RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
|Place of Origin:||CHINA|
|Brand Name:||Bicheng Enterprise Limited|
|Minimum Order Quantity:||1 PIECE|
|Delivery Time:||7-8 WORKING DAY|
|Supply Ability:||50000 PIECE PER MONTH|
|Board Material:||Polyimide 50µm,ITEQ||Board Thickness:||0.20mm|
|Surface Cu Thickness:||35 µm||Surface Finish:||Immersion Gold|
|Coverlay Colour:||Yellow||Color Of Silkscreen:||White|
|Function:||100% Pass Electrical Test|
New High-Frequency 6-Layer Rigid PCB Revealed
Details have emerged on a recently fabricated 6-layer rigid PCB intended for applications demanding functionality from -40°C to +130°C. This newly completed board leverages both Rogers RO4350B hydrocarbon ceramic and high Tg FR-4 materials, chosen for their exceptional dielectric and thermal properties enabling signal transmission up to 20GHz.
Its layered construction features six copper layers, each with 1oz of copper cladding separated by alternating RO4350B and FR-4 cores. The cores were selected to form the base substrate structure while preserving signal integrity at high speeds. Board dimensions of 50mm x 38mm were specified to accommodate tight spacing needs.
Various specifications were targeted including a minimum trace/space of 4/4 mils to maximize routing density. Resin-filled and capped microvias of 0.1mm in diameter were implemented per IPC-4761 Type VII standards to facilitate robust interlayer connectivity. A total board thickness of 1.0mm was achieved to balance dimensional stability with thermal dissipation.
Electroless nickel immersion gold surface finishing was applied to outer layers to provide exceptional solderability. Gerber data files conforming to IPC-2581 standards were received from the client and production adhered to stringent IPC Class 2 levels of workmanship.
The compact design scheme realized houses 70 electronic components interconnected through 108 total pads. Internal routing schemes employed 49 plated through vias distributed across 16 distinct signal nets. Impedance control of 50 ohms on one layer was specified to optimize high-speed transmission.
Extensive electrical testing procedures were conducted on the completed board prior to shipping. Full validation of functional integrity down to the component level was required before customer delivery. With final confirmation that all design and construction parameters were met, the 6-layer board was deemed ready for deployment into targeted applications.
If any technical queries arise, please contact Sally Mao at email@example.com. We are pleased to have facilitated this innovative high-frequency solution and remain open to collaborating on future multi-layer projects pushing design boundaries. Advanced circuitry such as this exemplifies our capabilities for enabling cutting-edge technologies.
Contact Person: Miss. Sally Mao