Metal Core PCB

Metal core PCB is thermal management circuit board used in LED lighting which needs fast cooling dissipation. The metal core can be aluminum (aluminum core PCB) and copper (copper core PCB), even iron base. The fastest speed of heat transfer is on copper which is designed in the form of thermoelectric separation.

Advantages

1) Effective heat dissipation reduces the operating temperature of the module and prolongs the service life;

2) Power density and reliability are improved up 10%;

3) Reduce the dependence of heat sinks and other hardware (including thermal interface materials);

4) Reduce the volume of the product;

5) Reduce the cost of hardware and assembly;

6) Optimization combination of power circuit and control circuit;

7) Replace the fragile ceramic substrate and obtain a better mechanical durability;

8) Reduce the operating temperature of the equipment;

Applications

LED lighting, Switch regulator, DC/AC converter, Communication electronic equipment, A filter electric circuit, Office automation equipment, Motor driver, Motor controller, Automobile etc.

Solder Mask
Depending on whether light is to be absorbed or reflected, we have green, black and white solder mask. White solder mask is commonly used in LED PCB application and we use super white LED solder mask and no yellowish or brown colour occurs after the bare PCB baking as well as reflow and wave solder PCB assembly processes.

PCB Services
1) Single sided, double sided and multi layers.
2) Insulated metal substrate (IMS PCB) and Metal core PCB(MCPCB)
3) High thermal conductivity to 3W/MK
4) Heavy copper up to 3oz
5) Proceeding thickness: 0.4-6.0mm thick
6) Plate through hole (PTH≥20μm)
7) BGA(mininum pad at 14 mil), Impedance control (+/-10)
8) V-Groove, Punch, CNC mill
9) Long strips, composite aluminum
10) ENIG, HASL, OSP and Immersion tin

Build Up

Single sided                                                                                     Double sided type(1)

Double sided type(2)                                                                        Multilayer    

MCPCB Capabilities 2018