MOQ: | 1 |
Price: | USD 2.99-6.99 PER PIECE |
Standard Packaging: | Vacuum |
Delivery Period: | 5-6 working days |
Payment Method: | T/T, Western Union |
Supply Capacity: | 45000 pieces per month |
Take High-Frequency Designs to New Heights with RO3203 Circuit Materials
When every cubic millimeter counts but signals need to soar above 20 GHz, turn to Rogers' RO3203 circuit materials. This woven glass-reinforced laminate optimizes both density and microwave performance to unleash your design's full potential.
RO3203 boasts a tightly controlled dielectric constant of 3.02 ±0.04 from plate to plate. This consistent value allows precise, repeatable circuit miniaturization. Even better, its ultra-low dissipation factor of just 0.0016 maintains signal clarity and integrity at the highest frequencies.
Woven E-glass reinforcement imbues boards with exceptional rigidity for complex, high-layer-count multilayer designs. RO3203 remains dimensionally stable regardless of environmental fluctuations from -55°C to 288°C. Its thermal expansion properties precisely match copper to prevent delamination or fatigue cracking.
For a recent automotive collision avoidance system, our engineers utilized RO3203 to maximize layers and routing density. A multi-chip module populated a compact 65x42mm, 2-layer board with 19 components and 52 total pads. Smallest linespace was a tight 5/6 mils.
Extensive RF and thermal cycle testing proved the design's longevity. The client anticipated RO3203 would withstand decades of heat, shock and vibration in under-hood mounting.
Competitively priced for high-volume use, RO3203 underpins mission-critical applications in automotive, wireless infrastructure, remote monitoring and more. Its 10,000 sqft size enables smooth-flowing, waste-reducing production runs.
MOQ: | 1 |
Price: | USD 2.99-6.99 PER PIECE |
Standard Packaging: | Vacuum |
Delivery Period: | 5-6 working days |
Payment Method: | T/T, Western Union |
Supply Capacity: | 45000 pieces per month |
Take High-Frequency Designs to New Heights with RO3203 Circuit Materials
When every cubic millimeter counts but signals need to soar above 20 GHz, turn to Rogers' RO3203 circuit materials. This woven glass-reinforced laminate optimizes both density and microwave performance to unleash your design's full potential.
RO3203 boasts a tightly controlled dielectric constant of 3.02 ±0.04 from plate to plate. This consistent value allows precise, repeatable circuit miniaturization. Even better, its ultra-low dissipation factor of just 0.0016 maintains signal clarity and integrity at the highest frequencies.
Woven E-glass reinforcement imbues boards with exceptional rigidity for complex, high-layer-count multilayer designs. RO3203 remains dimensionally stable regardless of environmental fluctuations from -55°C to 288°C. Its thermal expansion properties precisely match copper to prevent delamination or fatigue cracking.
For a recent automotive collision avoidance system, our engineers utilized RO3203 to maximize layers and routing density. A multi-chip module populated a compact 65x42mm, 2-layer board with 19 components and 52 total pads. Smallest linespace was a tight 5/6 mils.
Extensive RF and thermal cycle testing proved the design's longevity. The client anticipated RO3203 would withstand decades of heat, shock and vibration in under-hood mounting.
Competitively priced for high-volume use, RO3203 underpins mission-critical applications in automotive, wireless infrastructure, remote monitoring and more. Its 10,000 sqft size enables smooth-flowing, waste-reducing production runs.