RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas

Product Details:

Place of Origin:	China
Brand Name:	Bicheng Enterprise Limited
Certification:	UL
Model Number:	BIC-0059-V0.1

Payment & Shipping Terms:

Minimum Order Quantity:	1
Price:	USD 9.99-99.99 Per Piece
Packaging Details:	Vacuum
Delivery Time:	10 working days
Payment Terms:	T/T, Paypal
Supply Ability:	45000 pieces per month

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Detailed Product Description

Glass Epoxy:	RO4730G3, RogersCorp	Final Height Of PCB:	0.8mm ± 10%
Final Foil External:	1 Oz	Surface Finish:	Immersion Gold (51.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color:	NO	Colour Of Component Legend:	N/A
Number Of Layers:	2	Test:	100% Electrical Test Prior Shipment

RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas

Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

Typical application is cellular base station antennas.

General description

This is a type of double sided RF PCB built on 0.762mm (30mil) RO4730G3 for the application of Wireless telecommunications antennas.

Basic specifications

Base material: RO4730G3 30mil (0.762mm)

Dielectric constant: 3.0+/-0.5

Layer count: 2 layers

Type: Through holes

Format: 110mm x 100mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.1 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

Data Sheet of RO4730G3

RO4730G3 Typical Value
Property	RO4730G3	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.5	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign	2.98	Z		1.7 GHz to 5 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0028	Z		10 GHz 23℃	IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ	0.0028	Z		2.5 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+34	Z	ppm/℃	-50 ℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	<0.4	X, Y	mm/m	after etech +E2/150 ℃	IPC-TM-650 2.4.39A
Volume Resistivity (0.030")	9 X 107		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity (0.030")	7.2 X 105		MΩ	COND A	IPC-TM-650 2.5.17.1
PIM	-165		dBc	50 ohm 0.060"	43 dBm 1900 MHz
Electrical Strength (0.030")	730	Z	V/mil		IPC-TM-650 2.5.6.2
Flexural Strength MD	181 (26.3)		Mpa (kpsi)	RT	ASTM D790
CMD	139 (20.2)		Mpa (kpsi)	RT	ASTM D790
Moisure Absorption	0.093	-	%	48/50	IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity	0.45	Z	W/mK	50℃	ASTM D5470
Coefficient of Thermal Expansion	15.9 14.4 35.2	X Y Z	ppm/℃	-50 ℃to 288℃	IPC-TM-650 2.4.4.1
Tg	>280		℃		IPC-TM-650 2.4.24
Td	411		℃		ASTM D3850
Density	1.58		gm/cm3		ASTM D792
Copper Peel Stength	4.1		pli	1oz,LoPro EDC	IPC-TM-650 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

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