabilities.
- Coefficient of Thermal Expansion: The coefficient of thermal expansion is 47 ppm/℃ in the X-axis, 34 ppm/℃ in the Y-axis, and 117 ppm/℃ in the Z-axis at 23℃ and 50% RH, allowing the material to withstand temperature changes without significant dimensional variations.
- Thermal Decomposition Temperature (Td): The material has a thermal decomposition temperature of 500℃, ensuring stability in high-temperature environments.
- Density: The RT/duroid 6006 has a density of 2.7 g/cm³, striking a balance between lightweight design and robust performance.
- Specific Heat: The specific heat measures 0.97 j/g/k (0.231 BTU/ib/OF), indicating its heat absorption and retention capabilities.
- Copper Peel Strength: The material exhibits a copper peel strength of 14.3 pli (2.5 N/mm) after undergoing solder float, ensuring secure adhesion and reliability in demanding applications.
- Flammability: The material has achieved a V-0 rating for flammability based on UL 94 testing.
- Lead-Free Compatibility: The RT/duroid 6006 is fully compatible with lead-free processes, making it an ideal choice forRT/duroid 6006 high-frequency PCBs are ceramic-PTFE composites specifically designed for electronic and microwave circuit applications that require a high dielectric constant. These PCBs offer various advantages, such as enabling circuit size reduction, low signal loss, and consistent circuit performance.

The dielectric properties of RT/duroid 6006 are noteworthy. It has a process dielectric constant (εProcess) of 6.15±0.15 at 10 GHz and 23℃, ensuring excellent signal performance and stability. The design dielectric constant (εDesign) is 6.45, covering a frequency range of 8 GHz to 40 GHz using the Differential Phase Length Method. This high dielectric constant facilitates greater space in PCB circuit design, enabling product miniaturization.

The dissipation factor (tanδ) of RT/duroid 6006 is impressively low at 0.0027 at 10 GHz, which ensures minimal signal loss and high signal integrity.

When it comes to thermal properties, RT/duroid 6006 exhibits a thermal coefficient of dielectric constant of -410 ppm/℃ in the temperature range of -50℃ to 170℃. This indicates that the material has varying dielectric properties across a wide temperature spectrum, making it unsuitable for millimeter-wave applications and environments with significant temperature fluctuations.

In terms of electrical properties, RT/duroid 6006 demonstrates excellent electrical insulation capabilities with a volume resistivity of 7 x 10^7 Mohm.cm and a surface resistivity of 2 x 10^7 Mohm.

Regarding mechanical properties, RT/duroid 6006 has impressive tensile properties. In the X-axis, it has a Young's modulus of 627 MPa (91 kpsi) and an ultimate stress of 20 MPa (2.8 kpsi). In the Y-axis, the Young's modulus is 517 MPa (75 kpsi) and the ultimate stress is 17 MPa (2.5 kpsi). The ultimate strain ranges from 12% to 13% in the X-axis and from 4% to 6% in the Y-axis.

In compressive properties, RT/duroid 6006 has a Young's modulus of 1069 MPa (115 kpsi) in the Z-axis and an ultimate stress of 54 MPa (7.9 kpsi). The ultimate strain in the Z-axis measures at 33%.

The material's flexural modulus is 2634 MPa (382 kpsi) in the X-axis and 1951 MPa (283 kpsi) in the Y-axis. The ultimate stress in the X-axis is 38 MPa (5.5 kpsi).

Under load, RT/duroid 6006 exhibits a deformation rate of 0.33% in the Z-axis after 24 hours at 50℃ and 7 MPa. At 150℃ and 7 MPa, the deformation rate is 2.1% in the Z-axis, highlighting the material's dimensional stability under pressure and heat.

The moisture absorption of RT/duroid 6006 is remarkably low at 0.05%, ensuring its reliability and stability in humid environments.

Thermal conductivity of the material is 0.49 W/m/k at 80℃, indicating good heat dissipation capabilities.

The coefficient of thermal expansion for RT/duroid 6006 is 47 ppm/℃ in the X-axis, 34 ppm/℃ in the Y-axis, and 117 ppm/℃ in the Z-axis at 23℃ and 50% RH, which means it can withstand temperature changes without significant dimensional variations.

The thermal decomposition temperature (Td) of RT/duroid 6006 is 500℃, ensuring its stability in high-temperature environments.

With a density of 2.7 g/cm³, RT/duroid 6006 strikes a balance between lightweight design and robust performance.

Other properties include specific heat measuring 0.97 j/g/k (0.231 BTU/ib/OF), copper peel strength of 14.3 pli (2.5 N/mm) after solder float, V-0 flammability rating based on UL 94 testing, and full compatibility with lead-free processes, making it environmentally friendly.

Property |
RT/duroid 6006 |
Direction |
Units |
Condition |
Test Method |

Dielectric Constant,εProcess | 6.15±0.15 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |

Dielectric Constant,εDesign | 6.45 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |

Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |

Thermal Coefficient of ε | -410 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |

Volume Resistivity | 7 x 10^{7} |
Mohm.cm | A | IPC 2.5.17.1 | |

Surface Resistivity | 2 x 10^{7} |
Mohm | A | IPC 2.5.17.1 | |

Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||

Young's Modulus | 627(91) 517(75) | X Y | MPa(kpsi) | A | |

Ultimate Stress | 20(2.8) 17(2.5) | X Y | MPa(kpsi) | A | |

Ultimate Strain | 12 to 13 4 to 6 | X Y | % | A | |

Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||

Young's Modulus | 1069 (115) | Z | MPa(kpsi) | A | |

Ultimate Stress | 54(7.9) | Z | MPa(kpsi) | A | |

Ultimate Strain | 33 | Z | % | ||

Flexural Modulus | 2634 (382) 1951 (283) | X | MPa(kpsi) | A | ASTM D790 |

Ultimate Stress | 38 (5.5) | X Y | MPa(kpsi) | A | |

Deformation under load | 0.33 2.1 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |

Moisture Absorption | 0.05 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |

Thermal Conductivity | 0.49 | W/m/k | 80℃ | ASTM C518 | |

Coefficient of Thermal Expansion | 47 34 117 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |

Td | 500 | ℃ TGA | ASTM D3850 | ||

Density | 2.7 | g/cm^{3} |
ASTM D792 | ||

Specific Heat | 0.97(0.231) | j/g/k (BTU/ib/ ^{O}F) |
Calculated | ||

Copper Peel | 14.3 (2.5) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |

Flammability | V-0 | UL 94 | |||

Lead-free Process Compatible | Yes |

**PCB Capability (RT/duroid 6006)**

For RT/duroid 6006 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.

RT/duroid 6006 PCBs have wide thickness. These are the standard thickness such as 10 mils, 25 mils, 50 mils and 75mils etc. Finished copper on PCB is 1oz and 2oz.

Our maximum PCB size on RT/duroid 6006 laminate is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.

Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper and OSP etc. for pads protection.

PCB material: | Ceramic-PTFE Composites |

Designation: | RT/duroid 6006 |

Dielectric constant: | 6.15 |

Dissipation factor | 0.0027 10GHz |

Layer count: | Single-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid types |

Dielectric thickness: | 10mil(0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.905mm), 100mil(2.54mm) |

Copper weight: | 1oz (35µm), 2oz (70µm) |

PCB size: | ≤400mm X 500mm |

Solder mask: | Green, Black, Blue, Yellow, Red etc. |

Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc.. |

**A Piece of RT/duroid 6006 PCB**

Now on the screen is a type of 50mil RT/duroid 6006 PCB with immersion silver for patch antennas.

RT/duroid 6006 PCBs can be used in applications of 8 to 40 GHz of telecommunications, aerospace and defence etc. We can also see their applications in aircraft collision avoidance systems, ground radar warning systems and satellite communications systems etc.

**Conclusion**

That concludes our overview of the remarkable properties and characteristics of the RT/duroid 6006 and our printed circuit boards on it. If you have any further questions or would like more information, please feel free to ask. Thank you for your attention.

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