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WL-CT350 High-Frequency Laminate: Is This FR-4 Processable, Low-Loss Material Right for Your Antenna PCB?

Brand Name: Wangling Model Number: WL-CT350

Product Description

What is WL-CT350?

 

It is a thermosetting resin-based high-frequency laminate manufactured by Taizhou Wangling Insulating Materials Factory. It is part of the WL-CT series. The dielectric layer is composed of hydrocarbon resin, ceramics, and fiberglass cloth. The dielectric constant (Dk) is 3.48 at 10 GHz. The dissipation factor (Df) is 0.0039 at 10 GHz. The material has a Tg greater than 280°C. The thermal conductivity is 0.70 W/(m·K). The CTE in the X and Y axes is 11 and 14 ppm/°C. The Z-axis CTE is 34 ppm/°C. The material can be processed using standard FR-4 techniques. This is simpler than PTFE processing. The material offers better stability and consistency in circuitry.

 

 

What PCB can be built with it?

 

A complete 2-layer RF PCB solution can be provided. The board is based on WL-CT350 material. The finished thickness is 0.2 mm. The copper weight is 1 oz per layer. Immersion gold is applied as the surface finish. No solder mask is applied on either side. Black silkscreen is printed on the top layer. The minimum trace and space are 6 and 7 mils. The minimum hole size is 0.3 mm. Via plating thickness is 20 µm. The quality standard is IPC Class 2. This board is ideal for base station antennas, satellite antennas, automotive radar, power amplifiers, RF devices, and filters.

 

WL-CT350 High-Frequency Laminate: Is This FR-4 Processable, Low-Loss Material Right for Your Antenna PCB?

 

Material Overview

The WL-CT350 is a thermosetting resin-based high-frequency laminate. It is manufactured by Taizhou Wangling Insulating Materials Factory. It is part of the WL-CT series. The dielectric layer is composed of hydrocarbon resin, ceramics, and fiberglass cloth.

 

 

The material offers low loss performance. It meets the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR-4 materials. This is simpler compared to PTFE materials. Better stability and consistency in circuitry are ensured. The material can be used as a substitute for similar foreign products.

 

 

The combination of hydrocarbon resin and composite ceramics provides several advantages:

Excellent low loss

High-temperature resistance

Temperature stability

Low thermal expansion coefficient

High Tg greater than 280°C

 

 

Why Choose WL-CT350 Over PTFE:

Feature WL-CT350 (Thermoset) PTFE-Based Materials
Processing Standard FR-4 techniques Specialized PTFE techniques
Via Preparation No sodium etch required Sodium etch often required
Panel Handling Rigid, automated handling Soft, specialized handling
Dimensional Stability Excellent Good (with glass reinforcement)
Tg >280°C N/A (PTFE softens)
Wire Bonding Reliable (thermoset) Risk of pad lifting
Cost Cost-effective More expensive

 

 

WL-CT350 Technical Data Sheet​

Property Test Condition Unit WL-CT350 Value
Dielectric Constant (Typical) 10 GHz 3.48
Dielectric Constant (Design) 10 GHz 3.66
DK Tolerance ±0.05
Dissipation Factor (Typical) 2 GHz 0.003
  10 GHz 0.0039
  20 GHz 0.0048
TCDk -55°C to 150°C ppm/°C 52
Peel Strength (1 oz ED) N/mm 0.85
(1 oz RTF) N/mm 0.72
Volume Resistivity Normal condition MΩ·cm 1×10⁹
Surface Resistivity Normal condition 4×10⁹
Electrical Strength (Z-direction) 5 kW, 500 V/s kV/mm 31
Breakdown Voltage (X/Y-direction) 5 kW, 500 V/s kV 30
CTE X-axis -55°C to 288°C ppm/°C 11
CTE Y-axis -55°C to 288°C ppm/°C 14
CTE Z-axis -55°C to 288°C ppm/°C 34
Thermal Stress 288°C, 10s, 3 times No delamination
Water Absorption 23.5±2°C, 24 hours % 0.05
Density Normal temperature g/cm³ 1.9
Long-term Service Temperature °C -55 to +260
Thermal Conductivity Z-direction W/(m·K) 0.7
PIM Value (with RTF copper) dBc ≤ -157
Flammability UL94 Rating V-0
Tg °C >280
Td Onset °C 386
Halogen Content Halogenated
Composition Hydrocarbon + Ceramic + Glass Fabric

 

 

Key Advantages of WL-CT350

Feature Benefit
Dk is 3.48 ±0.05 Tight tolerance allows consistent impedance control
Df is 0.0039 at 10 GHz Low loss minimizes signal attenuation in microwave circuits
Tg is >280°C Withstands lead-free soldering without deformation
Td is 386°C Good thermal decomposition resistance
TCDk is 52 ppm/°C Stable Dk over temperature ensures consistent performance
CTE X/Y is 11/14 ppm/°C CTE matches copper; excellent dimensional stability
CTE Z is 34 ppm/°C Good plated through-hole reliability is ensured
Thermal conductivity is 0.70 W/(m·K) Heat dissipation is improved for power applications
Moisture absorption is 0.05% Very low water absorption ensures stable performance
UL94 V-0 rating is achieved Fire safety compliance is ensured
FR-4 processability No specialized equipment required; lower fabrication cost
Thermoset resin is used No softening when heated; reliable wire bonding
Radiation resistance is provided Suitable for aerospace applications
Low outgassing is ensured Suitable for space applications

 

 

WL-CT350 vs. WL-CT Series Variants

The WL-CT series offers multiple dielectric constants. The options are listed below.

Material Dk at 10 GHz Best Application
WL-CT300 3 General RF
WL-CT330 3.3 RF and microwave
WL-CT338 3.38 High-frequency RF
WL-CT348 3.48 RF, antennas, automotive radar
WL-CT410 4.1 Higher Dk requirements
WL-CT615 6.15 High-DK applications

 

 

Application Fields

- Base station antennas and satellite antennas.

- Automotive radar, sensors, and navigation systems.

- Power amplifiers.

- Satellite high-frequency heads.

- RF devices and filters.

- WIMAX antennas and distributed antennas.

 

 

Custom 2-Layer RF PCB – Complete Specification

A complete 2-layer RF PCB solution can be provided based on WL-CT350. The specifications are shown below.

 

WL-CT350 High-Frequency Laminate: Is This FR-4 Processable, Low-Loss Material Right for Your Antenna PCB?

 

Board Specifications

Specification Detail
Board Type 2-Layer RF PCB
Base Material WL-CT350 (0.102 mm / 4 mil core)
Finished Board Thickness 0.2 mm
Finished Copper Weight 1 oz (35 µm) per layer
Board Dimensions 56.8 × 78.09 mm (1 piece)
Dimension Tolerance ±0.15 mm
Minimum Trace / Space 6 / 7 mils
Minimum Hole Size 0.3 mm
Via Plating Thickness 20 µm
Surface Finish Immersion Gold (ENIG)
Top Solder Mask No
Bottom Solder Mask No
Top Silkscreen Black
Bottom Silkscreen No
IPC Classification Class 2
Artwork Format Gerber RS-274-X
Testing 100% Electrical Test (before shipment)
Availability Worldwide

 

 

Key Benefits of This PCB Design

Feature Benefit
2-layer RF design is used Simple and cost-effective RF circuit implementation is achieved
WL-CT350 core (0.102 mm) is used Low loss (0.0039), stable Dk (3.48), and FR-4 processability
Thin 0.2 mm board Ultra-lightweight and compact design is achieved
6/7 mil trace and space are used Fine-line, high-density RF circuits can be produced
No solder mask is used on either side Weight and cost are reduced; RF performance is optimized
Immersion gold finish is applied Excellent solderability; oxidation resistance; flat surface
20 µm via plating is used Reliable plated through-hole connections are ensured
IPC Class 2 quality is met Commercial and industrial quality standards are satisfied
100% electrical test is performed Functional integrity is guaranteed before shipment

 

 

 

Q1: What is the dielectric constant of WL-CT350?

The typical Dk is 3.48 at 10 GHz and 23°C. The design Dk is 3.66 at 10 GHz. The Dk tolerance is ±0.05.

 

 

Q2: How does WL-CT350 compare to PTFE materials?

WL-CT350 is a thermosetting hydrocarbon material. It offers similar high-frequency performance to PTFE. However, it can be processed using standard FR-4 techniques. No specialized equipment is required. This reduces fabrication cost and lead time. It also offers better dimensional stability and reliability.

 

 

Q3: What is the maximum operating temperature of WL-CT350?

The long-term service temperature is -55°C to +260°C. The Tg is greater than 280°C. This ensures stable performance during lead-free soldering. It also ensures reliability in high-temperature environments.

 

 

Q4: What copper foil options are available for WL-CT350?

Two copper foil options are available:

 

ED copper – suitable for general applications

 

RTF copper – offers better PIM performance (≤ -157 dBc), lower conductor loss, and more precise etching

 

RTF copper adds approximately 0.018 mm (0.7 mil) to the dielectric thickness.

 

 

Ready to Get Started?

WL-CT350 raw laminate can be provided. Aluminum-backed variants are also available. Fully fabricated 2-layer RF PCBs with immersion gold finish can be manufactured.

 

Contact us today for:

Material sampling and testing

RF circuit design assistance

Impedance calculation and design support

PCB quoting and DFM review

Technical support for your specific application

 

 

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