Rogers TC350 laminates are printed circuit board substrates 2-layer PCB 20mil with Hot Air Soldering Level (HASL)

Rogers TC350 laminates are printed circuit board substrates that comprise PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. They offer designers a unique combination of low insertion loss and higher thermal conductivity, enabling superior reliability and reduced operating temperatures in high-power applications.

Exceptional dielectric constant stability across various temperatures is maintained by TC350 laminates, a crucial feature for power amplifier and antenna designers in maximizing gain and minimizing bandwidth loss. This stability is also key for phase and impedance-sensitive devices like network transformers in power amplifiers or Wilkinson Power Dividers.

Impressive features contribute to the superior performance of TC350 laminates:

• The dielectric constant (Dk) remains stable at 3.5 at 1MHz, 1.8GHz, and 10GHz.
• A low dissipation factor of .0015 at 1MHz, 0.0018 at 1.8GHz, and 0.002 at 10GHz ensures minimal signal loss and excellent signal integrity.
• The thermal conductivity is high at 0.72 W/mk, facilitating efficient heat dissipation and management.
• The thermal coefficient of Dk is low at -9 ppm/°C, ensuring stable electrical performance across a temperature range of -40°C to 140°C.
• Moisture absorption is limited to 0.05%, providing excellent dimensional stability.
• Mechanical stability is achieved with a CTE x-axis of 7 ppm/°C, CTE y-axis of 7 ppm/°C, and CTE z-axis of 23 ppm/°C over a temperature range of 50°C to 150°C.

Reliability and manufacturing details are as follows:

• The recommended PCB stackup for a 2-layer rigid PCB using TC350 laminates consists of a copper layer on each side (35 μm) with a TC350 core thickness of 0.508 mm (20mil).
• PCB construction details include board dimensions of 68.35mm x 41.4mm with a thickness of 0.6mm. The PCB features a minimum trace/space of 6/5 mils, a minimum hole size of 0.5mm, and no blind vias. The surface finish is Hot Air Solder Level (HASL), with top and bottom solder masks in green.
• The manufactured PCBs adhere to IPC-Class-2 quality standards, ensuring reliable performance and consistent manufacturing processes.

Applications and availability:

• TC350 laminates find applications in power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas, microwave combiners, and power dividers.
• They are available worldwide, ensuring easy access to these high-performance PCB substrates for designers and manufacturers globally.

Experience the superior performance of TC350 laminates:

TC350 laminates enable designers to achieve unparalleled reliability, improved thermal management, and enhanced performance in high-power PCB applications. Benefit from their exceptional stability, low insertion loss, and higher thermal conductivity to elevate your designs. TC350 laminates are the optimal choice for your next high-power project, unlocking the true potential of your PCB designs.