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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

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Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni

Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni

  • Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
  • Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
  • Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
  • Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
  • Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0294-V2.94
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-7.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polymide 25 µm Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 4

Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of flexible printed circuit for the application of Digital Electronics. It’s a 4 layer FPC at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffener is applied on the two ends.

 

Parameter and data sheet

Size of Flexible PCB 60.87 X 130.42mm
Number of Layers 4
Board Type Flexible PCB
Board Thickness 0.20mm
Board Material Polyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes 35 µm
Surface Cu thickness 35 µm
   
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material FR-4
Stiffener Thickness 1.0mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni 0

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Controllability of electrical parameter design

The end can be whole soldered

Continuity of processing

Small quantity order is accepted

Eligible products rate of first production: >95%

 

Applications

Mobile phone built-in antenna FPC, FFC for industrial control equipment, medical equipment controller

 

Brief Introduction of FPC

Flexible Printed Circuit Board (FPC) is referred to as "soft board". In the industry, FPC is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, folded. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera and other fields or products.

 

FPC also has the advantages of good heat dissipation, solderability, easy mounting and low cost.

 

Flexible printed circuit board has one layer, two layers and multilayer board. The base material is polyimide clad laminate. This kind of material has high heat resistance and good dimensional stability. It is the final product through pressing with the coating film which has both mechanical protection and good electrical insulation. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metallized to realize the electrical connection of inner and outer layers.

 

The function of flexible circuit board can be divided into four kinds, namely, lead line, printed circuit, connector and multifunction integrated system, which cover computer, computer peripheral auxiliary system, consumer household electrical appliance and automobile, etc.

 
 
Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni 1
Multilayer Flexible Printed Circuit 4-layer FPC on Polyimide With FR4 Stiffener and Immersion Gold for Digital Electroni 2
 
 
 
 
 
 
 
 
 
 
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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