MOQ: | 1 |
Price: | USD69~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T/Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel
foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. Quick turnaround prototype;
E. Door to door shipment service;
F. Delivery on time: >98%
G. Customer complaint rate: <1%
H. Hassle-free, one-to-one after-sales service;
I. More than 15 years of experience;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 520 x 420 mm =1 PCS | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness |
0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
|||||
Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1620 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
|||||
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type |
Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
MOQ: | 1 |
Price: | USD69~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T/Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel
foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated
per IPC 7525A using supplied Gerber data, squeegee area locating in the center.
Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK
carton (hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. Quick turnaround prototype;
E. Door to door shipment service;
F. Delivery on time: >98%
G. Customer complaint rate: <1%
H. Hassle-free, one-to-one after-sales service;
I. More than 15 years of experience;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.
1.4 Parameter and data sheet
Dimension: | 520 x 420 mm =1 PCS | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness |
0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm |
|||||
Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1620 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
|||||
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type |
Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |