Why RT/duroid 6006 is Perfect for Compact RF Designs? The High-Dk Workhorse: RT/duroid 6006 10mil PCB give you the answer

Need to shrink your RF circuit without sacrificing performance? Meet the RT/duroid 6006 10mil Immersion Silver PCB.

This 2-layer board (134.8mm x 78.65mm) is built for engineers who want size reduction and low loss—especially at X-band frequencies and below.

Why you want it:

• High Dk, Smaller Circuits: With a dielectric constant of 6.15, this ceramic-PTFE material lets you shrink patch antennas and satellite comms modules significantly.

• Very Low Loss: Dissipation factor is just 0.0027 at 10 GHz. Your signal stays clean.

• No Solder Mask, No Silkscreen: This is a barebones, high-performance RF board. Top and bottom masks are "no"—just bare laminate and Immersion Silver pads.

• Tough as Nails: Td > 500°C and only 0.05% moisture absorption. This board survives harsh environments.

The Specs Snapshot:

• Stackup: 2-Layer | 35µm copper / 0.254mm (10mil) RT/duroid 6006 / 35µm copper

• Finish: Immersion Silver (flat, solderable, low loss)

• Traces/Holes: 5/6 mil trace/space | 0.3mm min hole size

• Stats: 46 components, 64 pads, 41 vias

Best For: Patch antennas, satellite systems, power amplifiers, and radar warning systems.

The Bottom Line: If you need high dielectric constant to cut board space, but refuse to give up low loss and thermal stability, the RT/duroid 6006 is your answer. No frills (mask/silkscreen), just pure RF performance.