MOQ: | 1 |
Price: | USD69~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T/Paypal |
Supply Capacity: | 45000 pieces per month |
1.1 General description
This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with
420 mm x 520 mm x 20mm dimension. It's fabricated per IPC 7525A using
supplied Gerber data, squeegee area locating in the center. 4 sides of fiducal
marks are through holes to suit for the SMT machine. It’s packed with KK carton
(hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G. No MOQ, low cost for prototypes and small runs quantity;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip
1.4 Parameter and data sheet
Dimension: | 520 x 420 mm =1 PCS | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness | 0.12mm | |||||
Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1021 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
|||||
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
MOQ: | 1 |
Price: | USD69~110 |
Standard Packaging: | KK carton (hard card) |
Delivery Period: | 2-3 working days |
Payment Method: | T/T/Paypal |
Supply Capacity: | 45000 pieces per month |
1.1 General description
This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with
420 mm x 520 mm x 20mm dimension. It's fabricated per IPC 7525A using
supplied Gerber data, squeegee area locating in the center. 4 sides of fiducal
marks are through holes to suit for the SMT machine. It’s packed with KK carton
(hard card) and usually 2 stencils are packed for shipment.
1.2 Features and benifits
A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process
error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to
the printing and forming of tin paste;
D. ISO9000 certified manufacturing factory;
E. 12 hours quotation;
F. Quick Lead time: 1-2 days;
G. No MOQ, low cost for prototypes and small runs quantity;
1.3 Application
SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip
1.4 Parameter and data sheet
Dimension: | 520 x 420 mm =1 PCS | |||||
Structure | Stencil foils with aluminum frame | |||||
Base material | Stainless steel shim | |||||
Foil Thickness | 0.12mm | |||||
Aperture configured | Laser cut | |||||
Appearance | Engraving and electro polishing | |||||
Fiducial mark | Through hole | |||||
Service area: | Worldwide | |||||
Quantity of open pads: | 1021 | |||||
Advantages: |
a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. |
|||||
Application: | CSP, BGA, 0.5mm QFP etc. package |
1.5 Opening Hole Design for Stencil
Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |