MOQ: | 1 PIECE |
Price: | USD2 .99-7.99 per piece |
Standard Packaging: | VACUUM |
Delivery Period: | 8-9 WORKING DAY |
Payment Method: | T/T,Paypal |
Supply Capacity: | 50000 PIECE PER MONTH |
Unveiling the Unmatched Prowess of TMM10: A Paradigm Shift in PCB Materials
Prepare to embark on an extraordinary journey through the realm of TMM10, a true game-changer in the world of PCB materials. In this captivating exploration, we unravel the unparalleled attributes that set TMM10 apart from the competition. Brace yourself as we delve into the realm of exceptional performance and unrivaled capabilities that TMM10 brings to the table.
Elevating the Standards of Electrical Excellence:
TMM10 emerges as a formidable force, boasting awe-inspiring electrical properties that redefine the boundaries of signal transmission. With a dielectric constant (εProcess) of 9.20±0.23 at 10 GHz, this material sets the stage for flawless signal integrity and unmatched communication within high-frequency circuits. Brace yourself for an unparalleled experience as TMM10 showcases a dielectric constant (εDesign) of 9.8, delivering unwavering performance across an impressive frequency range of 8 GHz to 40 GHz, as determined by the Differential Phase Length Method.
Unparalleled Thermal Stability:
TMM10 effortlessly conquers the challenges posed by fluctuating temperatures, emerging as a champion of thermal stability. Witness its remarkable thermal coefficient of dielectric constant, measuring at -38 ppm/℃ within the temperature range of -55℃ to 125℃. Marvel at its ability to maintain peak performance, even amidst extreme temperature variations.
Indestructible Mechanical Might:
TMM10 is not one to shy away from the rigors of demanding environments. It presents an unwavering display of mechanical strength, showcasing a flexural strength (MD/CMD) of 13.62 kpsi and a flexural modulus (MD/CMD) of 1.79 Mpsi. Prepare to be astounded as TMM10 defies bending and deformation, standing tall against the trials of countless applications.
Unleashing the Power of Thermal Conductivity:
Harnessing the force of efficient heat dissipation, TMM10 leaves competitors in its wake. Marvel at its thermal conductivity of 0.76 W/m/K in the Z-direction at 80℃, as it orchestrates seamless heat transfer, thwarting the threat of overheating and guaranteeing peak performance for your electronic masterpieces.
Reliability and Harmony:
In the pursuit of reliability and compatibility, TMM10 emerges triumphant. With a decomposition temperature (Td) of 425℃, this material scoffs at the notion of instability, even in the face of extreme temperatures. Moreover, TMM10 dances in perfect harmony with lead-free processes, aligning with industry standards and championing environmentally conscious manufacturing practices.
A Symphony of Remarkable Features:
Beyond its exceptional electrical and thermal prowess, TMM10 boasts a symphony of additional remarkable attributes. Revel in its volume resistivity of 2 x 10^8 Mohm.cm and surface resistivity of 4 x 10^7 Mohm, showcasing unwavering reliability. Witness its moisture absorption rate of 0.09% (for 1.27mm thickness) and a specific gravity of 2.77, embodying the essence of dependability and performance in diverse operating conditions.
Unleash the Limitless Potential of TMM10:
TMM10 unveils a world of endless possibilities for high-frequency applications, revolutionizing the way we approach telecommunications equipment, aerospace systems, and advanced electronics. With TMM10 by your side, prepare to witness unrivaled reliability and performance that elevate your creations to unparalleled heights.
Experience the unrivaled power of TMM10 and unlock the full potential of your electronic designs. Embrace TMM10 and embark on a transformative journey, as you transcend the boundaries of excellence in high-frequency applications.
TMM10 Typical Value | ||||||
Property | TMM10 | Direction | Units | Condition | Test Method | |
Dielectric Constant, εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant, εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -38 | - | ppm/℃ | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
Decomposition Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - X Y Z | 21,21,20 | X,Y,Z | ppm/℃ | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lbs/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
Moisture Absorption | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.2 | |||||
Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
MOQ: | 1 PIECE |
Price: | USD2 .99-7.99 per piece |
Standard Packaging: | VACUUM |
Delivery Period: | 8-9 WORKING DAY |
Payment Method: | T/T,Paypal |
Supply Capacity: | 50000 PIECE PER MONTH |
Unveiling the Unmatched Prowess of TMM10: A Paradigm Shift in PCB Materials
Prepare to embark on an extraordinary journey through the realm of TMM10, a true game-changer in the world of PCB materials. In this captivating exploration, we unravel the unparalleled attributes that set TMM10 apart from the competition. Brace yourself as we delve into the realm of exceptional performance and unrivaled capabilities that TMM10 brings to the table.
Elevating the Standards of Electrical Excellence:
TMM10 emerges as a formidable force, boasting awe-inspiring electrical properties that redefine the boundaries of signal transmission. With a dielectric constant (εProcess) of 9.20±0.23 at 10 GHz, this material sets the stage for flawless signal integrity and unmatched communication within high-frequency circuits. Brace yourself for an unparalleled experience as TMM10 showcases a dielectric constant (εDesign) of 9.8, delivering unwavering performance across an impressive frequency range of 8 GHz to 40 GHz, as determined by the Differential Phase Length Method.
Unparalleled Thermal Stability:
TMM10 effortlessly conquers the challenges posed by fluctuating temperatures, emerging as a champion of thermal stability. Witness its remarkable thermal coefficient of dielectric constant, measuring at -38 ppm/℃ within the temperature range of -55℃ to 125℃. Marvel at its ability to maintain peak performance, even amidst extreme temperature variations.
Indestructible Mechanical Might:
TMM10 is not one to shy away from the rigors of demanding environments. It presents an unwavering display of mechanical strength, showcasing a flexural strength (MD/CMD) of 13.62 kpsi and a flexural modulus (MD/CMD) of 1.79 Mpsi. Prepare to be astounded as TMM10 defies bending and deformation, standing tall against the trials of countless applications.
Unleashing the Power of Thermal Conductivity:
Harnessing the force of efficient heat dissipation, TMM10 leaves competitors in its wake. Marvel at its thermal conductivity of 0.76 W/m/K in the Z-direction at 80℃, as it orchestrates seamless heat transfer, thwarting the threat of overheating and guaranteeing peak performance for your electronic masterpieces.
Reliability and Harmony:
In the pursuit of reliability and compatibility, TMM10 emerges triumphant. With a decomposition temperature (Td) of 425℃, this material scoffs at the notion of instability, even in the face of extreme temperatures. Moreover, TMM10 dances in perfect harmony with lead-free processes, aligning with industry standards and championing environmentally conscious manufacturing practices.
A Symphony of Remarkable Features:
Beyond its exceptional electrical and thermal prowess, TMM10 boasts a symphony of additional remarkable attributes. Revel in its volume resistivity of 2 x 10^8 Mohm.cm and surface resistivity of 4 x 10^7 Mohm, showcasing unwavering reliability. Witness its moisture absorption rate of 0.09% (for 1.27mm thickness) and a specific gravity of 2.77, embodying the essence of dependability and performance in diverse operating conditions.
Unleash the Limitless Potential of TMM10:
TMM10 unveils a world of endless possibilities for high-frequency applications, revolutionizing the way we approach telecommunications equipment, aerospace systems, and advanced electronics. With TMM10 by your side, prepare to witness unrivaled reliability and performance that elevate your creations to unparalleled heights.
Experience the unrivaled power of TMM10 and unlock the full potential of your electronic designs. Embrace TMM10 and embark on a transformative journey, as you transcend the boundaries of excellence in high-frequency applications.
TMM10 Typical Value | ||||||
Property | TMM10 | Direction | Units | Condition | Test Method | |
Dielectric Constant, εProcess | 9.20±0.23 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant, εDesign | 9.8 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0022 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -38 | - | ppm/℃ | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 | |
Decomposition Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - X Y Z | 21,21,20 | X,Y,Z | ppm/℃ | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 | |
Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lbs/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 13.62 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.79 | X,Y | Mpsi | A | ASTM D790 | |
Moisture Absorption | 1.27mm (0.050") | 0.09 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.2 | |||||
Specific Gravity | 2.77 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.74 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |