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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

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Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

  • Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
  • Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
  • Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
  • Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
  • Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
  • Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-266-V4.17
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Plastic Bag
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Number Of Layers: 2 Board Material: Polymide 50µm
Board Thickness: 0.3mm Surface Cu Thickness: 70 µm (2 Oz)
Surface Finish: Immersion Gold Coverlay Colour: Yellow
Color Of Silkscreen: N/A Function: 100% Pass Electrical Test

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This type of flexible circuit is for the application of AC power systems. It’s a 2 layer polyimide FPC at 0.3mm thick with 2 oz copper. The base laminate is from Shengyi.On head of its back is 0.1mm FR-4 stiffener. It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffener is applied on the back side.

 

Parameter and data sheet

Size of Flexible PCB 130.66 X 40.67mm
Number of Layers 2
Board Type Flexible PCB
Board Thickness 0.30mm
Board Material Polyimide 50µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 70 µm
   
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material FR-4
Stiffener Thickness 0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

 

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper 0

 

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

The end can be whole soldered

Low cost

Continuity of processing

On-time service

Quick Lead time: 3-5 days

 

Applications

General purpose LED soft light strip, mobile phone antenna flex board, industrial control, temperature controller soft board

 

Copper Foils

There are two different types of copper foils: Electro-Deposited (ED) copper foils and Rolled and annealed (RA) copper foils.

 

Electro-Deposited copper foils are produced by depositing copper on a stainless steel drum that rotates in a plating tank with anodes of very pure copper. The thickness of the copper foil is determined by the length of the plating process, i.e. the rotation speed of the drum. The copper is then removed from the drum and wound on a roll. The finished copper foil is very smooth on the drum side and fairly rough on the other side. The rough side has the advantage of giving better adhesion to the base

laminate.

 

The main characteristic of ED copper is its grain structure, which is vertical in nature because of the electrolytic process. This implies a relatively low ductility of the copper foil, thus it is not recommended for dynamic applications. The drawing below shows the vertical grain structure of ED copper.

 

Common foil thicknesses for flexible circuits are 17.5, 35, 70, 105 and 175 µm (0.5, 1, 2, 3 and 5 oz.).

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper 1

 

RA Copper

This copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size, and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

 

Contrary to electro-deposited copper, rolled and annealed copper has a horizontal grain structure as shown below. The horizontal grain structure provides for much higher flexibility and a better flex life endurance than ED copper, therefore RA copper always should be used for dynamic applications.

 

A disadvantage of RA copper is that the bonding surface is fairly smooth, so that a relatively low adhesion is obtained. The bond, however, can be enhanced by an electrolytic copper flash without deteriorating the flexing characteristics of the copper foil.

 

Common foil thicknesses for flexible circuits are 17.5, 35, 70, 105 and 175 µm (0.5, 1, 2, 3 and 5 oz.)

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper 2

 

More Displays of Heavy Copper Flex

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper 3

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper 4

Heavy Copper Flexible PCB Built On Polyimide with 2 oz Copper 5

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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