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TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-105-V6
Glass Epoxy:
TMM4
Final Height Of PCB:
1.6 Mm ±0.1mm
Final Foil External::
1oz
Surface Finish:
ENIG
Solder Mask Color::
NO
Colour Of Component Legend:
NO
Number Of Layers:
2 Layers
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000 pieces per month
Product Description

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This is a type of double layer RF PCB which is made on Rogers TMM4 60mil substrate. There’s only 1 NPTH hole in the board with 0.5oz base copper plated to 1oz. The surface finish on pads is immersion gold and no solder mask or silkscreen printed. Track layer is on top and whole bottom layer is copper covered as shielding function. The boards are fabricated as per IPC Class II standard and 100% electrical tested before shipment. Every 25 board are vacuum packed for delivery.

 

PCB Specifications

PCB SIZE 90 x 90mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM4 1.524mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 100 mil / 100 mil
Minimum / Maximum Holes: 1.5 mm / 1.5 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TMM4 1.524mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold, 89%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA N/A
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold 0

 

Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

Our Capability (TMM4)

PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designator: TMM4
Dielectric constant: 4.5 ±0.045 (process); 4.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

 

Data Sheet of TMM4

Property TMM4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +15 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 16 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
3.18mm (0.125") 0.18
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -
 
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold 1
products
PRODUCTS DETAILS
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold
MOQ: 1
Price: USD 9.99-99.99
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal
Supply Capacity: 50000 pieces per month
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-105-V6
Glass Epoxy:
TMM4
Final Height Of PCB:
1.6 Mm ±0.1mm
Final Foil External::
1oz
Surface Finish:
ENIG
Solder Mask Color::
NO
Colour Of Component Legend:
NO
Number Of Layers:
2 Layers
Minimum Order Quantity:
1
Price:
USD 9.99-99.99
Packaging Details:
Vacuum
Delivery Time:
10 working days
Payment Terms:
T/T, Paypal
Supply Ability:
50000 pieces per month
Product Description

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This is a type of double layer RF PCB which is made on Rogers TMM4 60mil substrate. There’s only 1 NPTH hole in the board with 0.5oz base copper plated to 1oz. The surface finish on pads is immersion gold and no solder mask or silkscreen printed. Track layer is on top and whole bottom layer is copper covered as shielding function. The boards are fabricated as per IPC Class II standard and 100% electrical tested before shipment. Every 25 board are vacuum packed for delivery.

 

PCB Specifications

PCB SIZE 90 x 90mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
TMM4 1.524mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 100 mil / 100 mil
Minimum / Maximum Holes: 1.5 mm / 1.5 mm
Number of Different Holes: 1
Number of Drill Holes: 1
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: TMM4 1.524mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold, 89%
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA N/A
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold 0

 

Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

Our Capability (TMM4)

PCB Material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designator: TMM4
Dielectric constant: 4.5 ±0.045 (process); 4.7 (design)
Layer count: 1 Layer, 2 Layer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion tin, Pure gold (no nickle under gold), OSP.

 

Data Sheet of TMM4

Property TMM4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z   10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +15 - ppm/°K -55-125 IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 TGA - ASTM D3850
Coefficient of Thermal Expansion - x 16 X ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
3.18mm (0.125") 0.18
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -
 
TMM4 High Frequency Printed Circuit Board 60mil 1.524mm Rogers RF PCB DK4.5 With Immersion Gold 1
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