High-Performance PCB Materials: RO4003C and FR-4 (S1000-2M)

Introduction:
When it comes to achieving optimal performance in your electronic designs, choosing the right PCB materials is crucial. In this article, we will explore two exceptional options: RO4003C and FR-4 (S1000-2M). These materials offer unique properties that cater to different application requirements, ensuring reliable and efficient performance.

RO4003C PCB Material:

• Rogers RO4003C: Hydrocarbon Ceramic woven glass
• Dielectric Constant (DK): 3.38 at 10 GHz
• Dissipation Factor: 0.0027 at 10 GHz
• Tg (Glass Transition Temperature): >280 °C
• Td (Decomposition Temperature): >425 °C

FR-4 (S1000-2M) PCB Material:

• Shengyi High Tg, Low CTE Epoxy Glass
• Dielectric Constant (DK): 4.6 at 1 GHz
• Dissipation Factor: 0.0018 at 1 GHz
• Tg (Glass Transition Temperature): >185 °C
• Td (Decomposition Temperature): >180 °C

Features and Attentions:
RO4003C laminates offer tight control over dielectric constant (Dk) and low loss, providing excellent performance at a fraction of the cost compared to conventional microwave laminates. It utilizes both 1080 and 1674 glass fabric styles, meeting the same electrical performance specifications. However, please note that RO4003C materials are non-brominated and not UL 94 V-0 rated.

On the other hand, FR-4 (S1000-2M) boasts anti-CAF capability, lead-free compatibility, exceptional thermal and through-hole reliability, and excellent mechanical processability.

Stackup:

• This 4-layer rigid PCB stackup consists of:
• Copper Layer 1: 35 μm (1oz)
• Rogers 4003C Core: 12mil (0.305mm)
• Copper Layer 2: 35 μm (1oz)
• Prepreg: 0.1mm
• Core S1000-2M FR-4
• Prepreg: 0.1mm
• Copper Layer 1: 35 μm (1oz)
• Rogers 4003C Core: 12mil (0.305mm)
• Copper Layer 2: 35 μm (1oz)
• Construction Details:
• Board Dimensions: 76mm x 65mm
• Minimum Trace/Space: 4/7 mils
• Minimum Hole Size: 0.2mm
• No Blind Vias
• Finished Board Thickness: 1.6mm
• Finished Cu Weight: 1oz (1.4 mils) each layer
• Via Plating Thickness: 25 μm
• Surface Finish: Immersion Gold (ENIG)
• Top Silkscreen: White
• Bottom Silkscreen: White
• Top Solder Mask: Red
• Bottom Solder Mask: Red
• Top 6 mil / 7 mils trace and gap with 50-ohm differential impedance controlled
• 100% Electrical Test conducted prior to shipment

PCB Statistics:

• Components: 29
• Total Pads: 87
• Thru-Hole Pads: 44
• Top SMT Pads: 32
• Bottom SMT Pads: 11
• Vias: 70
• Nets: 5
• Artwork Supplied: Gerber RS-274-X
• Quality Standard: IPC-Class-2
• Availability: Worldwide

Typical Applications:

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNB's for Direct Broadcast Satellites

For any supports or custom assistance, contact Sally Mao at sales@bichengpcb.com. Bicheng is committed to enabling advancements in wireless technology through specialized RF/microwave fabrication capabilities.

Conclusion:
Choosing the right PCB material is vital for achieving optimal performance in your electronic designs. Both RO4003C and FR-4 (S1000-2M) offer unique advantages, catering to various application needs. Consider these exceptional materials to ensure reliable, high-performance PCB solutions.