Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

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Detail Information

Product Description

Detail Information

Product Description

► More than 18 year manufacturing experience.

► Skilled workers, 3 shifts per day

► Substrate material: Epoxy glass (FR-4), High frequency, Metal core and Flexible material.

► Price advantages on circuit boards

► Multilayer PCB and Hybrid material of Multilayer PCB

► Quick turnaround prototypes

► IATF16949 (2016), ISO14001 (2004),ISO9001 (2015), UL certified

PCB Capabilities 0

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--420µm (0.5oz - 12oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger