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Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut
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Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut
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Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut

MOQ: 1
Price: USD69~110
Standard Packaging: KK carton (hard card)
Delivery Period: 2-3 working days
Payment Method: T/T/Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0362-V3.62
Base Material:
Stainless Steel Shim
Foil Thickness(Optional):
0.1mm
Aperture Configured:
Laser Cut
Appearance:
Engraving And Electro Polishing
Fiducial Mark:
Through Hole
Application:
CSP, BGA, 0.5mm QFP Etc. Package
Minimum Order Quantity:
1
Price:
USD69~110
Packaging Details:
KK carton (hard card)
Delivery Time:
2-3 working days
Payment Terms:
T/T/Paypal
Supply Ability:
45000 pieces per month
Product Description

Product profile

 

 

1.1 General description


This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless

steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated

per IPC 7525A using supplied Gerber data, squeegee area locating in the center.

Fiducal marks are half-etch dented suit for the SMT machine. It’s packed with KK

carton (hard card) and usually 2 stencils are packed for shipment.

 

 

1.2 Features and benifits


A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process

     error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to

      the printing and forming of tin paste;
D. Focus on low to medium volume production;
E. Quick turnaround prototype;
F.  Door to door shipment service;
G. Competitive price;
H. On-time service;
I.   More than 15 years of experience;

 


1.3 Application


SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

 

 

1.4 Parameter and data sheet

Dimension: 370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 1152
Advantages: a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application: CSP, BGA, 0.5mm QFP etc. package

 

 

1.5 Opening Hole Design for Stencil

Component Type Pitch Soldering Width Soldering Length Opening Width Opening Length Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402   0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201   0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm   0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm   0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm   0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm

 

 

Variety of PCBs

Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut 0

Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut 1

 

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB

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Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut
  • name
  • name
  • name
  • name
  • name
  • name
  • name
  • name
Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut
MOQ: 1
Price: USD69~110
Standard Packaging: KK carton (hard card)
Delivery Period: 2-3 working days
Payment Method: T/T/Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Enterprise Limited
Certification
UL
Model Number
BIC-0362-V3.62
Base Material:
Stainless Steel Shim
Foil Thickness(Optional):
0.1mm
Aperture Configured:
Laser Cut
Appearance:
Engraving And Electro Polishing
Fiducial Mark:
Through Hole
Application:
CSP, BGA, 0.5mm QFP Etc. Package
Minimum Order Quantity:
1
Price:
USD69~110
Packaging Details:
KK carton (hard card)
Delivery Time:
2-3 working days
Payment Terms:
T/T/Paypal
Supply Ability:
45000 pieces per month
Product Description

Product profile

 

 

1.1 General description


This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless

steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated

per IPC 7525A using supplied Gerber data, squeegee area locating in the center.

Fiducal marks are half-etch dented suit for the SMT machine. It’s packed with KK

carton (hard card) and usually 2 stencils are packed for shipment.

 

 

1.2 Features and benifits


A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process

     error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to

      the printing and forming of tin paste;
D. Focus on low to medium volume production;
E. Quick turnaround prototype;
F.  Door to door shipment service;
G. Competitive price;
H. On-time service;
I.   More than 15 years of experience;

 


1.3 Application


SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

 

 

1.4 Parameter and data sheet

Dimension: 370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness 0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 1152
Advantages: a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application: CSP, BGA, 0.5mm QFP etc. package

 

 

1.5 Opening Hole Design for Stencil

Component Type Pitch Soldering Width Soldering Length Opening Width Opening Length Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402   0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201   0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm   0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm   0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm   0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm

 

 

Variety of PCBs

Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut 0

Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut 1

 

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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