30mil RF-35TC 2-layer rigid PCB PTFE /ceramic filled /fiberglass 1oz 0.8mm thickness Hot Air Soldering Level (HASL)

A New Rigid 2-Layer RF Printed Circuit Board Has Been Launched By Bicheng

Announcement has been made by Bicheng regarding the launch of their newest high performance RF printed circuit board. Constructed of a 2 layer rigid format, this PCB contains the following specifications:

• The PCB laminate material consists of RF-35TC, a PTFE composite that has been ceramic filled, providing low-loss benefits suitable for RF applications.
• An operating temperature range of -40°C to +85°C enables this board to withstand deployment in demanding thermal environments.
• Both layers have received 1oz/35μm electrodeposited copper for optimal power transmission.
• A dielectric stackup of 30mil has been selected to limit interference between layers.
• Vias have been plated with 1 mil of copper to improve connectivity and heat dissipation.
• The top side features a green solder mask and white silkscreen for easy component identification. The bottom side has no solder mask or silkscreen.
• Hot air solder leveling (HASL) finish has been applied to ensure excellent solderability.
• 100% electrical testing has been conducted on all boards prior to shipment.

With dimensions of 110mm x 92mm, this PCB has been designed for high frequency analog and RF applications. Manufactured to meet IPC Class 2 standards, it contains 2 routing layers, 104 vias, 35 components, and 15 nets.

To ensure worldwide deployment, Gerber RS-274X artwork files have been provided along with lead-free, RoHS compliant construction.

Technical inquiries can be directed to Sally Mao at sales@bichengpcb.com. Integration of this new RF35TC board into upcoming projects is welcomed.

Please advise if any additional modifications to the tone or style of this PCB launch article are desired. I would be happy to make further revisions as needed.