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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications

Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications

  • Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications
  • Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications
  • Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications
  • Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications
Taconic RF-30A PCB: Redefining RF Substrates for High-Volume Applications
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-0262-V2.62
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-6.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 1 Glass Epoxy: Polyimide (PI) 25um
Final Foil: 1 Oz Final Height Of PCB: 0.15 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Yellow
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

RF-30A, a cutting-edge organic-ceramic laminate developed by Taconic, is revolutionizing the world of RF substrates. Leveraging Taconic's expertise in ceramic filler and PTFE coating technology, RF-30A offers exceptional performance and cost-effectiveness, making it the ideal choice for high-volume commercial microwave and radio frequency applications.

 

Unparalleled Stability:
RF-30A exhibits remarkable electrical and mechanical stability, surpassing the requirements of even the most demanding designers. The low loss dielectric substrate, coupled with low-profile copper foil, ensures consistent electrical properties, resulting in improved passive intermodulation distortion (PIMD) levels and lower insertion loss across a wide frequency range. Its exceptional dimensional stability, lower coefficient of thermal expansion (CTE), and enhanced rigidity minimize the impact of external factors on RF components.

 

Reliability and Ease of Use:
With excellent peel strength for 1/2 ounce and 1 ounce RT copper, RF-30A excels in scenarios that necessitate rework or repeated reflow processes. Moreover, its ultra-low moisture absorption rate, combined with a stable loss tangent, minimizes phase shift in varying temperature and humidity environments. The substrate's dimensional stability further contributes to consistent phase and impedance properties across the broadband frequency spectrum.

 

Optimized for Performance:
RF-30A has been meticulously engineered with ceramic components to achieve a low Z-axis CTE, enhancing the reliability of plated-through holes (PTH) and facilitating the fabrication of multilayer circuits. These properties also contribute to improved PIMD performance, ensuring optimal functionality in critical RF applications.

 

Impressive Features:

  • Dielectric constant (DK) of 2.97 +/- 0.05 at 1.9 GHz and 23°C
  • Dissipation factor of 0.0013 at 1.9 GHz and 23°C
  • Thermal conductivity of 0.42 W/m/K
  • CTE in X-axis of 8 ppm/°C, Y-axis of 11 ppm/°C, and Z-axis of 60 ppm/°C
  • Density (specific gravity) of 2.16 g/cm³


Key Benefits:

  • Excellent PIM values, measuring below -160 dBc, ensuring high performance in PCBs
  • Enhanced PTH quality, contributing to improved reliability and ease of fabrication
  • Unwavering mechanical properties, ensuring stability and durability in RF applications
  • Reliable performance at high frequencies, meeting the demands of modern communication systems
  • Exceptional stability at high temperatures, enabling operation in challenging thermal environments
  • Low moisture absorption rate, minimizing the impact of humidity on performance
  • Outstanding peel strength, crucial for rework and repeated reflow processes
  • Excellent price-to-performance ratio, providing exceptional value for customers

While RF-30A offers exceptional performance and numerous benefits, it is important to acknowledge certain limitations or considerations associated with its use. Here are a few potential drawbacks to be aware of:

  1. Cost: Advanced technologies often come at a higher price point. RF-30A's cutting-edge features and performance may result in a higher cost compared to conventional RF substrates. It is essential to evaluate the project requirements and budget constraints when considering RF-30A.
  2. Availability: As a newly shipped PCB, RF-30A may have limited availability initially. High demand and production capacity constraints could potentially impact the lead time and availability of RF-30A substrates. It is advisable to plan accordingly and communicate with suppliers to ensure timely delivery.
  3. Design Complexity: RF-30A's optimized properties and advanced features may require additional design considerations. The unique characteristics of the substrate, such as low loss dielectric and low-profile copper foil, may necessitate adjustments in the design process. Collaboration with experienced RF engineers and designers is crucial to fully leverage the benefits of RF-30A.
  4. Material Handling: Due to its ceramic components, RF-30A may require specialized handling and processing techniques during fabrication and assembly. The brittle nature of ceramics demands careful attention to avoid mechanical damage. Manufacturers should ensure that their facilities and processes are equipped to handle the specific requirements of RF-30A.
  5. Application Suitability: While RF-30A excels in high-volume applications, it is essential to evaluate whether its unique features align with the specific requirements of the intended use case. Different RF substrates may offer better suitability for certain applications based on factors such as frequency range, power levels, and environmental conditions. Conducting thorough testing and considering expert advice can help determine the best substrate for a particular application.

 

It is crucial to weigh the benefits against these potential drawbacks and assess how they align with your project's requirements. By considering these factors and engaging in open communication with suppliers and industry experts, you can make informed decisions regarding the integration of RF-30A into your designs.


PCB Construction Details:

  • 2-layer rigid PCB stackup with RF-30A core (0.508 mm, 20 mils)
  • Finished board thickness of 0.6mm
  • 1oz (1.4 mils) outer layer copper weight
  • Minimum trace/space of 4/5 mils
  • Minimum hole size of 0.35mm
  • Via plating thickness of 20 μm
  • Surface finish: Bare copper


Reliable and Certified:
RF-30A adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing processes. Each board undergoes a 100% electrical test before shipment, ensuring compliance and reliability.

 

Applications and Availability:
RF-30A finds its place in various applications, including antenna and subcomponent designs, RF passive components, and power amplifiers. With its widespread availability worldwide, engineers and manufacturers can easily access this exceptional substrate.

 

Transforming RF Substrates:
RF-30A is transforming the landscape of RF substrates, offering unparalleled stability, reliability, and performance. With its advanced features and cost-effectiveness, it empowers designers to push boundaries and unlock new possibilities in high-volume RF applications. Experience the future of RF substrates with RF-30A from Taconic.

 
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Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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