MOQ: | 1 |
Price: | USD69~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T/Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless
steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre production;
E. Money-saving, Worry-saving and Labor-saving;
F. Door to door shipment service;
G. More than 9000 types per month;
H. No minimum order quantity. 1 piece is available;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 370mm x 470mm, 420mm x 520mm, 550mm x 650mm | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness |
0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
|||||
Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1533 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
|||||
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type |
Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
MOQ: | 1 |
Price: | USD69~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T/Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless
steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre production;
E. Money-saving, Worry-saving and Labor-saving;
F. Door to door shipment service;
G. More than 9000 types per month;
H. No minimum order quantity. 1 piece is available;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 370mm x 470mm, 420mm x 520mm, 550mm x 650mm | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness |
0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
|||||
Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1533 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
|||||
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type |
Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |