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TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

MOQ: 1
Price: USD 9.99-99.99 per piece
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-509-V3.5
Number Of Layers:
20
Glass Epoxy:
TU-883
Final Foil External:
1.0oz
Final Height Of PCB:
3.0 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99 per piece
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 OHM
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
Brief Introduction
This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.
 
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers
 
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 0
 
Detailed Specifications

Item Description Actual Result
1. Laminate Material Type TU-883 ACC
Tg 170 ACC
Supplier TUC ACC
Thickness 2.8-3.1mm ACC
2.Plating thickness Hole Wall 26.51µm ACC
Outer copper 41.09µm ACC
Inner Copper 15µm / 31µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D ACC
Color Green ACC
Rigidity (Pencil Test) 5H ACC
S/M Thickness 20.11µm ACC
Location Both Sides ACC
4. Component Mark Material Type IJR-4000 MW300 ACC
Color White ACC
Location C/S, S/S ACC
5. Peelable Solder Mask Material Type /  
Thickness /  
Location /  
6. Identification UL Mark YES ACC
Date Code 2921 ACC
Mark Location Solder Side ACC
7. Surface Finish Method Immersion Gold ACC
Nickel Thickness 4.06µm ACC
Gold Thickness 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU ACC
REACH Directive 1907 /2006 ACC
9.Annular Ring Min. Line Width (mil) 4.8mil ACC
Min. Spacing (mil) 5.2mil ACC
10.V-groove Angle /  
Residual thickness /  
11. Beveling Angle /  
Height /  
12. Function Electrical Test 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.21% ACC
14. Reliability Test Tape Test No Peeling ACC
Solvent Test No Peeling ACC
Solderability Test 265 ±5 ACC
Thermal Stress Test 288 ±5 ACC
Ionic Contamination Test 0.56µg/c ACC

 
Stackup & Impedance Controlled
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 1
HDI vias

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 2
 
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 3

 

products
PRODUCTS DETAILS
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
MOQ: 1
Price: USD 9.99-99.99 per piece
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-509-V3.5
Number Of Layers:
20
Glass Epoxy:
TU-883
Final Foil External:
1.0oz
Final Height Of PCB:
3.0 Mm ±10%
Surface Finish:
Immersion Gold
Solder Mask Color:
Green
Colour Of Component Legend:
White
Test:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD 9.99-99.99 per piece
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 OHM
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
Brief Introduction
This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.
 
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers
 
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 0
 
Detailed Specifications

Item Description Actual Result
1. Laminate Material Type TU-883 ACC
Tg 170 ACC
Supplier TUC ACC
Thickness 2.8-3.1mm ACC
2.Plating thickness Hole Wall 26.51µm ACC
Outer copper 41.09µm ACC
Inner Copper 15µm / 31µm ACC
3.Solder mask Material Type TAIYO/ PSR-2000GT600D ACC
Color Green ACC
Rigidity (Pencil Test) 5H ACC
S/M Thickness 20.11µm ACC
Location Both Sides ACC
4. Component Mark Material Type IJR-4000 MW300 ACC
Color White ACC
Location C/S, S/S ACC
5. Peelable Solder Mask Material Type /  
Thickness /  
Location /  
6. Identification UL Mark YES ACC
Date Code 2921 ACC
Mark Location Solder Side ACC
7. Surface Finish Method Immersion Gold ACC
Nickel Thickness 4.06µm ACC
Gold Thickness 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU ACC
REACH Directive 1907 /2006 ACC
9.Annular Ring Min. Line Width (mil) 4.8mil ACC
Min. Spacing (mil) 5.2mil ACC
10.V-groove Angle /  
Residual thickness /  
11. Beveling Angle /  
Height /  
12. Function Electrical Test 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.21% ACC
14. Reliability Test Tape Test No Peeling ACC
Solvent Test No Peeling ACC
Solderability Test 265 ±5 ACC
Thermal Stress Test 288 ±5 ACC
Ionic Contamination Test 0.56µg/c ACC

 
Stackup & Impedance Controlled
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 1
HDI vias

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 2
 
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 3

 

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