30mil RT/duroid 6035HTC 2-Layer PCB with Immersion Silver Finish

30mil RT/duroid 6035HTC 2-Layer PCB with Immersion Silver Finish

The 30mil RT/duroid 6035HTC 2-Layer PCB is a high-performance printed circuit board designed for high-power RF and microwave applications. Constructed with Rogers RT/duroid 6035HTC laminates, this PCB offers exceptional thermal conductivity, low insertion loss, and outstanding high-frequency performance. The Immersion Silver surface finish ensures excellent solderability, making this PCB ideal for power amplifiers, couplers, filters, and other high-power applications.

PCB Construction Details

PCB Stackup

PCB Statistics

The PCB is designed using Gerber RS-274-X artwork, ensuring precise fabrication and easy integration into modern manufacturing processes.

Material Overview: Rogers RT/duroid 6035HTC

RT/duroid 6035HTC is a high-frequency circuit material designed for use in high-power RF and microwave applications. It features a ceramic-filled PTFE composite with superior thermal conductivity and excellent dielectric properties. The laminates are easily processable with standard FR-4 manufacturing techniques, making them cost-effective for complex high-power designs.

The high thermal conductivity (1.44 W/mK) ensures efficient heat dissipation, reducing operating temperatures in high-power applications.

Key Features:

• Dielectric Constant (Dk): 3.5 ± 0.05 for predictable and consistent signal performance.
• Low Dissipation Factor (Df): 0.0013 at 10GHz for minimal signal loss in high-frequency applications.
• High Thermal Conductivity: 1.44 W/mK for efficient heat dissipation in high-power circuits.
• Moisture Resistance: Low moisture absorption (0.06%) ensures stable performance in varying environmental conditions.
• Immersion Silver Finish: Provides excellent solderability, corrosion resistance, and high conductivity.

Key Benefits:

• Improved Heat Dissipation: Enables lower operating temperatures, increasing circuit reliability and lifespan.
• Low Insertion Loss: Ensures superior signal integrity in RF and microwave designs.
• Cost-Effective Manufacturing: Compatible with standard FR-4 processes, reducing fabrication costs.
• Environmentally Friendly: RoHS compliant and lead-free.
• High Durability: Excellent thermal stability and resistance to conductive anodic filament (CAF) formation ensure long-term reliability.

Applications

High-power RF amplifiers and power dividers

Couplers, filters, and combiners

High-frequency power amplifiers

Microwave filters and combiners

High-power RF modules and antenna systems

Conclusion

The 30mil RT/duroid 6035HTC 2-Layer PCB with Immersion Silver Finish is a high-performance solution for RF and microwave applications requiring superior thermal conductivity, low dielectric loss, and excellent signal integrity. With its Rogers RT/duroid 6035HTC laminates, this PCB offers exceptional heat dissipation and reliable high-frequency performance, making it ideal for demanding high-power designs. The Immersion Silver finish ensures excellent solderability and long-term reliability. With worldwide availability and compliance with IPC-Class-2 standards, this PCB is a reliable and efficient choice for high-power RF and microwave system designs.