Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO4003C High Frequency 2-layer rigid PCB with 35 μm copper Immersion Gold

Rogers RO4003C High Frequency 2-layer rigid PCB with 35 μm copper Immersion Gold

  • Rogers RO4003C High Frequency 2-layer rigid PCB with 35 μm copper Immersion Gold
  • Rogers RO4003C High Frequency 2-layer rigid PCB with 35 μm copper Immersion Gold
  • Rogers RO4003C High Frequency 2-layer rigid PCB with 35 μm copper Immersion Gold
Rogers RO4003C High Frequency 2-layer rigid PCB with 35 μm copper Immersion Gold
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-328-V2.76
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD20~30
Packaging Details: VACUUM
Delivery Time: 8 WORKING DAY
Payment Terms: T/T, Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide (PI) 50 Um Board Thickness: 0.15mm +/-10%
Surface Finish: Immersion Gold Surface Cu Thickness: 35 Um (1oz)
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test

We are pleased to present our latest 2-layer printed circuit board featuring the high-performance Rogers RO4003C substrate. This board was designed to push the boundaries of relay and radar systems operating in the GHz range.


Key Characteristics:

  • RO4003C hydrocarbon ceramic laminate substrate provides excellent electrical performance up to 10GHz due to its low dielectric constant of 3.38 and very low loss tangent of 0.0027.
  • 2-layer construction with 35um copper layers separated by a robust 1.524mm RO4003C core. Finished board thickness is 1.6mm.
  • Rapid heat cycling durability from -40°C to +85°C operating temperature range. Stable electrical properties over frequency.
  • Reliable plated through holes due to RO4003C's low Z-axis expansion coefficient. Dimensionally stable over processing temperatures.
  • Minimum trace/space of 5/4 mil allows for high component density on the dense 12-component designs.

Substrate Selection

The Rogers RO4003C substrate enables 10GHz+ operation due to exceptional electrical properties. With a Dk of 3.38 and loss tangent of 0.0027, it smoothly propagates high-speed signals. Further merits include -40°C to 85°C thermal rating and low expansion coefficients ensuring dimensional stability during processing.


While such performance exceeds FR-4, RO4003C's higher cost may only be justified for meticulous high frequency use cases. Others could leverage its capabilities yet select more affordable options depending on design tolerances.


Circuit Density

A 5/4mil minimum trace/space allows fitting abundant components into the compact 42.56x63.2mm space. This favors applications with high component counts like phased arrays. However, more extensive multilayer designs may exceed its 2-layer limit.


Construction Details Description
Board Dimensions 42.56mm x 63.2mm (1PCS), +/- 0.15mm
Minimum Trace/Space 5/4 mils
Minimum Hole Size 0.5mm
Blind Vias No
Finished Board Thickness 1.6mm
Finished Cu Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 25 μm
Surface Finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No


Frequency Limitations

The board facilitates circuits up to 10GHz via RO4003C's microwave-optimized properties. While meeting needs of 5G, radar and satellite tech, applications above 10GHz fall outside its tuned frequency range. Material selection depends on intended operation band.


Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • RF Identifi cation Tags
  • Automotive Radar and Sensors
  • LNB’s for Direct Broadcast Satellites



Employing IPC Class 2 workmanship standards and 100% electrical testing delivers consistent, bug-free boards. Customers appreciate risk mitigation this provides, especially for safety-critical systems. However, inherent tamper-resistance of enclosed designs is lost.



Potential Limitations

While substantive for many use cases, complex multilayer networks may exceed capabilities. Designers should also consider the confined board area of just 42.56x63.2mm and 1.6mm thickness for some installations.


In conclusion, where dimensional precision, circuit density and frequencies up to 10GHz take priority - while avoiding complex multilayers - this 2-layer solution ably satisfies. But its merits must be carefully weighed relative to specific design factors.


Our RO4003C-enabled 2-layer platform pushes design boundaries for GHz systems through its benchmark substrate properties. Contact us to discuss crafting solutions for your most exacting radio circuitry needs.







Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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