MOQ: | 1 |
Price: | USD78~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T , Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 598 mm
x 598 mm length and width. It’s fabricated per IPC 7525A using supplied Gerber data,
squeegee area locating in the center. 4 sides of edges are through holes to suit for the
SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed
for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process error
is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to the
printing and forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G. No MOQ, low cost for prototypes and small runs quantity;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 598 x 598 mm =1 PCS |
Structure | Stencil foils with aluminum frame |
Base material | Stainless steel shim |
Foil Thickness | 0.12mm |
Aperture configured | Laser cut |
Appearance | Engraving and electro polishing |
Fiducial mark | Through hole |
Service area: | Worldwide |
Quantity of open pads: | 166 |
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
MOQ: | 1 |
Price: | USD78~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T , Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with 598 mm
x 598 mm length and width. It’s fabricated per IPC 7525A using supplied Gerber data,
squeegee area locating in the center. 4 sides of edges are through holes to suit for the
SMT machine. It’s packed with KK carton (hard card) and usually 2 stencils are packed
for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process error
is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to the
printing and forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G. No MOQ, low cost for prototypes and small runs quantity;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 598 x 598 mm =1 PCS |
Structure | Stencil foils with aluminum frame |
Base material | Stainless steel shim |
Foil Thickness | 0.12mm |
Aperture configured | Laser cut |
Appearance | Engraving and electro polishing |
Fiducial mark | Through hole |
Service area: | Worldwide |
Quantity of open pads: | 166 |
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |