RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||CHINA|
|Brand Name:||Bicheng Enterprise Limited|
|Minimum Order Quantity:||1 PIECE|
|Price:||USD2 .99-7.99 per piece|
|Delivery Time:||8-9 WORKING DAY|
|Supply Ability:||50000 PIECE PER MONTH|
|Board Material:||Polymide 25 µm||Board Thickness:||0.20 Mm|
|Surface/Inner Layer Cu Thickness:||35 µm||Surface Finish:||Immersion Gold|
|Coverlay Colour:||Yellow||Color Of Silkscreen:||White|
|Function:||100% Pass Electrical Test||Number Of Layers:||4|
Introducing TMM13i: Unleashing the Power of High-Performance PCB Substrate
Hey there, tech enthusiasts! Get ready to dive into the world of advanced PCB substrates as we unveil the remarkable features of TMM13i. This high-performance wonder is set to revolutionize your electronic designs, delivering exceptional electrical and thermal properties that will take your products to new heights. Let's explore the key characteristics of TMM13i that make it a game-changer in the industry.
Unleashing Electrical Superiority:
TMM13i boasts an impressive dielectric constant of 12.2 at the design stage, ensuring enhanced signal integrity within a frequency range of 8 GHz to 40 GHz. With a precise dielectric constant of 12.85±0.35 during the manufacturing process, you can trust TMM13i to maintain consistent performance. Say goodbye to signal loss and hello to high-speed data transmission!
Efficient Power Management:
Say hello to minimal energy loss with TMM13i's ultra-low dissipation factor of 0.0019. This remarkable characteristic ensures efficient power management, allowing your devices to operate optimally even under demanding conditions. TMM13i lets you make the most out of your power resources without compromising on performance.
Reliable Insulation and Electrical Strength:
With an insulation resistance exceeding 2000 Gohm, TMM13i guarantees robust insulation performance, promoting reliable and stable operation of your electronic circuits. Additionally, its superior electrical strength of 213 V/mil safeguards against electrical breakdown, ensuring the longevity of your designs.
TMM13i is engineered to excel in thermal management. Its coefficient of thermal expansion (CTE) of 19 ppm/K in the X and Y directions, and 20 ppm/K in the Z direction, enables seamless integration with various components, even in extreme temperature conditions. With a decomposition temperature (Td) of 425°C, TMM13i can handle high-temperature environments with ease, providing you with peace of mind.
Rock-Solid Mechanical Performance:
TMM13i delivers exceptional mechanical strength and durability. Its copper peel strength after thermal stress reaches an impressive 4.0 lb/inch (0.7 N/mm), making it highly resistant to delamination and ensuring the integrity of your PCB assemblies. This remarkable feature guarantees the longevity and reliability of your electronic devices.
Built for the Future:
In line with industry demands, TMM13i is lead-free process compatible, making it environmentally friendly and compliant with the latest regulations. You can confidently embrace sustainable manufacturing practices without compromising on performance or reliability.
TMM13i: Redefining PCB Substrate Excellence:
With its exceptional electrical properties, efficient power management, reliable insulation, and outstanding thermal and mechanical performance, TMM13i stands at the forefront of high-performance PCB substrates. Whether you're working on high-speed data applications, power electronics, or demanding environments, TMM13i is the substrate that will elevate your designs to new horizons.
Ready to unlock the full potential of your electronic designs? Choose TMM13i and witness the difference it can make in your next project.
Stay tuned for more electrifying updates and technological breakthroughs. Until then, keep innovating!
PCB Capability (TMM13i)
|Dielectric Constant,εDesign||12.2||-||-||8GHz to 40 GHz||Differential Phase Length Method|
|Dielectric Constant,εProcess||12.85±0.35||Z||10 GHz||IPC-TM-650 220.127.116.11|
|Dissipation Factor (process)||0.0019||Z||-||10 GHz||IPC-TM-650 18.104.22.168|
|Insulation Resistance||>2000||-||Gohm||C/96/60/95||ASTM D257|
|Electrical Strength (dielectric strength)||213||Z||V/mil||-||IPC-TM-650 method 22.214.171.124|
|Thermal Coefficient of dielectric constant||-70||-||ppm/°K||-55℃-125℃||IPC-TM-650 126.96.36.199|
|Decompositioin Temperature(Td)||425||425||℃TGA||-||ASTM D3850|
|Coefficient of Thermal Expansion - X||19||X||ppm/K||0 to 140 ℃||ASTM E 831 IPC-TM-650, 2.4.41|
|Coefficient of Thermal Expansion - Y||19||Y||ppm/K||0 to 140 ℃||ASTM E 831 IPC-TM-650, 2.4.41|
|Coefficient of Thermal Expansion - Z||20||Z||ppm/K||0 to 140 ℃||ASTM E 831 IPC-TM-650, 2.4.41|
|Copper Peel Strength after Thermal Stress||4.0 (0.7)||X,Y||lb/inch (N/mm)||after solder float 1 oz. EDC||IPC-TM-650 Method 2.4.8|
|Moisture Absorption||1.27mm (0.050")||0.16||-||%||D/24/23||ASTM D570|
|Specific Gravity||3||-||-||A||ASTM D792|
|Lead-Free Process Compatible||YES||-||-||-||-|
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