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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

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Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development

Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development

  • Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development
  • Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development
  • Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development
Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0285-V2.85
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-6.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
Contact Now
Detailed Product Description
Board Material: Polyimide 50 µm Board Thickness: 0.25 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C

 

In the world of printed circuit boards (PCBs), selecting the right substrate material is crucial for achieving optimal performance and reliability. Among the top contenders in the market are Rogers' RO3010, RO3006, and RO4003C substrates. These advanced materials offer exceptional electrical properties, thermal stability, and reliability, making them ideal choices for a wide range of applications. In this article, we will delve into the key features and advantages of each substrate and highlight their suitability for various PCB designs.

 

RO3010: Ceramic-filled PTFE Composite for High-frequency Applications
Rogers' RO3010 substrate stands out with its exceptional electrical performance, making it an excellent choice for high-frequency applications. Key features include:

  • Dielectric constant of 10.2+/- .30 at 10 GHz/23°C, ensuring consistent signal integrity.
  • Low dissipation factor of 0.0022 at 10 GHz/23°C, minimizing signal losses.
  • Impressive thermal conductivity of 0.95 W/mK, aiding in heat dissipation.
  • High thermal decomposition temperature (Td) above 500°C, ensuring stability in demanding environments.
  • Negligible moisture absorption of 0.05%, maintaining consistent performance over time.

 

RO3006: Ceramic-filled PTFE Composite for High-speed Digital and RF Applications
RO3006 is another notable substrate from Rogers, offering excellent electrical characteristics for high-speed digital and RF designs. Key features include:

  • Dielectric constant of 6.15+/- .15 at 10 GHz/23°C, facilitating controlled impedance.
  • Low dissipation factor of 0.0020 at 10 GHz/23°C, minimizing signal losses.
  • Thermal conductivity of 0.79 W/mK, aiding in heat dissipation.
  • High thermal decomposition temperature (Td) above 500°C, ensuring stability in demanding environments.
  • Minimal moisture absorption of 0.02%, maintaining consistent performance over time.

 

RO4003C: Hydrocarbon Ceramic Laminate for RF and Microwave Applications
Designed specifically for RF and microwave applications, RO4003C offers a unique blend of performance and affordability. Key features include:

  • Low dielectric constant of 3.38+/- .05 at 10 GHz/23°C, enabling precise impedance control.
  • Low dissipation factor of 0.0027 at 10 GHz/23°C, minimizing signal losses.
  • Thermal conductivity of 0.71 W/mK, facilitating heat dissipation.
  • High thermal decomposition temperature (Td) above 425°C, ensuring stability in demanding environments.
  • Controlled moisture absorption of 0.06%, maintaining consistent performance over time.

 

Stackup and Construction Details:
For the specified PCB design, a stackup without copper is employed, utilizing the aforementioned substrates:


RO3010 - 0.635mm (25mil)
Prepreg
RO3006 - 0.635mm (25mil)
Prepreg
RO4003C - 0.813mm (32mil)

 

Exploring High-performance PCB Substrates: RO3010, RO3006, and RO4003C for RF Product Development 0

 

Construction Details and Specifications:
The PCB dimensions are 3mm x 3mm with a tolerance of +/- 0.15mm. The board features a bare dielectric material, and laser profiling is employed for contouring. The finished board thickness is 2.3mm, while other specifics such as copper weight, via plating thickness, and surface finish are not provided in the given information. Additionally, the PCB undergoes a 100% electrical test prior to shipment to ensure its quality.

 

Artwork Standards and Availability:
The supplied artwork follows the Gerber RS-274-X standard, widely accepted in the PCB manufacturing industry. The manufacturing process adheres to the IPC-Class-2 standard, ensuring reliable and consistent quality. These PCB substrates and manufacturing services are available worldwide.

 

Conclusion:
Rogers' RO3010, RO3006, and RO4003C PCB substrates offer exceptional electrical properties, thermal stability, and reliability for a variety of applications. Whether you require high-frequency performance, high-speed digital capabilities, or RF/microwave functionality, these substrates provide the foundation for reliable and efficient PCB designs. For more technical inquiries or to explore these substrates further, reach out to Sally Mao at sales30@bichengpcb.com for expert assistance and guidance.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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