RF-60TC PCB 2-layer 5mil with ENIG | 1oz Cu weight

RF-60TC: Unleashing the Power of High-Frequency Materials in RF and Microwave Applications

Introduction:

RF-60TC is an exceptional high-frequency material designed to revolutionize RF and microwave applications. With its unique combination of advanced characteristics, including high thermal conductivity, superior dielectric properties, and dimensional stability, RF-60TC offers unparalleled performance for high-power RF systems and miniaturized antenna designs. In this article, we will delve deeper into the features, advantages, PCB stackup, construction details, and typical applications of RF-60TC, showcasing its significant contributions to the field of high-frequency materials.

RF-60TC: Advancing RF and Microwave Technologies

1.Features of RF-60TC:
RF-60TC incorporates glass-reinforced PTFE ceramic composites, which serve as the foundation for its outstanding characteristics. Let's explore the key features of RF-60TC in more detail:

• Dielectric Constant (Dk) of 6.15 at 10 GHz: RF-60TC ensures reliable signal transmission and optimal performance in high-frequency applications by providing a stable and predictable dielectric constant.
• Dissipation Factor of 0.002 at 10 GHz/23°C: With an exceptionally low dissipation factor, RF-60TC minimizes signal losses and ensures efficient power transfer, resulting in improved system efficiency.
• Thermal Coefficient of Dk: RF-60TC exhibits a thermal coefficient of Dk of -3.58 ppm/°C over a wide temperature range (-50°C to 150°C). This characteristic ensures stability and consistency in varying operating conditions, enabling reliable performance across different temperature environments.
• High Thermal Conductivity: RF-60TC boasts impressive thermal conductivity values, providing efficient heat dissipation and reducing operating temperatures in high-power RF applications. It offers thermal conductivities of 0.9 W/MK (unclad), 1.0 W/MK (0.5oz), and 1.05 W/M*K (1oz), enabling effective heat management in demanding applications.
• Low Moisture Absorption: RF-60TC exhibits a minimal moisture absorption rate of only 0.03%, making it highly resistant to environmental humidity. This characteristic ensures consistent performance and mitigates the risk of moisture-related issues in RF and microwave systems.
• Dimensional Stability and Low CTE: RF-60TC demonstrates excellent dimensional stability and a low coefficient of thermal expansion (CTE). These properties make it possible to construct high layer count multilayer PCBs with improved plated through hole reliability. The low CTE reduces stress on components and ensures long-term reliability in various operating conditions.

2.Benefits of RF-60TC:

RF-60TC provides a range of benefits that make it an optimal choice for RF and microwave applications:

• Improved Loss Tangent: By minimizing dielectric losses, RF-60TC enhances signal quality and overall system performance. The material's improved loss tangent results in superior gains, efficiencies, and reduced signal distortion.
• Enhanced Heat Transfer: RF-60TC's high thermal conductivity enables efficient heat dissipation, leading to lower operating temperatures and increased design margins. The improved heat transfer capability extends the lifetime of active components and enhances the long-term reliability of RF systems.
• Dimensional Stability and Low Z-Axis CTE: RF-60TC's low CTE and dimensional stability are crucial for maintaining consistent performance over time. The material's dimensional stability supports high layer count multilayer PCBs, while the low Z-axis CTE reduces the risk of delamination and ensures reliable performance in demanding environments.
• Excellent Adhesion to Metal: RF-60TC exhibits excellent adhesion properties, particularly to low-profile and reverse-treated copper surfaces. This characteristic results in reduced insertion loss, improved signal integrity, and enhanced overall system performance.
• Stable DK over Frequency and Temperature: RF-60TC maintains a stable dielectric constant over a wide frequency range and temperature variations. This stability ensures predictable performance, making RF-60TC a reliable choice for demanding RF and microwave applications.
• Low Moisture Absorption: The minimal moisture absorption of RF-60TC prevents performance degradation in humid environments. This characteristic ensures consistent and reliable system operation, even in challenging conditions.

3.PCB Stackup and Construction Details:
RF-60TC is ideally suited for 2-layer rigid PCB stackups. The recommended construction details for utilizing RF-60TC in PCB designs are as follows:

• Copper Layer 1: 35 μm
• RF-60TC Layer: 0.127 mm (5 mils)
• Copper Layer 2: 35 μm

These specifications ensure optimal signal integrity and efficient heat dissipation while maintaining the mechanical stability of the PCB assembly.

In addition to the stackup details, the construction of the PCB should adhere to specific requirements:

• Board dimensions: The recommended dimensions are 54.19 mm x 34.47 mm, with a tolerance of +/- 0.15 mm.
• Minimum Trace/Space: The minimum trace/space requirements areI apologize, but it seems like the response got cut off again. Here are the remaining points for the PCB construction details:
• Minimum Trace/Space: The minimum trace/space requirements for RF-60TC depend on the specific manufacturing capabilities of the PCB fabrication process. It is recommended to consult with the PCB manufacturer for the appropriate trace and space dimensions.
• Hole Size: The hole size should be designed based on the specific requirements of the PCB and the components being used. Consultation with the PCB manufacturer is essential to determine the appropriate hole sizes.
• Finished Board Thickness: The finished board thickness for RF-60TC PCBs can vary based on the specific application. It is typically determined by the stackup and the mechanical requirements of the system.
• Copper Weight: The recommended copper weight for RF-60TC PCBs is 35 μm (1 oz) for both the top and bottom copper layers.
• Via Plating Thickness: The via plating thickness should be determined according to the specific requirements of the PCB design and the manufacturing capabilities of the chosen PCB fabrication process.
• Surface Finish: The surface finish of RF-60TC PCBs can be selected based on the specific needs of the application. Common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservative).
• Silkscreen Details: Silkscreen details, such as component designators, logos, and other markings, should be applied based on the specific requirements of the PCB design. The size and placement of the silkscreen elements should be carefully considered to avoid any interference with signal traces or critical components.

4.Typical Applications:
RF-60TC is well-suited for a wide range of high-frequency applications, including:

• High Power Amplifiers: The exceptional thermal conductivity of RF-60TC makes it an ideal choice for high-power amplifier designs. It enables efficient heat dissipation, leading to lower operating temperatures and improved performance and reliability.
• Miniaturized Antennas: RF-60TC's superior dielectric properties and dimensional stability contribute to the development of compact and high-performance miniaturized antennas. The material enables improved gains and efficiencies, enhancing wireless communication systems.
• GPS, Patch, and RFID Reader: RF-60TC enhances the performance of GPS, patch, and RFID reader systems by minimizing signal losses and ensuring accurate signal reception and reliable data transmission.
• Filters, Couplers & Dividers: The stable dielectric constant and low moisture absorption of RF-60TC make it suitable for constructing filters, couplers, and dividers. These components require precise signal separation and distribution, and RF-60TC delivers the necessary electrical performance and reliability.
• Satellites: RF-60TC's excellent thermal conductivity, dimensional stability, and low moisture absorption make it a valuable material for satellite applications. It ensures reliable performance in the harsh conditions of space, contributing to the success of satellite communication systems.

Conclusion:

RF-60TC represents a significant advancement in high-frequency materials, offering exceptional thermal conductivity, low dielectric losses, and dimensional stability. Its unique combination of features and benefits makes it an optimal choice for a range of RF and microwave applications. By leveraging RF-60TC's advantages, such as improved signal quality, enhanced heat transfer, dimensional stability, and reliable performance, designers can unlock new possibilities in high-power RF systems, miniaturized antennas, and other advanced applications. RF-60TC is poised to shape the future of wireless communication by enabling high-performance RF and microwave systems.